Abstract: An optical element for a projection exposure apparatus for semiconductor lithography comprises a main body and at least two actuators connected to the main body. The actuators are designed for deforming an optical effective surface of the optical element. The at least two actuators are ring actuators. A corresponding apparatus comprises such an optical element.

Abstract: A drive device includes: a drive unit configured to apply a drive voltage to a capacitive actuator to set a position of a capacitive actuator; a source controllable by an excitation signal and coupled to the first node to feed a time-dependent AC current signal into the first node so that an AC voltage arises at the capacitive actuator due to a superposition of the drive voltage and an AC voltage corresponding to a product of the AC current signal and an impedance of the capacitive actuator; a filter unit connected configured to filter an output signal of the capacitive actuator; and a determining unit configured to determine an impedance behaviour of the capacitive actuator depending on the filtered output signal, the determining unit configured to output the excitation signal to drive the source.

Abstract: A method for driving an actuator for a component of a projection exposure apparatus for semiconductor lithography comprises: characterizing the actuator; parameterizing an actuator model; implementing the actuator model in a control structure; and driving the in actuator using the actuator model.

Abstract: An optical system comprises at least one mirror having a mirror body and a mirror surface, and at least one actuator device coupled to the mirror body and serving for deforming the mirror surface. The actuator device comprises at least one electrostrictive actuator element for generating a mechanical stress in the mirror body for deforming the mirror surface depending on an electrical drive voltage, and at least one electrostrictive sensor element for outputting a sensor signal depending on a deformation of the sensor element. The at least one sensor element is arranged directly adjacent to the actuator element and/or is arranged in such a way that it is configured at least partly for transferring the mechanical stress generated by the actuator element to the mirror body.

Abstract: A method for calibrating a manipulable optical module for a microlithographic projection exposure apparatus, which comprises at least one manipulation element for setting an at least one-dimensional local variation profile of an optical property of the optical module is provided. The method comprises: applying a temporally varying excitation signal to the at least one manipulation element; determining a raw measurement data set via a measurement device measuring the respective local variation profile resulting at different times during the variation of the excitation signal; estimating a temporally varying scaling, caused by the temporal variation of the excitation signal, in the variation profiles of the raw measurement data set; determining a full effect profile of the optical property by fitting the temporally varying scaling to the variation profiles of the raw measurement data set; and determining calibration data of the manipulable optical module on the basis of the full effect profile.

Abstract: An optical apparatus for a lithography system has at least one optical element comprising an optical surface. The optical apparatus also has one or more actuators for deforming the optical surface. The optical element comprises a strain gauge device for determining the deformation of the optical surface. The gauge device comprises: a) at least one path length device for generating a measurement spectrum of a measurement radiation, wherein the path length device comprises a grating device for the measurement radiation and/or a resonator device for the measurement radiation; and/or b) at least one waveguide, wherein the at least one waveguide and/or the at least one grating device and/or the at least one resonator device are formed by the substrate element.

Abstract: A component for a projection exposure apparatus for semiconductor lithography, comprises an optical element and an actuator, which are force-fittingly connected to each other. The actuator at least locally deforms the optical element. The actuator can be configured to minimize the loss in rigidity at the peripheries delimiting the actuator on the imaging quality. A method for designing a component of projection exposure apparatus is provided.

Abstract: An optical apparatus for a lithography system comprises at least one optical element comprising an optical surface. The optical apparatus also comprises one or more actuators for deforming the optical surface. A strain gauge device is provided for determining the deformation of the optical surface. The strain gauge device comprises at least one optical fiber that maintains polarization.

Abstract: A metrology system includes a first beam analysis system for analyzing at least one first measurement beam that was coupled from the excitation laser beam before a reflection on the target material and a second beam analysis system for analyzing at least one second measurement beam that was coupled from the excitation laser beam after a reflection on the target material. Each of the first beam analysis system and the second beam analysis system has at least one wavefront sensor system.

Abstract: A projection exposure apparatus comprises an optical element. The optical element comprises a main body and an actuator for deforming an optically effective surface formed on the main body. The actuator is in a recess in the rear side of the main body.

Abstract: A method, a system, a computer program and a data storage device in which machine parameters are captured by at least one sensor of the machine are disclosed. The operating anomaly is identified via the captured machine parameters. Environmental parameters are retrieved from at least one external data source and the captured machine parameters are retrieved by a computing device. The environmental parameters are filtered at least according to a location of the machine and/or a measuring time of the machine parameters, Furthermore, at least one correlation between the machine parameters, the filtered environmental parameters and the operating anomaly is ascertained by the computing device by a correlation model. The cause of the operating anomaly is determined on the basis of the at least one correlation ascertained by the correlation model.

Abstract: A method and apparatus for determining a load of a drive device are disclosed. The drive device is provided with at least one sensor system which is coupled to a computing unit. By the sensor system, different data relating to the drive device in operation are detected. The detected data are transmitted to the computing unit and the detected data are compared to load-typical information stored in the computing unit. A type of load is determined based on the compared data.

Abstract: An apparatus includes a light intensity sensor arrangement, a focusing unit for focusing the light beam at a specified location on the light intensity sensor arrangement, and an adjustment unit which adjusts a relative position of the intensity centroid of the light beam in relation to a specified location on the light intensity sensor arrangement when there is a change in the beam angle present upon entry in the apparatus. The adjustment unit is configured to keep the relative position of the intensity centroid of the light beam in relation to the specified location on the light intensity sensor arrangement constant up to a specified maximum deviation. The maximum deviation corresponds to half the mean beam diameter upon incidence on the light intensity sensor arrangement.

Abstract: A method for measuring an actuator in a projection exposure apparatus for semiconductor lithography, comprises: driving and deflecting a first actuator with a constant control signal; deflecting a further actuator by way of the mechanical coupling; and determining the capacitance of the further actuator, which was deflected by way of the coupling. A projection exposure apparatus for semiconductor lithography comprises a control device and a measuring device, wherein the measuring device is configured to determine the capacitance of at least one actuator in the projection exposure apparatus.

Abstract: An adaptive optical element for microlithography comprises at least one manipulator for changing the shape of an optical surface of the optical element. The manipulator comprises a dielectric medium which is deformable via an electric field, work electrodes for generating the electric field in the dielectric medium, and a measuring electrode for measuring temperature. The measuring electrode is arranged in a direct assemblage with the dielectric medium. The measuring electrode has a temperature-dependent resistance.

Abstract: An adaptive optical element for microlithography comprises at least one manipulator for changing the shape of an optical surface of the optical element. The manipulator comprises a one-piece dielectric medium which is deformable by applying an electric field, electrodes that are arranged in interconnection with the one-piece dielectric medium, and a voltage generator which is wired to the electrodes and configured to apply to the electrodes, firstly, a control voltage that serves to change a longitudinal extent of the dielectric medium and, secondly, an AC voltage that serves to heat the dielectric medium.

Abstract: An optical assembly for semiconductor lithography comprises an optical element and an actuator for deforming the optical element. The actuator is constructed from at least three sections, which include at least first and second group of sections that are controllable in each case via a controller are present. The first group serves for coarse actuation, and the second group serves for fine actuation. The controller is configured to control the groups independently of one another and the sections of a group jointly. The controller is furthermore configured to variably set the number of sections controlled jointly per group. Furthermore, the disclosure relates to a projection exposure apparatus equipped with the assembly, and to a method for controlling the optical assembly.

Abstract: A drive device comprises a drive unit, a source, a filter unit, and a determining unit.

Abstract: An optical system comprises at least one mirror having a mirror body and a mirror surface, and at least one actuator device coupled to the mirror body and serving for deforming the mirror surface. The actuator device comprises at least one electrostrictive actuator element for generating a mechanical stress in the mirror body for deforming the mirror surface depending on an electrical drive voltage, and at least one electrostrictive sensor element for outputting a sensor signal depending on a deformation of the sensor element. The at least one sensor element is arranged directly adjacent to the actuator element and/or is arranged in such a way that it is configured at least partly for transferring the mechanical stress generated by the actuator element to the mirror body.

Abstract: A control system for frequency control of a laser module, comprising at least one laser module for generating laser radiation, at least one control device coupled or configured to couple to the laser module, and at least one optical resonator coupled or configured to couple to the control device, wherein the control device comprises a semiconductor substrate, a first Pound-Drever-Hall system arranged on the semiconductor substrate and at least one second Pound-Drever-Hall system arranged on the semiconductor substrate, wherein the laser module is coupled to the first Pound-Drever-Hall system of the control device and is configured to couple to the at least second Pound-Drever-Hall system of the control device, wherein the first Pound-Drever-Hall system is coupled to the optical resonator and wherein the second Pound-Drever-Hall system is configured to couple to the optical resonator, and wherein the number of Pound-Drever-Hall systems is greater than the number of laser modules or optical resonators.