Patents by Inventor Michael A. Gaynes

Michael A. Gaynes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040150097
    Abstract: An optimized lid mounting for electronic device carriers, using standard manufacturing process steps of semiconductor packaging, optimizing heat dissipation and electromagnetic interference shielding is disclosed. According to the invention, conductive blocks or springs are soldered to ground pads of the chip carrier on their lower side. On the other side, these conductive blocks or springs are electrically connected to the lid with conductive adhesive material such as silicone based material. Furthermore, the lid is thermally connected to the semiconductor chip with electrical insulative adhesive material.
    Type: Application
    Filed: November 26, 2003
    Publication date: August 5, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Michael A. Gaynes, Stefano Oggioni, Giorgio Viero
  • Patent number: 6770968
    Abstract: A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive.
    Type: Grant
    Filed: February 19, 2003
    Date of Patent: August 3, 2004
    Assignee: International Business Machines Corporation
    Inventors: Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson
  • Patent number: 6744132
    Abstract: A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesively coupled to both a top surface of the semiconductor device and a top surface of the stiffener ring using a first and second adhesive, respectively. The modulus of the first adhesive is less than the modulus of the second adhesive.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: June 1, 2004
    Assignee: International Business Machines Corporation
    Inventors: David J. Alcoe, Thomas W. Dalrymple, Michael A. Gaynes, Randall J. Stutzman
  • Patent number: 6739046
    Abstract: A method is provided for connecting two conductive surfaces in an electronic circuit package comprising the steps of forming dendrites on selected regions of a first conductive surface, applying a dielectric insulation material over the first conductive surface such that the dendrites are exposed through the insulation material to leave a substantially planar surface of exposed dendrites, and placing a second conductive surface on top of the exposed dendrites. The second conductive surface may be a surface metal, a chip bump array, or a ball grid array. Also claimed is an electronic circuit package incorporating the dendrites used for electrical interconnection and planarization manufactured in accordance with the present invention.
    Type: Grant
    Filed: May 22, 2000
    Date of Patent: May 25, 2004
    Assignee: International Business Machines Corporation
    Inventors: Bernd K. Appelt, Saswati Datta, Michael A. Gaynes, John M. Lauffer, James R. Wilcox
  • Patent number: 6719871
    Abstract: A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive.
    Type: Grant
    Filed: January 9, 2001
    Date of Patent: April 13, 2004
    Assignee: International Business Machines Corporation
    Inventors: Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson
  • Patent number: 6661661
    Abstract: A common heatsink for multiple chips and modules which are spaced on electronic packages, and an arrangement for the formation of precision gaps intermediate two or more chips or modules covered by a common heatsink. Furthermore, a precision tool enables positioning of a common heatsink for multiple chips and modules for electronic packages facilitating the formation of x, y and z-directional compliant thermal interfaces intermediate a plurality of chips and a common heatsink with minimized effects of package tolerances.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: December 9, 2003
    Assignee: International Business Machines Corporation
    Inventors: Michael A. Gaynes, Howard Victor Mahaney, Jr., Mark V. Pierson
  • Publication number: 20030141586
    Abstract: A method and structure to adhesively couple a cover plate to a semiconductor device. A semiconductor device is electrically coupled to a substrate. A stiffener ring surrounding the semiconductor device is adhesively coupled to the substrate. A cover plate is adhesively coupled to both a top surface of the semiconductor device and a top surface of the stiffener ring using a first and second adhesive, respectively. The modulus of the first adhesive is less than the modulus of the second adhesive.
    Type: Application
    Filed: January 29, 2002
    Publication date: July 31, 2003
    Applicant: International Business Machines Corporation
    Inventors: David J. Alcoe, Thomas W. Dalrymple, Michael A. Gaynes, Randall J. Stutzman
  • Publication number: 20030128518
    Abstract: A common heatsink for multiple chips and modules which are spaced on electronic packages, and an arrangement for the formation of precision gaps intermediate two or more chips or modules covered by a common heatsink. Furthermore, a precision tool enables positioning of a common heatsink for multiple chips and modules for electronic packages facilitating the formation of x, y and z-directional compliant thermal interfaces intermediate a plurality of chips and a common heatsink with minimized effects of package tolerances.
    Type: Application
    Filed: January 7, 2002
    Publication date: July 10, 2003
    Applicant: International Business Machines Corporation
    Inventors: Michael A. Gaynes, Howard Victor Mahaney, Mark V. Pierson
  • Publication number: 20030123229
    Abstract: A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive.
    Type: Application
    Filed: February 19, 2003
    Publication date: July 3, 2003
    Inventors: Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson
  • Patent number: 6576996
    Abstract: A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at least partially convert silicon-containing residue on the surface to silica; and (c) bonding an article to the surface by applying an adherent between the article and the surface. Often, the silicon-containing residue is silicone oil, a mold release compound, which may prevent the formation of a bond when using conventional bonding methods and materials. The silica layer formed on the surface of the molded polymer assists in formation of a proper bond. The plasma may be an oxygen plasma and the adherent may be selected from either a heat cured silicone-based paste adhesive with a metal oxide filler or a heat cured porous polymer film impregnated with adhesive.
    Type: Grant
    Filed: January 9, 2001
    Date of Patent: June 10, 2003
    Assignee: International Business Machines Corporation
    Inventors: Frank D. Egitto, Michael A. Gaynes, Ramesh R. Kodnani, Luis J. Matienzo, Mark V. Pierson
  • Publication number: 20030101582
    Abstract: An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.
    Type: Application
    Filed: January 8, 2003
    Publication date: June 5, 2003
    Inventors: Barry A. Bonitz, Eric Duchesne, Michael A. Gaynes, Eric A. Johnson
  • Patent number: 6559666
    Abstract: A method and device for testing and burning-in semiconductor circuits. The method and device permit the entire wafer to be tested by temporarily attaching the wafer to a test substrate using electrically conductive adhesive (ECA). The ECA conforms to deviations from co-planarity of the contact points of both the wafer and test substrate while providing a quality electrical connection at each point. ECA material can be deposited on either the wafer contacts or the substrate pads. In addition, the ECA may be deposited on C4 bumps or tin-capped lead bases. Variations in the method and device include filling vias of a non-conductive interposer with ECA. The electrical connection may be enhanced by forming conductive dendrites on test pads while the ECA is deposited on the wafer contacts. To further enhance the electrical connection, the ECA material can be plasma etched to remove some of its polymer matrix and to expose the electrically conductive particles on one side and then plating with palladium.
    Type: Grant
    Filed: June 6, 2001
    Date of Patent: May 6, 2003
    Assignee: International Business Machines Corporation
    Inventors: William E. Bernier, Michael A. Gaynes, Wayne J. Howell, Mark V. Pierson, Ajit K. Trivedi, Charles G. Woychik
  • Patent number: 6545869
    Abstract: An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a to contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: April 8, 2003
    Assignee: International Business Machines Corporation
    Inventors: Barry A. Bonitz, Eric Duchesne, Michael A. Gaynes, Eric A. Johnson
  • Patent number: 6517662
    Abstract: A semiconductor chip carrier assembly which includes a flexible substrate having a metallicized path on one of its surfaces in electrical communication with a semiconductor chip. A stiffener is disposed adjacent to said flexible substrate and is bonded thereto by an adhesive composition. The adhesive composition which comprises a microporous film laden with a curable adhesive is disposed between the flexible substrate and the stiffener. A cover plate is adhesively bonded to the semiconductor chip and to the stiffener. A process of making the assembly involving disposition of the flexible substrate in a vacuum fixture upon which the adhesive composition and stiffener is placed followed by the application of heat and pressure to cure the curable adhesive is also described.
    Type: Grant
    Filed: September 16, 1999
    Date of Patent: February 11, 2003
    Assignee: International Business Machines Corporation
    Inventors: Thomas M. Culnane, Michael A. Gaynes, Ramesh R. Kodnani, Mark V. Pierson, Charles G. Woychik
  • Publication number: 20020174947
    Abstract: Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.
    Type: Application
    Filed: July 10, 2002
    Publication date: November 28, 2002
    Inventors: John G. Davis, Michael A. Gaynes, Joseph D. Poole
  • Patent number: 6487461
    Abstract: A method for aligning a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate is arranged on a coverplate support. A first layer of a bonding material is applied to at least one of a first side of each of the tiles and a surface of the coverplate on which the tiles are to be secured. The tiles are arranged on the coverplate, such that the first layer of bonding material is arranged between the tiles and the coverplate. The tiles are connected to an alignment apparatus. The tiles are aligned relative to each other and the coverplate. The tiles are at least partially secured to the coverplate.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: November 26, 2002
    Assignee: International Business Machines Corporation
    Inventors: Michael A. Gaynes, Allan O. Johnson, Ramesh R. Kodnani, Mark V. Pierson, Edward J. Tasillo
  • Publication number: 20020141160
    Abstract: An electronic structure, and associated method of fabrication, for coupling a heat spreader above a chip to a chip carrier below the chip. Initially provided is a substrate, a chip on a surface of the substrate and coupled to the substrate, and the heat spreader. Then a fillet of at least one adhesive material is formed on the chip and around a periphery of the chip. Additionally, the heat spreader is placed on a portion of the fillet and over a top surface of the chip. The fillet couples the heat spreader to the substrate. An outer surface of the fillet makes a contact angle of about 25 degrees with the surface of the substrate. The small contact angle not exceeding about 25 degrees prevents cracking of the substrate that would otherwise result from thermal cycling.
    Type: Application
    Filed: January 17, 2001
    Publication date: October 3, 2002
    Inventors: Barry A. Bonitz, Eric Duchesne, Michael A. Gaynes, Eric A. Johnson
  • Patent number: 6447885
    Abstract: Two surfaces are adhesively bonded together by providing on one of the surfaces a central, single point adhesive contact deposit and providing on one of the surfaces, adhesive extending from a central point deposit in a spoke-like array diagonally across substantially the entire surface. Also provided is the article obtained by the above method as well as the assembly used for bonding the two surfaces together. The surfaces are brought together, one on top of the other, with the adhesive located between the surfaces to cause the adhesive to spread out and cover the surfaces to thereby bond them together.
    Type: Grant
    Filed: June 15, 2000
    Date of Patent: September 10, 2002
    Assignee: International Business Machines Corporation
    Inventors: Michael A. Gaynes, Ramesh R. Kodnani
  • Publication number: 20020121698
    Abstract: An electronic structure bondable to an electronic assembly, such as a chip. The electronic structure may be joined to a electronic assembly, such as a chip, by use of a structural epoxy adhesive. The electronic structure includes a mineral layer on a metallic plate, and an adhesion promoter layer on the mineral layer. The metallic plate includes a metallic substance that includes a pure metal with or without a metal coating. The metallic substance may include such substances as stainless steel, aluminum, titanium, copper, copper coated with nickel, and copper coated with chrome. The mineral layer includes a chemical compound derived from a mineral; e.g., silicon dioxide (SiO2) derived from quartz. Such chemical compounds may include such substances as silicon dioxide, silicon nitride, and silicon carbide. The chemical compound may exist in either crystalline or amorphous form. The adhesion promoter may include such chemical substances as silanes, titanates, zirconates, and aluminates.
    Type: Application
    Filed: January 4, 2002
    Publication date: September 5, 2002
    Applicant: International Business Machines Corporation
    Inventors: Stephen Leslie Buchwalter, Hung Manh Dang, Michael A. Gaynes, Konstantinos I. Papathomas
  • Patent number: 6432511
    Abstract: Curved surfaces of a preform of thermoplastic adhesive provide improved regulation of heating and exclusion of gas as surfaces to be bonded are heated and pressed against the thermoplastic adhesive preform. Particulate or filamentary materials can be added to the thermoplastic adhesive for adjustment of coefficient of thermal expansion or further increase of heat transfer through the adhesive or both. The preform is preferably fabricated by molding, preferably in combination with die-cutting of a preform of desired volume from a web of approximately the same thickness as the completed bond.
    Type: Grant
    Filed: June 6, 1997
    Date of Patent: August 13, 2002
    Assignee: International Business Machines Corp.
    Inventors: John G. Davis, Michael A. Gaynes, Joseph D. Poole