Patents by Inventor Mei Wang

Mei Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163570
    Abstract: A correction method for ill-exposed (IE) images, comprises the following steps. (1) A series of original images are captured. (2) The original images are classified as a set of first well-exposed (WE) images and IE images by utilizing a first computational model, according to a lightness distribution of each of the original images. The IE images have a plurality of exposure types including a back-lit (BL) type, an over-exposed (OE) type, and an under-exposed (UE) type. (3) The IE images are corrected to obtain a set of second WE images by utilizing a second computational model. A plurality of perceptual parameters and structural parameters of each of the IE images are extracted and then adjusted according to the BL, OE, and UE types respectively. (4) The first WE images and the second WE images are provided as a set of output images.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 16, 2024
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventor: Te-Mei WANG
  • Publication number: 20240125563
    Abstract: A fin structure includes an inlet fin assembly and an outlet fin assembly. The inlet fin assembly includes a plurality of inlet fins arranged side by side, and a first air channel is formed between two of the plurality of inlet fins that are adjacent to each other. The outlet fin assembly includes a plurality of outlet fins arranged side by side, and a second air channel is formed between two of the plurality of outlet fins that are adjacent to each other. The inlet fin assembly is connected to the outlet fin assembly, and the plurality of first air channels are in fluid communication with the plurality of second air channels. A thermal conductivity of the inlet fin assembly is greater than a thermal conductivity of the outlet fin assembly.
    Type: Application
    Filed: February 10, 2023
    Publication date: April 18, 2024
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Xue Mei WANG, Xiao Min ZHANG, Xiong ZHANG
  • Publication number: 20240110751
    Abstract: A thin heat pipe including a thin heat pipe container, wick structure, working fluid, and vapor flow passage section is provided. The thin heat pipe container includes a lower inner wall and upper inner wall. The wick structure is disposed on the lower inner wall and includes a first wick structure portion connected to a second wick structure portion. The vapor flow passage section is configured for vapor to flow therethrough. A thickness of the second wick structure portion is lesser than a thickness of the first wick structure portion and the second wick structure portion does not contact, contact points between the upper inner wall and lower inner wall. The wick structure defines the vapor flow passage section. The first wick structure contacts the upper inner wall and second wick structure. Working fluid is pulled from vapor condenser sections to high temperature sections via the wick structure.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 4, 2024
    Inventors: Xue Mei WANG, Xiao Min ZHANG, HUA-YUAN LIN
  • Publication number: 20240080049
    Abstract: Embodiments described herein include methods and apparatus for dynamically selecting antenna settings for reception of wireless signals in multiple radio frequency band by wireless devices. A wireless device includes at least two SIM/eSIM profiles that each use different radio frequency bands and dynamically selects an antenna tuner setting based on requirements of one or more applications in use and key radio frequency performance indicators. In some embodiments, the antenna hardware tuner setting is selected to improve paging reception for a secondary SIM/eSIM from a second cellular wireless network when applications communicating using a first SIM/eSIM via a first cellular wireless network can accommodate performance degradation for a period of time.
    Type: Application
    Filed: September 6, 2022
    Publication date: March 7, 2024
    Inventors: Kexin MA, Zhengbo ZHU, Alex Yee Kit HO, Mei WANG
  • Publication number: 20240074114
    Abstract: A heat dissipation device includes a thermally-conductive base and at least one heat pipe. The thermally-conductive base has a heat absorbing surface, a heat dissipation surface and at least one accommodation hole. The heat dissipation surface faces away from the heat absorbing surface, and the at least one accommodation hole extends from the heat absorbing surface to the heat dissipation surface. The at least one heat pipe is located in the at least one accommodation hole and has a first surface and a second surface which are exposed to outside. The second surface faces away from the first surface, and the first surface and the heat dissipation surface are substantially coplanar and directly connected to each other so as to form a same plane together.
    Type: Application
    Filed: November 10, 2022
    Publication date: February 29, 2024
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Xue Mei WANG, Xiao Min ZHANG, Xianyao LIU
  • Patent number: 11898665
    Abstract: A pipeline connection device includes a first connecting member, a second connecting member and a sealing member. The first connecting member includes a first channel and an abutting portion. The second connecting member includes a second channel and a first groove portion. The first groove portion includes a first side wall and a first receiving groove to receive the sealing member. At least part of the abutting portion is received in the first receiving groove and abuts against the sealing element. A first gap not greater than 0.3 mm is provided between the abutting portion and the first side wall; or the first connecting member and the second connecting member include at most two annular friction surfaces. As a result, mutual jamming of the first connecting member and the second connecting member can be avoided. Besides, a pipeline adapting assembly having the pipeline connection device is disclosed.
    Type: Grant
    Filed: January 12, 2020
    Date of Patent: February 13, 2024
    Assignee: HANGZHOU SANHUA RESEARCH INSTITUTE CO., LTD.
    Inventors: Mei Wang, Li Li, Junqi Dong
  • Patent number: 11892212
    Abstract: A gas-liquid separator includes a first cylinder, a second cylinder and a heat exchange assembly. The first cylinder is surrounded by the second cylinder at a predetermined distance. The heat exchange assembly is arranged between the first cylinder and the second cylinder. The heat exchange assembly includes a collecting pipe. An extension direction of the collecting pipe is parallel to an axial direction of the first cylinder. At least a part of a side wall surface of the first cylinder is formed with an avoidance portion recessed inwardly. At least a part of the collecting pipe is arranged between the avoidance portion and the second cylinder.
    Type: Grant
    Filed: August 22, 2019
    Date of Patent: February 6, 2024
    Assignee: ZHEJIANG SANHUA INTELLIGENT CONTROLS CO., LTD.
    Inventors: Li Li, Mei Wang, Junqi Dong
  • Publication number: 20240002308
    Abstract: The present invention discloses a soil-structure improving bio-organic fertilizer and a preparation method thereof, and belongs to the technical field of biological fertilizers. The preparation method of the bio-organic fertilizer of the present invention includes the following steps: S1: aerobically fermenting cow dung-based organic materials to prepare a solid-state fermentation medium; S2: inoculating Bacillus subtilis fermentation broth and silicate bacteria fermentation broth into the solid-state fermentation medium for solid-state fermentation until the end of fermentation; and S3: after the fermentation is finished, extruding and granulating or directly sieving to prepare the soil-structure improving bio-organic fertilizer.
    Type: Application
    Filed: September 14, 2023
    Publication date: January 4, 2024
    Inventors: Lihua Jiang, Chunxiu Wei, Yan Yang, Baozhong Zhao, Xueping Li, Lesen Zhang, Yu Xu, Jing Shi, Mei Wang, Yumin Liu
  • Publication number: 20230417491
    Abstract: A vapor chamber includes a first cover and a second cover. The first cover has a thermal contact surface. The thermal contact surface is configured to be thermally coupled to a heat source. The second cover and the first cover are joined together to form an air tight space. The air tight space is configured to accommodate a cooling fluid. The thermal contact surface faces away from the air tight space. The second cover has a first surface, a second surface and at least one first support protrusion structure. The first surface faces away from the first cover. The second surface faces the first cover. The at least one first support protrusion structure protrudes from the second surface of the second cover and is in physical contact with the first cover.
    Type: Application
    Filed: October 3, 2022
    Publication date: December 28, 2023
    Applicant: COOLER MASTER (HUIZHOU) CO., LTD.
    Inventors: Xue Mei WANG, Xiao Min ZHANG, Xiong ZHANG
  • Publication number: 20230408205
    Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.
    Type: Application
    Filed: August 31, 2023
    Publication date: December 21, 2023
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei LIU, Xiao Min ZHANG, Xue Mei WANG
  • Publication number: 20230391104
    Abstract: An ink delivery system for delivering ink to an inkjet printhead includes: an ink tank; the inkjet printhead having a printhead inlet port and a printhead outlet port; an ink supply line connected between the ink tank and the printhead inlet port; an ink return line connected between the ink tank and the printhead outlet port; an ink recirculation pump positioned in the ink return line; an ink filter positioned in the ink return line; a bypass line for bypassing ink around the ink filter; a bypass valves for controlling flow of ink either through the ink filter or through the bypass line; and a controller for coordinating the bypass valve and the pump. The controller is configured to pump ink from the printhead outlet port to the ink tank via the bypass line when the return line contains air.
    Type: Application
    Filed: April 28, 2023
    Publication date: December 7, 2023
    Inventors: Zhenya Yourlo, Peter Crichton, Mei Wang, Nicolas Chin, Craig Meyer
  • Publication number: 20230372427
    Abstract: A composition of plant ingredients and a composition of herbs are introduced. The composition of plant ingredients and the composition of herbs respectively include Camellia, lotus seedpod of Nelumbo nucifera, Eucommia ulmoides Oliver, Glechoma hederacea and Angelica keiskei. The composition of plant ingredients and the composition of herbs can inhibit coronavirus infection in host cells.
    Type: Application
    Filed: May 18, 2023
    Publication date: November 23, 2023
    Inventors: Yu-Fen Chang, Hsiu-Mei Wang, Szu-Yu Lin, Min-Wen Chung
  • Publication number: 20230370484
    Abstract: Techniques for providing Internet of Things (IoT) security are disclosed. An applicable system includes profiling IoT devices to limit the number of network signatures applicable to the IoT devices and performing pattern matching using a pattern that is appropriate for the profile of a given IoT device.
    Type: Application
    Filed: July 25, 2023
    Publication date: November 16, 2023
    Inventors: Jun Du, Mei Wang, Hector Daniel Regalado, Jianhong Xia
  • Publication number: 20230358482
    Abstract: A three-dimensional heat exchanger includes a thermally conductive casing, a thermally conductive structure, a first heat pipe and a second heat pipe. The thermally conductive casing includes a bottom plate and a thermally conductive protrusion structure. The bottom plate has a first inner surface. The thermally conductive protrusion structure has a second inner surface. The thermally conductive structure is disposed on the thermally conductive protrusion structure, and has a top surface. The first heat pipe contacts the first inner surface. The second heat pipe contacts the second inner surface. An end of the first heat pipe and an end of the second heat pipe have a bottom surface, respectively. A distance between the two bottom surfaces and the second inner surface is larger than a distance between the top surface and the second inner surface.
    Type: Application
    Filed: July 17, 2023
    Publication date: November 9, 2023
    Applicant: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei LIU, Xue Mei WANG
  • Patent number: 11788795
    Abstract: This disclosure relates to a vapor chamber configured to accommodate a cooling fluid. The vapor chamber includes a first cover, a second cover, a first capillary structure, and a second capillary structure. The second cover and the first cover are attached to each other to form a chamber therebetween. The chamber is configured to accommodate the cooling fluid. The first capillary structure is located in the chamber and stacked on the first cover. The second capillary structure is located in the chamber and stacked on the first capillary structure. The second capillary structure is different from the first capillary structure. A projection of the second capillary structure onto the first cover is smaller than a projection of the first capillary structure onto the first cover.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: October 17, 2023
    Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Lei Lei Liu, Xiao Min Zhang, Xue Mei Wang
  • Publication number: 20230327366
    Abstract: Provided is an electrical connector including an insulator, a plurality of terminals disposed in the insulator, a first housing surrounding the insulator and the terminals, a waterproof sealant, and a second housing disposed on the first housing. The first housing has a connecting port and a flange. The connecting port is configured to connect to another electrical connector, and the flange is disposed along the connecting port. The waterproof sealant is disposed onto the first housing along the connecting port and abutting the flange. The waterproof sealant is kept at a distance from the second housing.
    Type: Application
    Filed: April 6, 2023
    Publication date: October 12, 2023
    Applicant: Advanced Connectek Inc.
    Inventors: Yubin Li, Yao Mei Wang, Shu-Fen Wang
  • Publication number: 20230327367
    Abstract: Disclosed is an electrical connector configured to be mated with another electrical connector along a mating axis. The electrical connector includes an insulating body, a plurality of terminals, a first shell, and a water-proof member. The insulating body includes a first part and a second part separated from each other along the mating axis to form a gap between the first part and the second part along the mating axis. The plurality of terminals are disposed through the insulating body. The first shell is sleeved on the insulating body. The first shell, the first part, and the second part form a closed space at the gap. The water-proof member is disposed at the insulating body and located in the closed space.
    Type: Application
    Filed: March 22, 2023
    Publication date: October 12, 2023
    Applicant: Advanced Connectek Inc.
    Inventors: Yubin Li, Yao Mei Wang, Shu-Fen Wang
  • Patent number: 11774180
    Abstract: A heat pipe including a pipe body. The pipe body has an evaporation portion and a condensation portion. The condensation portion is connected to the evaporation portion. The condensation portion includes a condensation end. The evaporation portion includes an evaporation end. The evaporation end and/or the condensation end are/is in a rectangular shape.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: October 3, 2023
    Assignee: VAST GLORY ELECTRONICS & HARDWARE & PLASTIC(HUI ZHOU) LTD.
    Inventors: Xue Mei Wang, Lei Lei Liu
  • Patent number: 11777965
    Abstract: Techniques for providing Internet of Things (IoT) security are disclosed. An applicable system includes profiling IoT devices to limit the number of network signatures applicable to the IoT devices and performing pattern matching using a pattern that is appropriate for the profile of a given IoT device.
    Type: Grant
    Filed: June 18, 2019
    Date of Patent: October 3, 2023
    Assignee: Palo Alto Networks, Inc.
    Inventors: Jun Du, Mei Wang, Hector Daniel Regalado, Jianhong Xia
  • Patent number: D1003386
    Type: Grant
    Filed: June 12, 2023
    Date of Patent: October 31, 2023
    Inventor: Mei Wang