Abstract: A lithographic apparatus is provided in which exposure is carried out by projecting through an aqueous solution of alkali metal halide(s), the solution being in contact with the substrate to be exposed.

Abstract: A method for protecting a wet lens element from liquid degradation is provided. The method includes applying a thin coating of an organoxy-metallic compound to the side portions of a wet lens element to leave behind an optically inert, light absorbing metal oxide film. A liquid shield coating is applied on top of the metal oxide coating. The two coating layers protect the wet lens element from liquid degradation when the side portion of the wet lens element is submerged into a liquid. In an embodiment, the wet lens element is an immersion lithography wet lens element and the liquid is an immersion lithography liquid.

Abstract: A method for protecting a wet lens element from liquid degradation is provided. The method includes applying a thin coating of an organoxy-metallic compound to the side portions of a wet lens element to leave behind an optically inert, light absorbing metal oxide film. A liquid shield coating is applied on top of the metal oxide coating. The two coating layers protect the wet lens element from liquid degradation when the side portion of the wet lens element is submerged into a liquid. In an embodiment, the wet lens element is an immersion lithography wet lens element and the liquid is an immersion lithography liquid.

Abstract: A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

Abstract: A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

Abstract: Disclosed are highly efficient multiphoton absorbing compounds and methods of their use. The compounds generally include a bridge of pi-conjugated bonds connecting electron donating groups or electron accepting groups. The bridge may be substituted with a variety of substituents as well. Solubility, lipophilicity, absorption maxima and other characteristics of the compounds may be tailored by changing the electron donating groups or electron accepting groups, the substituents attached to or the length of the pi-conjugated bridge. Numerous photophysical and photochemical methods are enabled by converting these compounds to electronically excited states upon simultaneous absorption of at least two photons of radiation. The compounds have large two-photon or higher-order absorptivities such that upon absorption, one or more Lewis acidic species, Lewis basic species, radical species or ionic species are formed.

Abstract: A lithography system comprises an illumination system that supplies radiation and a projection system comprising an optical system and a patterning device located at a pupil plane. The patterning device patterns the radiation and the optical system projects the patterned radiation onto a target portion of a substrate. In one example, an additional patterning device is located at an object plane of the lithography system and patterns the radiation before the patterning device at the pupil plane.

Abstract: A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.

Abstract: Lithographic Apparatus and Device Manufacturing Method A system for tuning the refractive index of immersion liquid in an immersion lithographic apparatus is disclosed. Two or more immersion liquids of different refractive index are mixed together in order to achieve a desired refractive index. Further, the fluids may be conditioned and treated to maintain optical characteristics.

Abstract: Systems and methods are used to modify a layer on a substrate that is used to form a pattern generator, so that light reflecting from the modified substrate has a trapezoidal or other custom profile. The layer is modified using various vapor deposition techniques in conjunction with moving or positioning the substrate a desired distance from a blocking device and/or at a desired rate or speed.

Abstract: A system and method that can be used to cover a portion (e.g., a clear aperture) of an optical element (e.g., a lens) during coating of another portion (e.g., a circumferential portion) of the optical element. This can be done to protect the clear aperture during coating of an adhesive protection layer proximate a circumferential edge of the lens without damaging or altering the clear aperture. The method can include the following steps. An optical element is held so that a first portion of the optical element is covered and a second portion of the optical element is exposed. A first coating is provided on the second portion of the optical element. The optical element is released from being held. A second coating is provided on the optical element. The first and second coatings are removed from the second portion of the optical element.

Abstract: Systems and methods are used to modify a layer on a substrate that is used to form a pattern generator, so that light reflecting from the modified substrate has a trapezoidal or other custom profile. The layer is modified using various vapor deposition techniques in conjunction with moving or positioning the substrate a desired distance from a blocking device and/or at a desired rate or speed.

Abstract: Disclosed are highly efficient multiphoton absorbing compounds and methods of their use. The compounds generally include a bridge of pi-conjugated bonds connecting electron donating groups or electron accepting groups. The bridge may be substituted with a variety of substituents as well. Solubility, lipophilicity, absorption maxima and other characteristics of the compounds may be tailored by changing the electron donating groups or electron accepting groups, the substituents attached to or the length of the pi-conjugated bridge. Numerous photophysical and photochemical methods are enabled by converting these compounds to electronically excited states upon simultaneous absorption of at least two photons of radiation. The compounds have large two-photon or higher-order absorptivities such that upon absorption, one or more Lewis acidic species, Lewis basic species, radical species or ionic species are formed.

Abstract: A system and method include a pattern generating portion that is used to pattern an object via a projection system. The pattern generating portion includes active and inactive areas. The pattern generating portion patterns light traveling towards the active areas and the projection system projects the patterned light onto the object. The pattern generating portion directs light traveling towards inactive areas away from the object.

Abstract: An optical storage system and method having separate, independent format hologram writing and data writing mechanisms to allow optimization of data writing separately from format hologram recording. In its most general terms, the invention comprises an optical medium having a first, photoactive material responsive to a first, format hologram recording condition and a second photo-active material, responsive to a second, data writing condition, which is dispersed or dissolved in the first photoactive material. The second photoactive material may additionally be “erasable” under a third, erasing condition. The second photoactive material is preferably in the form of microparticles, microdroplets or microcapsules which are dispersed throughout the first photoactive material.

Abstract: A method for protecting a wet lens element from liquid degradation is provided. The method includes applying a thin coating of an organoxy-metallic compound to the side portions of a wet lens element to leave behind an optically inert, light absorbing metal oxide film. A liquid shield coating is applied on top of the metal oxide coating. The two coating layers protect the wet lens element from liquid degradation when the side portion of the wet lens element is submerged into a liquid. In an embodiment, the wet lens element is an immersion lithography wet lens element and the liquid is an immersion lithography liquid.

Abstract: A method for reducing the scattered light emitted through an optical element is provided that protects adhesive used to hold the optical element in place from light induced deterioration. In one embodiment, the method includes applying a thin coating of an organoxy metallic compound to a region on an optical element where adhesive will be applied and exposing the organoxy metallic compound to ultra-violet light. Exposure to ultra-violet light converts the organoxy metallic compound to its corresponding metal oxide forming an optically inert, light absorbing coating that protects adhesive used to hold the optical element in place from light induced deterioration.

Abstract: A lithography system comprises an illumination system that supplies radiation and a projection system comprising an optical system and a patterning device located at a pupil plane. The patterning device patterns the radiation and the optical system projects the patterned radiation onto a target portion of a substrate. In one example, an additional patterning device is located at an object plane of the lithography system and patterns the radiation before the patterning device at the pupil plane.

Abstract: A system and method comprise a pattern generating portion that is used to pattern an object via a projection system. The pattern generating portion includes active and inactive areas. The pattern generating portion has active and inactive areas. The pattern generating portion includes active and inactive areas. The pattern generating portion patterns light traveling towards the active areas and the projection system projects the patterned light onto the object. The pattern generating portion directs light traveling towards inactive areas away from the object.

Abstract: A lithographic apparatus is provided in which exposure is carried out by projecting through an aqueous solution of alkali metal halide(s), the solution being in contact with the substrate to be exposed.