Patents by Inventor Mei Wang
Mei Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220341868Abstract: The present invention relates to the technical field of glucose detection, and in particular to an enzyme-free glucose sensor and a fabrication method and use thereof. In the present invention, Magnolia grandiflora L. leaves are used as a carbon-based catalyst, which serve as a base material to well disperse nickel atoms and improve the catalytic activity of a material. A prepared Ni@NSiC nano-molecular layer is used to modify a pretreated white glassy carbon electrode (GCE) to obtain a highly-active material-modified working electrode Ni@NSiC/GCE, and then glucose is detected through cyclic voltammetry (CV) and chronoamperometry (CA).Type: ApplicationFiled: April 30, 2021Publication date: October 27, 2022Applicant: Jiangsu UniversityInventors: Quan BU, Jin CAI, Hairong LONG, Mei WANG, Hanping MAO
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Patent number: 11447855Abstract: A hard coating includes three kinds of alternately laminated layers. The three kinds of layers consist of two kinds of single composition layers and a nanolayer-alternated layer. The two kinds of single composition layers are constituted by respective two of an A composition, a B composition and a C composition, wherein the A composition is a nitride of AlCr?, the B composition is a nitride of AlCrSi?, and the C composition is a nitride of AlCr(SiC)?. The nanolayer-alternated layer includes two kinds of nanolayers which are constituted by respective two of the A composition, the B composition and the C composition and which are alternately laminated. Each of the two kinds of single composition layers has a thickness of 0.5-1000 nm. Each of the two kinds of nanolayers has a thickness of 0.5-500 nm, and the nanolayer-alternated layer has a thickness of 1-1000 nm.Type: GrantFiled: August 1, 2018Date of Patent: September 20, 2022Assignee: OSG CORPORATIONInventors: Mei Wang, Hiroaki Sugita
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Patent number: 11447875Abstract: A hard coating includes a three kinds of layers that are alternately laminated. The three kinds of layers consist of a single composition layer and two kinds of nanolayer-alternated layers. The single composition layer is constituted by one of an A composition (nitride of AlCrSi?), a B composition (nitride of CrBSi?) and a C composition (nitride of AlCr(SiC)?). The two kinds of nanolayer-alternated layers include nanolayers which are alternately laminated and which are constituted by two of three combinations consisting of a combination of the A composition and B composition, a combination of the A composition and C composition and a combination of the B composition and C composition. The single composition layer has a thickness of 0.5-1000 nm. Each of the nanolayers constituting the two kinds of nanolayer-alternated layers has a thickness of 0.5-500 nm, and each of the two kinds of nanolayer-alternated layers has a thickness of 1-1000 nm.Type: GrantFiled: August 1, 2018Date of Patent: September 20, 2022Assignee: OSG CORPORATIONInventor: Mei Wang
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Patent number: 11447873Abstract: A hard coating includes a three kinds of layers that are alternately laminated. The three kinds of layers consist of a single composition layer and two kinds of nanolayer-alternated layers. The single composition layer is constituted by one of an A composition (nitride of AlCrSi?), a B composition (nitride of AlTiSi?) and a C composition (nitride of AlCr(SiC)?). The two kinds of nanolayer-alternated layers include nanolayers which are alternately laminated and which are constituted by two of three combinations consisting of a combination of the A composition and B composition, a combination of the A composition and C composition and a combination of the B composition and C composition. The single composition layer has a thickness of 0.5-1000 nm. Each of the nanolayers constituting the two kinds of nanolayer-alternated layers has a thickness of 0.5-500 nm, and each of the two kinds of nanolayer-alternated layers has a thickness of 1-1000 nm.Type: GrantFiled: August 1, 2018Date of Patent: September 20, 2022Assignee: OSG CORPORATIONInventor: Mei Wang
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Patent number: 11447872Abstract: A hard coating includes a three kinds of layers that are alternately laminated. The three kinds of layers consist of a single composition layer and two kinds of nanolayer-alternated layers. The single composition layer is constituted by one of an A composition (nitride of AlCr?), a B composition (nitride of AlTiCr?) and a C composition (nitride of AlCr(SiC)?). The two kinds of nanolayer-alternated layers include nanolayers which are alternately laminated and which are constituted by two of three combinations consisting of a combination of the A composition and B composition, a combination of the A composition and C composition and a combination of the B composition and C composition. The single composition layer has a thickness of 0.5-1000 nm. Each of the nanolayers constituting the two kinds of nanolayer-alternated layers has a thickness of 0.5-500 nm, and each of the two kinds of nanolayer-alternated layers has a thickness of 1-1000 nm.Type: GrantFiled: August 1, 2018Date of Patent: September 20, 2022Assignee: OSG CORPORATIONInventors: Mei Wang, Hiroyuki Hanyu
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Publication number: 20220295669Abstract: A heat dissipation device includes an upper cover, a lower cover, an upper wick, a first wick, a plurality of second wicks, a third wick, and a gas-liquid separation structure. The lower cover and the upper cover together form a sealed vacuum chamber therebetween. The upper wick is attached on a first inner surface of the upper cover and is in fluid communication with the second wicks and the third wick. The first wick is attached on a second inner surface of the lower cover. The second wicks are attached on the lower cover. Third wick is attached on a third inner surface of the lower cover and is connected to and in fluid communication with the first wick. The gas-liquid separation structure is attached on a planar area of the third wick so as to separate a vapor from a liquid in the sealed vacuum chamber.Type: ApplicationFiled: September 7, 2021Publication date: September 15, 2022Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Xue Mei WANG, Xianyao LIU
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Patent number: 11428354Abstract: The present application provides a pipeline adapter including a first connection block, a second connection block, a fastener and a seal ring. The first connection block is provided with a first channel and a first annular positioning groove disposed around the first channel. The second connection block is provided with a second channel communicating with the first channel and a second annular positioning platform fitting inside the first annular positioning groove. The second annular positioning platform is disposed around the second channel. The fastener connects the first connection block to the second connection block. The seal ring fits between the first annular positioning groove and the second annular positioning platform. The pipeline adapter is convenient to use, has a favorable sealing effect, and facilitates pipeline connection of a refrigeration system.Type: GrantFiled: August 22, 2018Date of Patent: August 30, 2022Assignee: HANGZHOU SANHUA RESEARCH INSTITUTE CO., LTD.Inventors: Shifeng Liu, Lin-Jie Huang, Xu Li, Wenqing Chen, Mei Wang, Li Li, Junqi Dong
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Patent number: 11421940Abstract: A vapor chamber accommodating working fluid and including first plate, second plate, first capillary structure and second capillary structure. First plate has thermal contact surface. Second and first plate are attached to each other so as to allow hermetically sealed space to be formed. Hermetically sealed space accommodates working fluid. Thermal contact surface faces away from hermetically sealed space. First capillary structure is located in hermetically sealed space. First capillary structure includes base portion, first protrusions and second protrusions. Base portion is stacked on first plate. First protrusions and second protrusions protrude from a side of base portion. Second protrusions surround first protrusions. Second capillary structure is located in hermetically sealed space. Second capillary structure is stacked on first protrusions. Distance between first protrusions is smaller than distance between second protrusions.Type: GrantFiled: April 1, 2021Date of Patent: August 23, 2022Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Lei Lei Liu, Xue Mei Wang
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Publication number: 20220253535Abstract: A first device governs operation of a second device based on a network security risk posed by the second device. The second device is disposed locally to the first device and in local network communication with the first device. The first device is in network communication with a cloud-based computational service.Type: ApplicationFiled: April 26, 2022Publication date: August 11, 2022Inventors: Gong Cheng, Mayuresh Ektare, Mei Wang
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Publication number: 20220243995Abstract: A heat pipe has a tube and an evaporator wick. The tube has multiple groove structures, an evaporator section, and a condenser section. The groove structures are disposed on an inner surface of the tube and extend to two opposite ends of the tube to reduce flow resistance of liquid phase working fluid. The evaporator wick is disposed in the evaporator section. The evaporator wick is made of metal powder and sintered to adhere to the groove structures. The evaporator wick is uniform in thickness and uniformly adheres to the groove structures. The evaporator wick vaporizes the working fluid in the evaporator section. As a result, the heat pipe has good manufacturing process repeatability and is reliable, easy to manufacture, and low-cost.Type: ApplicationFiled: May 17, 2021Publication date: August 4, 2022Inventor: XUE-MEI WANG
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Publication number: 20220220016Abstract: A fungus having manganese oxidation capacity is provided. The fungus can oxidize Mn2+ in a water body into a water-insoluble manganese oxide; and the Mn2+ oxidizing fungus is Cladosporium sp. XM01 strain with the accession number of CGMCC NO. 21083. The Cladosporium sp. XM01 strain is used to oxidize Mn2+ in a natural water body, and has stable operation within a range of room temperature (15-30° C.) and a range of neutral pH (6.0-7.5) and high Mn2+ oxidation efficiency; moreover, the XM01 strain may oxidize Mn2+ cyclically, thereby achieving the in-situ remediation of water bodies or soils polluted by heavy metals or trace organic substances. The manganese oxides generated through oxidization in the growth process of the strain have a good application potential in sewage treatment, water environment restoration, soils and other fields.Type: ApplicationFiled: May 19, 2021Publication date: July 14, 2022Applicant: TONGJI UNIVERSITYInventors: Mei Wang, Zuxin Xu, Bin Dong
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Publication number: 20220214115Abstract: A vapor chamber accommodating working fluid and including first plate, second plate, first capillary structure and second capillary structure. First plate has thermal contact surface. Second and first plate are attached to each other so as to allow hermetically sealed space to be formed. Hermetically sealed space accommodates working fluid. Thermal contact surface faces away from hermetically sealed space. First capillary structure is located in hermetically sealed space. First capillary structure includes base portion, first protrusions and second protrusions. Base portion is stacked on first plate. First protrusions and second protrusions protrude from a side of base portion. Second protrusions surround first protrusions. Second capillary structure is located in hermetically sealed space. Second capillary structure is stacked on first protrusions. Distance between first protrusions is smaller than distance between second protrusions.Type: ApplicationFiled: April 1, 2021Publication date: July 7, 2022Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Lei Lei LIU, Xue Mei WANG
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Publication number: 20220175064Abstract: Most protective masks are not designed to follow individual facial contours and have a limited ability to adjust to various facial sizes and shapes. A sealing cushion for use with surgical face masks and the like has a pliant body with a tacky surface and a wire embedded within, which together create a frame-like structure having a central aperture. The wire encased within the body of the cushion allows the apparatus to be shaped and fitted to the contours of the face to create a substantially airtight seal between the face and the mask. The sealing cushion can prevent or reduce entry of airborne contaminants around the sides and edges of the mask.Type: ApplicationFiled: December 7, 2020Publication date: June 9, 2022Inventors: Yang Pan, Mei Wang
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Patent number: 11349248Abstract: The invention provides a universal serial bus connector, including an insulating body and a plurality of terminals. The insulating body has a tongue portion and at least one recess located on the tongue portion. The terminals pass through the insulating body, and the terminals expose the insulating body from the tongue portion. The recess corresponds to at least one terminal and is located in an extending direction of the corresponding terminal on the tongue portion.Type: GrantFiled: November 17, 2020Date of Patent: May 31, 2022Assignee: Advanced Connectek Inc.Inventors: Er Li Huang, Pin-Yuan Hou, Yao Mei Wang, Hsien-Lung Huang
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Publication number: 20220163267Abstract: A three-dimensional heat exchanger including first thermally conductive plate, second thermally conductive plate, a plurality of supporting structures, at least one thermally conductive structure, at least one capillary structure and at least one heat pipe. Second thermally conductive plate has at least one through hole. Second thermally conductive plate is attached to first thermally conductive plate so that liquid-tight chamber is formed between first and second thermally conductive plate. An end of each of supporting structures is connected to first thermally conductive plate. Another end of each of supporting structures is connected to second thermally conductive plate. Thermally conductive structure is connected to at least a part of supporting structures. Capillary structure is stacked on first thermally conductive plate, at least a part of supporting structures, and thermally conductive structure. Heat pipe is disposed through the through hole.Type: ApplicationFiled: April 17, 2021Publication date: May 26, 2022Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Lei Lei Liu, Xue Mei Wang
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Publication number: 20220136778Abstract: A heat pipe including a pipe body. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The condensation portion includes a condensation end. The evaporation portion includes an evaporation end. The evaporation end and/or the condensation end are/is in a rectangular shape.Type: ApplicationFiled: February 17, 2021Publication date: May 5, 2022Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Xue Mei WANG, Lei Lei LIU
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Patent number: 11313626Abstract: This disclosure relates to a heat pipe includes a tubular body and a capillary structure. The tubular body has an inner surface. The inner surface forms a sealed chamber. The capillary structure is located in the sealed chamber and arranged on the inner surface. The tubular body includes a condensation section and an evaporation section connected to each other. The capillary structure includes a cold section and a heat section connected to each other. The cold section is disposed on the condensation section, and the heat section is disposed on the evaporation section. A wall thickness of the cold section is greater than a wall thickness of the heat section.Type: GrantFiled: August 5, 2020Date of Patent: April 26, 2022Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.Inventors: Lei Lei Liu, Xue Mei Wang
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Patent number: 11291924Abstract: A reversible toy has a main body. The main body has a first configured unit and a second configured unit joined with each other. Each of the first and the second configured units is made of elastomer. One of the first and the second configured units is filled in the other one of the first and the second configured units to form a reversible opening formed in a bottom of the main body, and positions of the first and the second configured units are interchangeable via the reversible opening.Type: GrantFiled: June 3, 2020Date of Patent: April 5, 2022Assignee: KAI SHUN INDUSTRIAL CO., LTD.Inventor: Dong-Mei Wang
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Patent number: D965882Type: GrantFiled: August 9, 2020Date of Patent: October 4, 2022Inventor: Mei Wang
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Patent number: D965883Type: GrantFiled: August 9, 2020Date of Patent: October 4, 2022Inventor: Mei Wang