Abstract: A semiconductor device is provided, which includes an epitaxial structure, a first contact electrode and a second contact electrode. The epitaxial structure includes a first semiconductor structure, a second semiconductor structure and an active region. The first semiconductor structure includes a first semiconductor contact layer. The second semiconductor structure includes a second semiconductor contact layer. The active region is located between the first semiconductor structure and the second semiconductor structure. The first contact electrode is located on the second semiconductor contact layer and directly contacts the first semiconductor contact layer. The second contact electrode is located on the second semiconductor contact layer and directly contacts the second semiconductor contact layer. The first semiconductor contact layer has a conductivity type of n-type and includes a first group III-V semiconductor material.

Abstract: A testing system for sensor data of a monitoring system including a server and multiple sensors is disclosed. The server includes a data pre-process module, a value classifying-computing module, and a value comparing module. The data pre-process module performs a data cleaning procedure to sensor data of the multiple sensors to generate multiple cleaned data. The value classifying-computing module computes a difference-value combination of multiple cleaned data of every two sensors in a designated order-direction. The value comparing module subtracts a measuring-accuracy value from every difference-value of each difference-value combination to obtain multiple second difference-value combinations, computes a first feature value of each second difference-value combination, and records a label to two sensors corresponding to one of the second difference-value combinations when a p-value corresponding to the first feature value of the second difference-value combination is determined to be less than a threshold.

Abstract: A package comprises an interposer, comprising an interposer substrate including at least one layer, and a plurality of RDLs formed through at least a portion of the interposer substrate. The package also includes a die device structure comprising at least one device die, and a first test line (TL) structure interposed between the interposer and the die device structure. The first TL structure includes at least one first test line electrically coupled to the at least one device die, at least a portion of the at least one first test line extending beyond a peripheral edge of the die device structure to provide an electrical interface with the at least one device die.

Abstract: An image processing method for human body posture transformation, which is executed by an electronic device reading an executable code to identify a preset object using artificial intelligence, and performing image processing to capture target postures of the preset object. The method includes the steps of identifying an object, detecting postures, and capturing target postures. The steps involve detecting the preset object undergoing transformation between different postures within a target duration. A capture requirement is met when each posture is visible for a posture visibleness duration and reaches a duration threshold. A target posture transformation video which lasts for a segment duration is captured from an initial image and uploaded to the cloud for storage. An electronic device for human body posture transformation image processing, a terminal device in communication connection with the electronic device, and a non-transient computer-readable recording medium are further provided.

Abstract: A semiconductor device includes: a substrate; a seed layer disposed on the substrate; a compound semiconductor stack layer disposed on the seed layer; and a source metal layer and a drain metal layer disposed on the compound semiconductor stack layer. The semiconductor device further includes a conductive layer at least partially covering the source metal layer and the drain metal layer, and covering opposing side surfaces of the seed layer and opposing side surfaces of the compound semiconductor stack layer. The conductive layer electrically connects the seed layer and the source metal layer.

Abstract: A combinable optical-fiber adapter assembly includes combinable optical-fiber adapters. A first optical-fiber adapter includes a first adapter body, and a first side wall of the first adapter body has first connection units. A second optical-fiber adapter includes a second adapter body, and a first side wall of the second adapter body has second connection units. The first connection units are assembled with the second connection units. In a one-to-one manner, each of the first connection units is docked with a corresponding one of the second connection units, so that two adjacent optical-fiber adapters can be assembled side-by-side. Optical-fiber cables are inserted into the optical-fiber adapter from one side of the optical-fiber adapter. The optical-fiber adapter has a reduced length.

Abstract: An estimating system for energy-saving and emission-reduction is provided and includes an energy-consumption device operating in the environment based on multiple operating parameters to generate an energy-consumption and carbon-emission result and a server for receiving and storing corresponding values of each operating parameter of the energy-consumption device. The server includes an energy-consumption factor analyzing module for selecting multiple energy-consumption factors relevant to power-consumed amount and carbon-emitted amount from the multiple operating parameters, a new-device-parameter importing module for importing multiple performance coefficients of multiple new devices, and a simulating module for performing a simulation and calculating an energy-consumption simulated result of each new device as if each new device were operated under same environment within a specific historical time-period.

Abstract: A method is provided for forming an integrated circuit (IC) chip package structure. The method includes: providing an interposer having a front surface and a back surface, the interposer comprising a substrate, at least one routing region, and at least one non-routing region; forming at least one warpage-reducing trench in the at least one non-routing region, wherein the at least one warpage-reducing trench extends from the front surface of the interposer to a first depth, the first depth smaller than a thickness between the front surface and the back surface of the interposer; depositing a warpage-relief material in the at least one warpage-reducing trench; and bonding the group of IC dies to the front surface of the interposer.

Abstract: Processing methods for forming iridium-containing films at low temperatures are described. The methods comprise exposing a substrate to iridium hexafluoride and a reactant to form iridium metal or iridium silicide films. Methods for enhancing selectivity and tuning the silicon content of some films are also described.

Abstract: Processing methods for forming iridium-containing films at low temperatures are described. The methods comprise exposing a substrate to iridium hexafluoride and a reactant to form iridium metal or iridium silicide films. Methods for enhancing selectivity and tuning the silicon content of some films are also described.

Abstract: Aqueous formulations of indacaterol are disclosed. The formulations may find use in the treatment of respiratory disorders, inflammatory disorders, or obstructive airway diseases. Methods of using the formulations and kits comprising the formulations are also encompassed by the disclosure.

Abstract: Provided are atomic layer deposition methods to deposit a tungsten film or tungsten-containing film using a tungsten-containing reactive gas comprising one or more of tungsten pentachloride, a compound with the empirical formula WCl5 or WCl6.

Abstract: Aqueous formulations of indacaterol are disclosed. The formulations may find use in the treatment of respiratory disorders, inflammatory disorders, or obstructive airway diseases. Methods of using the formulations and kits comprising the formulations are also encompassed by the disclosure.

Abstract: The presently disclosed subject matter relates to methods of diagnosing and treating chronic kidney disease (CKD) in an animal, comprising determining the amount of magnesium in a sample of the animal and providing the animal with a treatment regimen. In certain embodiments, the treatment regimen comprises administering an effective amount of magnesium.

Abstract: An aerosolization system includes a container that is configured to deliver a unit dosage of a liquid when squeezed a single time. The system also includes an aerosolizer that is constructed of a housing defining a mouthpiece, and an aerosol generator disposed in the housing. The aerosol generator includes a vibratable membrane having a front face and a rear face, and a vibratable element used to vibrate the membrane. Further, the housing includes an opening that is adapted to receive a unit dosage of the liquid from the container. The opening provides a liquid path to the rear face of the vibratable membrane.

Abstract: A method is described for supplying a metered amount of a liquid medicament to an aerosolizing device. The method utilizes a dispenser comprising an elongate dispenser body having a proximal end and a tip at a distal end through which a liquid medicament is dispensed. The dispenser further comprises a dispensing mechanism that operates to dispense a metered quantity of the liquid medicament from the tip each time the dispenser body is compressed. The dispenser is grasped with one hand such that the fingers wrap around the dispenser body, with the thumb closest to the proximal end and the last finger closest to the tip. The tip is inserted into an opening of an inhaler and the elongate body is forced toward the tip to cause the dispenser body to compress, thereby operating the dispensing mechanism and causing a metered quantity of the liquid medicament to eject into the inhaler.

Abstract: The presently disclosed subject matter relates to methods of diagnosing and treating chronic kidney disease (CKD) in an animal, comprising determining the amount of magnesium in a sample of the animal and providing the animal with a treatment regimen. In certain embodiments, the treatment regimen comprises administering an effective amount of magnesium.

Abstract: Processing methods for forming iridium-containing films at low temperatures are described. The methods comprise exposing a substrate to iridium hexafluoride and a reactant to form iridium metal or iridium silicide films. Methods for enhancing selectivity and tuning the silicon content of some films are also described.

Abstract: Methods and apparatus for depositing a coating on a semiconductor manufacturing apparatus component are provided herein. In some embodiments, a method of depositing a coating on a semiconductor manufacturing apparatus component includes: sequentially exposing a semiconductor manufacturing apparatus component including nickel or nickel alloy to an aluminum precursor and a reactant to form an aluminum containing layer on a surface of the semiconductor manufacturing apparatus component by a deposition process.

Abstract: A method for manufacturing a gel-state flame-retardant electrolyte film includes the steps of: preparing a first solution having a high boiling-point solvent; adding a solid-state polymer material into the first solution, and performing a heating and stirring process to form a second solution; adding a flame-retardant electrolyte material and a flame-retardant water-absorbent material into the second solution for forming a third solution by well mixing; forming the third solution into a viscous matter; and, solidifying the viscous matter to form the gel-state flame-retardant electrolyte film. In addition, a gel-state flame-retardant electrolyte film, a gel-state electrolyte battery and a method for manufacturing the gel-state electrolyte battery are also provided.