Patents by Inventor Mei Wang
Mei Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230417491Abstract: A vapor chamber includes a first cover and a second cover. The first cover has a thermal contact surface. The thermal contact surface is configured to be thermally coupled to a heat source. The second cover and the first cover are joined together to form an air tight space. The air tight space is configured to accommodate a cooling fluid. The thermal contact surface faces away from the air tight space. The second cover has a first surface, a second surface and at least one first support protrusion structure. The first surface faces away from the first cover. The second surface faces the first cover. The at least one first support protrusion structure protrudes from the second surface of the second cover and is in physical contact with the first cover.Type: ApplicationFiled: October 3, 2022Publication date: December 28, 2023Applicant: COOLER MASTER (HUIZHOU) CO., LTD.Inventors: Xue Mei WANG, Xiao Min ZHANG, Xiong ZHANG
-
Publication number: 20230408205Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.Type: ApplicationFiled: August 31, 2023Publication date: December 21, 2023Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Lei Lei LIU, Xiao Min ZHANG, Xue Mei WANG
-
Publication number: 20230391104Abstract: An ink delivery system for delivering ink to an inkjet printhead includes: an ink tank; the inkjet printhead having a printhead inlet port and a printhead outlet port; an ink supply line connected between the ink tank and the printhead inlet port; an ink return line connected between the ink tank and the printhead outlet port; an ink recirculation pump positioned in the ink return line; an ink filter positioned in the ink return line; a bypass line for bypassing ink around the ink filter; a bypass valves for controlling flow of ink either through the ink filter or through the bypass line; and a controller for coordinating the bypass valve and the pump. The controller is configured to pump ink from the printhead outlet port to the ink tank via the bypass line when the return line contains air.Type: ApplicationFiled: April 28, 2023Publication date: December 7, 2023Inventors: Zhenya Yourlo, Peter Crichton, Mei Wang, Nicolas Chin, Craig Meyer
-
Publication number: 20230372427Abstract: A composition of plant ingredients and a composition of herbs are introduced. The composition of plant ingredients and the composition of herbs respectively include Camellia, lotus seedpod of Nelumbo nucifera, Eucommia ulmoides Oliver, Glechoma hederacea and Angelica keiskei. The composition of plant ingredients and the composition of herbs can inhibit coronavirus infection in host cells.Type: ApplicationFiled: May 18, 2023Publication date: November 23, 2023Inventors: Yu-Fen Chang, Hsiu-Mei Wang, Szu-Yu Lin, Min-Wen Chung
-
Publication number: 20230370484Abstract: Techniques for providing Internet of Things (IoT) security are disclosed. An applicable system includes profiling IoT devices to limit the number of network signatures applicable to the IoT devices and performing pattern matching using a pattern that is appropriate for the profile of a given IoT device.Type: ApplicationFiled: July 25, 2023Publication date: November 16, 2023Inventors: Jun Du, Mei Wang, Hector Daniel Regalado, Jianhong Xia
-
Publication number: 20230358482Abstract: A three-dimensional heat exchanger includes a thermally conductive casing, a thermally conductive structure, a first heat pipe and a second heat pipe. The thermally conductive casing includes a bottom plate and a thermally conductive protrusion structure. The bottom plate has a first inner surface. The thermally conductive protrusion structure has a second inner surface. The thermally conductive structure is disposed on the thermally conductive protrusion structure, and has a top surface. The first heat pipe contacts the first inner surface. The second heat pipe contacts the second inner surface. An end of the first heat pipe and an end of the second heat pipe have a bottom surface, respectively. A distance between the two bottom surfaces and the second inner surface is larger than a distance between the top surface and the second inner surface.Type: ApplicationFiled: July 17, 2023Publication date: November 9, 2023Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Lei Lei LIU, Xue Mei WANG
-
Patent number: 11788795Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.Type: GrantFiled: June 11, 2020Date of Patent: October 17, 2023Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Lei Lei Liu, Xiao Min Zhang, Xue Mei Wang
-
Publication number: 20230327367Abstract: Disclosed is an electrical connector configured to be mated with another electrical connector along a mating axis. The electrical connector includes an insulating body, a plurality of terminals, a first shell, and a water-proof member. The insulating body includes a first part and a second part separated from each other along the mating axis to form a gap between the first part and the second part along the mating axis. The plurality of terminals are disposed through the insulating body. The first shell is sleeved on the insulating body. The first shell, the first part, and the second part form a closed space at the gap. The water-proof member is disposed at the insulating body and located in the closed space.Type: ApplicationFiled: March 22, 2023Publication date: October 12, 2023Applicant: Advanced Connectek Inc.Inventors: Yubin Li, Yao Mei Wang, Shu-Fen Wang
-
Publication number: 20230327366Abstract: Provided is an electrical connector including an insulator, a plurality of terminals disposed in the insulator, a first housing surrounding the insulator and the terminals, a waterproof sealant, and a second housing disposed on the first housing. The first housing has a connecting port and a flange. The connecting port is configured to connect to another electrical connector, and the flange is disposed along the connecting port. The waterproof sealant is disposed onto the first housing along the connecting port and abutting the flange. The waterproof sealant is kept at a distance from the second housing.Type: ApplicationFiled: April 6, 2023Publication date: October 12, 2023Applicant: Advanced Connectek Inc.Inventors: Yubin Li, Yao Mei Wang, Shu-Fen Wang
-
Patent number: 11777965Abstract: Techniques for providing Internet of Things (IoT) security are disclosed. An applicable system includes profiling IoT devices to limit the number of network signatures applicable to the IoT devices and performing pattern matching using a pattern that is appropriate for the profile of a given IoT device.Type: GrantFiled: June 18, 2019Date of Patent: October 3, 2023Assignee: Palo Alto Networks, Inc.Inventors: Jun Du, Mei Wang, Hector Daniel Regalado, Jianhong Xia
-
Patent number: 11774180Abstract: A heat pipe including a pipe body. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The condensation portion includes a condensation end. The evaporation portion includes an evaporation end. The evaporation end and/or the condensation end are/is in a rectangular shape.Type: GrantFiled: February 17, 2021Date of Patent: October 3, 2023Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Xue Mei Wang, Lei Lei Liu
-
Publication number: 20230289945Abstract: A method for positioning tea-bud picking points based on fused thermal images and RGB images is provided and includes: firstly, image pairs of several tea buds are acquired by using an image acquisition device, and are each labeled to obtain a tea-bud object detection database and a tea-bud keypoint detection database; secondly, in order to obtain a trained object detection model and a trained keypoint detection model, the tea-bud object detection database and the tea-bud keypoint detection database are inputted into an object detection model and a keypoint detection model for training, respectively; finally, the trained object detection model and keypoint detection model are used to sequentially process the tea-bud image pairs to obtain tea-bud keypoint positions, and then tea-bud picking point positions are obtained in combination with the tea-bud growth characteristics. The positioning accuracy and efficiency of the tea-bud picking points can be improved.Type: ApplicationFiled: November 14, 2022Publication date: September 14, 2023Inventors: Chunwang DONG, Yang LI, Mei WANG, Jianneng CHEN, Rentian ZHANG, Yifan CHENG, Jiayin JIANG, Muzhe WANG
-
Patent number: 11754345Abstract: A heat dissipation device includes an upper cover, a lower cover, an upper wick, a first wick, a plurality of second wicks, a third wick, and a gas-liquid separation plate. The lower cover and the upper cover together form a sealed vacuum chamber therebetween. The upper wick is attached on a first inner surface of the upper cover and is in fluid communication with the second wicks and the third wick. The first wick is attached on a second inner surface of the lower cover. The second wicks are attached on the lower cover. Third wick is attached on a third inner surface of the lower cover and is connected to and in fluid communication with the first wick. The gas-liquid separation plate is attached on a planar area of the third wick so as to separate a vapor from a liquid in the sealed vacuum chamber.Type: GrantFiled: September 7, 2021Date of Patent: September 12, 2023Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC (HUI ZHOU) LTD.Inventors: Xue Mei Wang, Xianyao Liu
-
Patent number: 11747089Abstract: A three-dimensional heat exchanger including first thermally conductive plate, second thermally conductive plate, a plurality of supporting structures, at least one thermally conductive structure, at least one capillary structure and at least one heat pipe. Second thermally conductive plate has at least one through hole. Second thermally conductive plate is attached to first thermally conductive plate so that liquid-tight chamber is formed between first and second thermally conductive plate. An end of each of supporting structures is connected to first thermally conductive plate. Another end of each of supporting structures is connected to second thermally conductive plate. Thermally conductive structure is connected to at least a part of supporting structures. Capillary structure is stacked on first thermally conductive plate, at least a part of supporting structures, and thermally conductive structure. Heat pipe is disposed through the through hole.Type: GrantFiled: April 17, 2021Date of Patent: September 5, 2023Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Lei Lei Liu, Xue Mei Wang
-
Patent number: 11733199Abstract: The present invention relates to the technical field of glucose detection, and in particular to an enzyme-free glucose sensor and a fabrication method and use thereof. In the present invention, Magnolia grandiflora L. leaves are used as a carbon-based catalyst, which serve as a base material to well disperse nickel atoms and improve the catalytic activity of a material. A prepared Ni@NSiC nano-molecular layer is used to modify a pretreated white glassy carbon electrode (GCE) to obtain a highly-active material-modified working electrode Ni@NSiC/GCE, and then glucose is detected through cyclic voltammetry (CV) and chronoamperometry (CA).Type: GrantFiled: April 30, 2021Date of Patent: August 22, 2023Assignee: Jiangsu UniversityInventors: Quan Bu, Jin Cai, Hairong Long, Mei Wang, Hanping Mao
-
Patent number: 11713302Abstract: A sulfonamide benzamide derivative has the structure shown in Formula II that can be prepared as an anti-HBV (hepatitis B virus) pharmaceutical composition; it is prepared by sulfonation reaction, acylation reaction and sulfonylation reaction; the sulfonamide benzamide derivative has been shown effective activity for anti-HBV by inhibiting HBV DNA replication in vitro.Type: GrantFiled: May 12, 2022Date of Patent: August 1, 2023Assignee: WEIFANG MEDICAL UNIVERSITYInventors: Haiyong Jia, Chuanju Li, Lei Zhang, Linyue Liu, Mei Wang, Xin Li, Xianghui Han
-
Patent number: 11699264Abstract: A method, a system, and a computing device for reconstructing three-dimensional planes are provided. The method includes the following steps: obtaining a series of color information, depth information and pose information of a dynamic scene by a sensing device; extracting a plurality of feature points according to the color information and the depth information, and marking part of the feature points as non-planar objects including dynamic objects and fragmentary objects; computing point cloud according to the unmarked feature points and the pose information, and instantly converting the point cloud to a three-dimensional mesh; and growing the three-dimensional mesh to fill vacancy corresponding to the non-planar objects according to the information of the three-dimensional mesh surrounding or adjacent to the non-planar objects.Type: GrantFiled: May 22, 2020Date of Patent: July 11, 2023Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventor: Te-Mei Wang
-
Publication number: 20230213288Abstract: A three-dimensional heat transfer device includes a first thermally conductive casing, a second thermally conductive casing, a first capillary structure, a second capillary structure and a heat pipe. The second thermally conductive casing has a through hole. The second thermally conductive casing is mounted on the first thermally conductive casing so as to form a liquid-tight chamber. The first capillary structure is disposed on the first thermally conductive casing. The second capillary structure is disposed on the first thermally conductive casing. Projections of the first capillary structure and the second capillary structure on the outer surface and an extension surface of the outer surface are located in an extent of the outer surface, and the second capillary structure is located closer to the second thermally conductive casing than the second capillary structure. The heat pipe is disposed through the through hole and in contact with the second capillary structure.Type: ApplicationFiled: September 2, 2022Publication date: July 6, 2023Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Xue Mei WANG, Xiao Min ZHANG
-
Patent number: D999334Type: GrantFiled: May 16, 2023Date of Patent: September 19, 2023Inventor: Mei Wang
-
Patent number: D1003386Type: GrantFiled: June 12, 2023Date of Patent: October 31, 2023Inventor: Mei Wang