Abstract: A projection exposure system (10) for microlithography. The system includes projection optics (12) configured to image mask structures into a substrate plane (16), an input diffraction element (28) which is configured to convert irradiated measurement radiation (21) into at least two test waves (30) directed onto the projection optics (12) with differing propagation directions, a detection diffraction element (34; 28) which is disposed in the optical path of the test waves (30) after the latter have passed through the projection optics (12) and is configured to produce a detection beam (36) from the test waves (30) which has a mixture of radiation portions of both test waves (30), a photo detector (38) disposed in the optical path of the detection beam (36) which is configured to record the radiation intensity of the detection beam (36), time resolved, and an evaluation unit which is configured to determine the lateral imaging stability of the projection optics (12) from the radiation intensity recorded.

Abstract: First test beams (464a-d), after passing through an optical system on optical paths that differ in pairs, impinge on a first measurement region (461) at angles that differ in pairs with respect to the measurement plane. Second test beams (465a-d), after passing through the optical system on optical paths that differ in pairs, impinge on a second measurement region (462) at angles that differ in pairs, wherein the second region differs from the first. A value of a first measurement variable of the test beam at the first region is detected for each of the first test beams, and comparably for a second measurement variable at the second region for the second test beams. Impingement regions (467a-d) on reference surface(s) (466, 471) of the optical system are determined and a spatial diagnosis distribution of a property of the reference surface(s) for each test beam is calculated.

Abstract: Measuring a shape of an optical surface (14) of a test object (12) includes: providing an interferometric measuring device (16) generating a measurement wave (18); arranging the measuring device (16) and the test object (12) consecutively at different measurement positions relative to each other, such that different regions (20) of the optical surface (14) are illuminated by the measurement wave (18); measuring positional coordinates of the measuring device (16) at the different measurement positions in relation to the test object (12); obtaining surface region measurements by interferometrically measuring the wavefront of the measurement wave (18) after interaction with the respective region (20) of the optical surface (14) using the measuring device (16) in each of the measurement positions; and determining the actual shape of the optical surface (14) by computationally combining the sub-surface measurements based on the measured positional coordinates of the measuring device (16) at each of the measurement

Abstract: Measuring a shape of an optical surface (14) of a test object (12) includes: providing an interferometric measuring device (16) generating a measurement wave (18); arranging the measuring device (16) and the test object (12) consecutively at different measurement positions relative to each other, such that different regions (20) of the optical surface (14) are illuminated by the measurement wave (18); measuring positional coordinates of the measuring device (16) at the different measurement positions in relation to the test object (12); obtaining surface region measurements by interferometrically measuring the wavefront of the measurement wave (18) after interaction with the respective region (20) of the optical surface (14) using the measuring device (16) in each of the measurement positions; and determining the actual shape of the optical surface (14) by computationally combining the surface region measurements based on the measured positional coordinates of the measuring device (16) at each of the measurem

Abstract: First test beams (464a-d), after passing through an optical system on optical paths that differ in pairs, impinge on a first measurement region (461) at angles that differ in pairs with respect to the measurement plane. Second test beams (465a-d), after passing through the optical system on optical paths that differ in pairs, impinge on a second measurement region (462) at angles that differ in pairs, wherein the second region differs from the first. A value of a first measurement variable of the test beam at the first region is detected for each of the first test beams, and comparably for a second measurement variable at the second region for the second test beams. Impingement regions (467a-d) on reference surface(s) (466, 471) of the optical system are determined and a spatial diagnosis distribution of a property of the reference surface(s) for each test beam is calculated.

Abstract: A method for calibrating a specimen stage of a metrology system is provided, in which a specimen that has multiple marks is positioned successively in different calibration positions, each mark is positioned in the photography range of an optical system by means of the specimen stage in each calibration position of the specimen, and the mark position is measured using the optical system. A model is set up that describes positioning errors of the specimen stage using a system of functions having calibration parameters to be determined. The model takes into consideration at least one systematic measurement error that occurs during the measurement of the mark positions. The values of the calibration parameters are determined based on the model with consideration of the measured mark positions.

Abstract: An optical system, in particular a projection objective, for microlithography, has an optical axis and at least one optical correction arrangement, which has a first optical correction element and at least one second optical correction element, wherein the first correction element is provided with a first aspherical surface contour, and wherein the second correction element is provided with a second aspherical surface contour, wherein the first surface contour and the second surface contour add up at least approximately to zero, wherein the correction arrangement has at least one drive for movement of at least one of the two correction elements. In this case, at least one of the two correction elements can rotate about a rotation axis which is at least approximately parallel to the optical axis, and the at least one drive is a rotary drive for rotation of one or both of the correction elements about the rotation axis.

Abstract: There is provided a method for determining residual errors, compromising the following steps: in a first step, a test plate comprising a first pattern is used, and in a second step, a test plate comprising a second pattern which is reflected and/or rotated with respect to the first step is used.

Abstract: Measuring a shape of an optical surface (14) of a test object (12) includes: providing an interferometric measuring device (16) generating a measurement wave (18); arranging the measuring device (16) and the test object (12) consecutively at different measurement positions relative to each other, such that different regions (20) of the optical surface (14) are illuminated by the measurement wave (18); measuring positional coordinates of the measuring device (16) at the different measurement positions in relation to the test object (12); obtaining surface region measurements by interferometrically measuring the wavefront of the measurement wave (18) after interaction with the respective region (20) of the optical surface (14) using the measuring device (16) in each of the measurement positions; and determining the actual shape of the optical surface (14) by computationally combining the sub-surface measurements based on the measured positional coordinates of the measuring device (16) at each of the measurement

Abstract: A projection exposure system (10) for microlithography. The system includes projection optics (12) configured to image mask structures into a substrate plane (16), an input diffraction element (28) which is configured to convert irradiated measurement radiation (21) into at least two test waves (30) directed onto the projection optics (12) with differing propagation directions, a detection diffraction element (34; 28) which is disposed in the optical path of the test waves (30) after the latter have passed through the projection optics (12) and is configured to produce a detection beam (36) from the test waves (30) which has a mixture of radiation portions of both test waves (30), a photo detector (38) disposed in the optical path of the detection beam (36) which is configured to record the radiation intensity of the detection beam (36), time resolved, and an evaluation unit which is configured to determine the lateral imaging stability of the projection optics (12) from the radiation intensity recorded.

Abstract: An optical system (10), in particular a projection objective (12), for microlithography, has an optical axis and at least one optical correction arrangement (44), which has a first optical correction element (48) and at least one second optical correction element, wherein the first correction element is provided with a first aspherical surface contour, and wherein the second correction element is provided with a second aspherical surface contour, wherein the first surface contour and the second surface contour add up at least approximately to zero, wherein the correction arrangement (44) has at least one drive for movement of at least one of the two correction elements. In this case, at least one of the two correction elements can rotate about a rotation axis which is at least approximately parallel to the optical axis, and the at least one drive is a rotary drive for rotation of one or both of the correction elements about the rotation axis.

Abstract: A method for calibrating a specimen stage of a metrology system is provided, in which a specimen that has multiple marks is positioned successively in different calibration positions, each mark is positioned in the photography range of an optical system by means of the specimen stage in each calibration position of the specimen, and the mark position is measured using the optical system. A model is set up that describes positioning errors of the specimen stage using a system of functions having calibration parameters to be determined. The model takes into consideration at least one systematic measurement error that occurs during the measurement of the mark positions. The values of the calibration parameters are determined based on the model with consideration of the measured mark positions.

Abstract: A method and an apparatus for determining at least one optical property of an imaging optical system which is designed to image an object disposed in an object plane of the optical system into an assigned image plane. The method includes disposing at least one test structure in the object plane of the optical system, disposing an image recording device in at least two different positions relative to the image plane of the optical system, in each of the at least two relative positions the image recording device being offset in relation to the image plane to such an extent that an image of the pupil of the optical system is produced respectively on the image recording device by the optical system by means of the test structure, and recording an image produced on the image recording device by the optical system by means of the test structure in each of the at least two relative positions by means of the image recording device.

Abstract: A scattered light measurement device includes an illumination mask providing measuring radiation on an entrance side (1a) of a test component (1) and a detection part (3-6) for detection of light scattered by the test component and disposed on an exit side (1b) of the test component. The illumination mask includes at least one scattered light measurement structure, wherein the scattered light measurement structure has a scattered light marker zone and wherein the scattered light marker zone has a rotationally non-symmetric shape.

Abstract: An apparatus for measuring the positions of marks on a mask is provided, said apparatus comprising a mask holder for holding the mask, a recording unit for recording the marks of the mask held by the mask holder, an actuating module for moving the mask holder and the recording unit relative to each other, and an evaluating module, which numerically calculates the gravity-induced sagging of the mask in the mask holder and determines the positions of the marks on the mask, based on the calculated sagging, the recordings made by the recording unit and the relative movement between the mask holder and the recording unit, wherein, prior to calculating said sagging, the present position of the mask in the mask holder is determined and is taken into consideration in said numerical calculation, and/or the geometrical dimensions of the mask are taken into consideration in said numerical calculation of sagging.

Abstract: There is provided a method for determining residual errors, compromising the following steps: in a first step, a test plate comprising a first pattern is used, and in a second step, a test plate comprising a second pattern which is reflected and/or rotated with respect to the first step is used.

Abstract: An illumination mask (10a) for a device for the range-resolved determination of scattered light, having one or more scattered-light measuring structures (11a) which respectively include an inner dark-field zone which defines a minimum scattering range, to an associated image-field mask and a corresponding device is provided. Also provided is an associated operating method and a microlithography projection-exposure system having such a device. The scattered-lighter measuring structure in the illumination mask has a scattered-light marker zone (20a) in the form of a bright-field zone, which on the one hand borders the inner dark-field zone and on the other hand borders an outer dark-field zone, which defines a maximum scattering range. The device may optionally be designed for the multi-channel measuring of scattered light by using a suitable image-field mask and also for multi-channel wavefront measurement, and the detection part may contain an immersion medium.

Abstract: A method and an apparatus for determining at least one optical property of an imaging optical system which is designed to image an object disposed in an object plane of the optical system into an assigned image plane. The method includes disposing at least one test structure in the object plane of the optical system, disposing an image recording device in at least two different positions relative to the image plane of the optical system, in each of the at least two relative positions the image recording device being offset in relation to the image plane to such an extent that an image of the pupil of the optical system is produced respectively on the image recording device by the optical system by means of the test structure, and recording an image produced on the image recording device by the optical system by means of the test structure in each of the at least two relative positions by means of the image recording device.

Abstract: An illumination mask (10a) for a device for the range-resolved determination of scattered light, having one or more scattered-light measuring structures (11a) which respectively include an inner dark-field zone which defines a minimum scattering range, to an associated image-field mask and a corresponding device is provided. Also provided is an associated operating method and a microlithography projection-exposure system having such a device. The scattered-lighter measuring structure in the illumination mask has a scattered-light marker zone (20a) in the form of a bright-field zone, which on the one hand borders the inner dark-field zone and on the other hand borders an outer dark-field zone, which defines a maximum scattering range. The device may optionally be designed for the multi-channel measuring of scattered light by using a suitable image-field mask and also for multi-channel wavefront measurement, and the detection part may contain an immersion medium.

Abstract: An illumination mask (10a) for a device for the range-resolved determination of scattered light, having one or more scattered-light measuring structures (11a) which respectively include an inner dark-field zone which defines a minimum scattering range, to an associated image-field mask and a corresponding device is provided. Also provided is an associated operating method and a microlithography projection-exposure system having such a device. The scattered-lighter measuring structure in the illumination mask has a scattered-light marker zone (20a) in the form of a bright-field zone, which on the one hand borders the inner dark-field zone and on the other hand borders an outer dark-field zone, which defines a maximum scattering range. The device may optionally be designed for the multi-channel measuring of scattered light by using a suitable image-field mask and also for multi-channel wavefront measurement, and the detection part may contain an immersion medium.