Abstract: The present invention teaches how greater solder ball height can be achieved without the need to sacrifice areal density. The mold in which the solder is formed, is created in two steps. In a first exposure, a negative photoresist (preferably DFR) is patterned to form a conventional cylindrical mold. However, exposure and development time are adjusted in such a way that a layer of unexposed and undeveloped resist of reduced thickness remains covering the floor of the mold. This residual resist layer is given a second exposure and, after development, forms an annular insert in the bottom of the first mold. After the mold has been filled with solder (either through electroplating or by using solder paste) it is removed, the result being a solder bump made up of two contiguous coaxial cylinders the upper one having the larger diameter. After remelt, bumps having this shape form oblate spheroids rather than spheres.

Abstract: A process for producing solder bumps on metal electrodes, such as Al electrodes, of a semiconductor wafer, such as silicon wafer, involves the formation of the under bump metallurgies (UBM) on the electrodes. The solder bumps are then formed on the under bump metallurgies by wave soldering. The under bump metallurgies consist of a diffusion barrier layer formed on the metal electrodes, and a wetting layer formed on the diffusion barrier layer.

Abstract: A semiconductor operational circuit conducts real-time analog vector operations to permit the determination of the center of gravity of an image of a moving object. The circuit employs a first processing stage utilizing CMOS source follower circuits to perform weighted linear sum operations on the analog signals. A second processing stage utilizes comparator circuitry to perform comparison operations involving data from the weighted-sum and non-weighted-sum operations. A third processing stage utilizes exclusive OR gates to provide digital data outputs based on the comparison operation results.

Abstract: This invention is an easy opening case, when taking something (e.g. tape cassette) out of the case, it is enough to use a single hand to open it. Besides, the case has a function of preventing itself from being opened by mistake. It mainly consists of a positioning hook on one side of its cover, corresponding to the hook, there disposed a positioning block on the wall of the base, the positioning block is an "L" shaped, elastic, movable coupled moving lug; when the case is closed, the hook just retains the positioning block so as to have a function of preventing the cover from being opened by mistake. When it is open for a user to take out an object in it, it is enough to use a single hand to handle it; that is, use the thumb to push the coupled moving lug, and use other fingers to pull the cover so that the positioning hook can get off the positioning block and the cover can be easily opened by a single hand.

Abstract: A composite bump structure and methods of forming the composite bump structure. The composite bump structure comprises a polymer body of relatively low Young's Modulus compared to metals covered by a conductive metal coating formed at the input/output pads of an integrated circuit element or substrate. The composite bump is formed using material deposition, lithography, and etching techniques. A layer of soldering metal can be formed on the composite bumps if this is desired for subsequent processing.

Abstract: The invention relates to compounds of the formulas ##STR1## wherein R.sup.1, R.sup.2 and R.sup.3 independently are hydrogen or lower alkyl, and the dotted ( . . . ) line is an optional double bond, and their pharmaceutically acceptable acid addition salts. The compounds of formulas I, II and III possess marked anticholinesterase activity and are useful as analeptic agents and as agents for the treatment of senile dementia and myasthenia gravis.