Patents by Inventor Michael A Siegel

Michael A Siegel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8866663
    Abstract: In exemplary implementations of this invention, a radio signal is transmitted between a transmitter and a receiver. Either the transmitter, or receiver, or both, have a directional antenna. When organic tissue passes between (or is stationary between) the transmitter and receiver, the tissue causes a reduction of the received signal strength (RSS) of the signal, as compared to a baseline RSS. The larger the amount of tissue, the greater is the reduction of the RSS. By analyzing the degradation of the signal, information about organic tissue between the transmitter and receiver may be determined. For example, the number of persons passing through a physical threshold may be determined. Or the fact that one person is walking faster than, and catching up with, a second person as they pass between the transmitter and receiver may be determined.
    Type: Grant
    Filed: December 27, 2011
    Date of Patent: October 21, 2014
    Assignee: Massachusetts Institute of Technology
    Inventors: Nadav Aharony, Michael Siegel
  • Publication number: 20140057770
    Abstract: In one nonlimiting example, an automated system is provided for separating one or more components in a biological fluid, wherein the system comprises: (a) a centrifuge comprising one or more bucket configured to receive a container to effect said separating of one or more components in a fluid sample; and (b) the container, wherein the container includes one or more shaped feature that is complementary to a shaped feature of the bucket.
    Type: Application
    Filed: July 18, 2013
    Publication date: February 27, 2014
    Applicant: Theranos, Inc.
    Inventors: Elizabeth A. Holmes, Daniel Young, Timothy Smith, Scott Ridel, John Kent Frankovich, Michael Siegel
  • Publication number: 20130303861
    Abstract: The present invention, in one aspect, relates to a method for distinguishing between possible adenomatous and hyperplastic polyps using what :is referred to as “Early Increase in microvascular Blood Supply” (EIBS) that exists in tissues that are close to, but are not themselves, the abnormal tissue.
    Type: Application
    Filed: March 15, 2013
    Publication date: November 14, 2013
    Inventors: Vadim BACKMAN, Hemant ROY, Young L. KIM, Michael SIEGEL, Vladimir TURZHITSKY
  • Publication number: 20130162459
    Abstract: In exemplary implementations of this invention, a radio signal is transmitted between a transmitter and a receiver. Either the transmitter, or receiver, or both, have a directional antenna. When organic tissue passes between (or is stationary between) the transmitter and receiver, the tissue causes a reduction of the received signal strength (RSS) of the signal, as compared to a baseline RSS. The larger the amount of tissue, the greater is the reduction of the RSS. By analyzing the degradation of the signal, information about organic tissue between the transmitter and receiver may be determined. For example, the number of persons passing through a physical threshold may be determined. Or the fact that one person is walking faster than, and catching up with, a second person as they pass between the transmitter and receiver may be determined.
    Type: Application
    Filed: December 27, 2011
    Publication date: June 27, 2013
    Applicant: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
    Inventors: Nadav Aharony, Michael Siegel
  • Publication number: 20120279283
    Abstract: A method for operating an apparatus which has an oscillatable unit. The oscillatable unit is excited to oscillate by means of a first frequency sweep within a predetermined frequency band with successive, discrete exciter frequencies of increasing or decreasing frequency. A first exciter frequency is ascertained, in the case of which, during the first frequency sweep, at least one predeterminable criterion is fulfilled. The oscillatable unit is excited by means of a second frequency sweep, wherein the frequency band, compared with the first frequency sweep, is run through in the opposite direction. A second exciter frequency is ascertained, in the case of which, during the second frequency sweep, the at least one predeterminable criterion is fulfilled. From the first exciter frequency and the second exciter frequency, via formation of an average, a measuring frequency for determining and/or monitoring at least one process variable is determined.
    Type: Application
    Filed: May 3, 2012
    Publication date: November 8, 2012
    Applicant: Endress + Hauser GmbH + Co. KG
    Inventors: Tobias Brengartner, Martin Urban, Michael Siegel
  • Patent number: 8163645
    Abstract: A system and method is disclosed for providing a redistribution metal layer in an integrated circuit. The redistribution metal layer is formed from the last metal layer in the integrated circuit during manufacture of the integrated circuit before final passivation is applied. The last metal layer provides sites for solder bump pads used in flip chip interconnection. The redistribution metal layer can be (1) a flat layer deposited over the next to last metal layer through an opening in a dielectric layer, or (2) deposited over an array of vias connected to the next to last metal layer. Space between the solder bump pads is deposited with narrower traces for connecting active circuit areas below. A final passivation layer is deposited to ensure product reliability.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: April 24, 2012
    Assignee: STMicroelectronics, Inc.
    Inventors: Danielle A. Thomas, Harry Michael Siegel, Antonio A. Do Bento Vieira, Anthony M. Chiu
  • Publication number: 20120085165
    Abstract: A method and an apparatus for determining or monitoring a predetermined fill level, a phase boundary or a density of a medium in a container with an oscillatable unit. The oscillatable unit is placed at the height of the predetermined fill level and is excited to oscillate successively with discrete exciter frequencies following one another in a frequency scanning operation (sweep) within a predeterminable frequency band in the working range of the oscillatable unit. The corresponding oscillations of the oscillatable unit are received in the form of received signals; wherein that exciter frequency is ascertained in the frequency scanning operation, at which the oscillatable unit oscillates with an oscillation frequency, which has a predetermined phase shift between the transmission signal and the received signal; and wherein the transmitting/receiving unit excites the oscillatable unit to oscillate with the ascertained oscillation frequency.
    Type: Application
    Filed: April 23, 2010
    Publication date: April 12, 2012
    Applicant: Endress + Hauser GmbH + Co. KG
    Inventors: Martin Hortenbach, Martin Urban, Dietmar Frühauf, Tobias Brengartner, Frank Ruhnau, Michael Siegel
  • Patent number: 8095733
    Abstract: A data processing system includes an interconnect fabric, a system memory coupled to the interconnect fabric and including a virtual barrier synchronization region allocated to storage of virtual barrier synchronization registers (VBSRs), and a plurality of processing units coupled to the interconnect fabric and operable to access the virtual barrier synchronization region. Each of the plurality of processing units includes a processor core and a cache memory including a cache controller and a cache array that caches VBSR lines from the virtual barrier synchronization region of the system memory. The cache controller of a first processing unit, responsive to a memory access request from its processor core that targets a first VBSR line, transfers responsibility for writing back to the virtual barrier synchronization region a second VBSR line contemporaneously held in the cache arrays of first, second and third processing units.
    Type: Grant
    Filed: April 7, 2009
    Date of Patent: January 10, 2012
    Assignee: International Business Machines Corporation
    Inventors: Ravi K. Arimilli, Guy L. Guthrie, Michael Siegel, William J. Starke, Derek E. Williams
  • Publication number: 20110226443
    Abstract: The invention relates to fresh air ventilation devices adapted for use with air conditioners (ACs) and/or heaters. In operation, the device supplements the recirculating air of the AC/heater with fresh air drawn from outside of the building.
    Type: Application
    Filed: March 16, 2010
    Publication date: September 22, 2011
    Inventors: Moshe Michael SIEGEL, Fredric Nadel, Qianli Fu
  • Publication number: 20110120166
    Abstract: The present invention relates to cooling/heating units and their installation to wall or window openings, and more particularly pertains to a new and improved casing to secure the air conditioner while protecting against heat leakages through the casing itself. The wall casing is a cabinet structure containing a top side, a bottom side opposing the top side, and two opposing lateral sides being approximately orthogonal to the top and bottom sides. The top, bottom, and lateral sides forming substantially a box with the front and back opened. Each of the sides is double-walled and filled with an insulating material.
    Type: Application
    Filed: November 23, 2009
    Publication date: May 26, 2011
    Inventors: Fredric NADEL, Moshe Michael Siegel, Qianli Fu
  • Publication number: 20100297841
    Abstract: A system and method is disclosed for providing a redistribution metal layer in an integrated circuit. The redistribution metal layer is formed from the last metal layer in the integrated circuit during manufacture of the integrated circuit before final passivation is applied. The last metal layer provides sites for solder bump pads used in flip chip interconnection. The redistribution metal layer can be (1) a flat layer deposited over the next to last metal layer through an opening in a dielectric layer, or (2) deposited over an array of vias connected to the next to last metal layer. Space between the solder bump pads is deposited with narrower traces for connecting active circuit areas below. A final passivation layer is deposited to ensure product reliability.
    Type: Application
    Filed: July 30, 2010
    Publication date: November 25, 2010
    Inventors: Danielle A. Thomas, Harry Michael Siegel, Antonio A. Do Bento Vieira, Anthony M. Chiu
  • Publication number: 20100257316
    Abstract: A data processing system includes an interconnect fabric, a system memory coupled to the interconnect fabric and including a virtual barrier synchronization region allocated to storage of virtual barrier synchronization registers (VBSRs), and a plurality of processing units coupled to the interconnect fabric and operable to access the virtual barrier synchronization region. Each of the plurality of processing units includes a processor core and a cache memory including a cache controller and a cache array that caches VBSR lines from the virtual barrier synchronization region of the system memory. The cache controller of a first processing unit, responsive to a memory access request from its processor core that targets a first VBSR line, transfers responsibility for writing back to the virtual barrier synchronization region a second VBSR line contemporaneously held in the cache arrays of first, second and third processing units.
    Type: Application
    Filed: April 7, 2009
    Publication date: October 7, 2010
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Ravi K. Arimilli, Guy L. Guthrie, Michael Siegel, William J. Starke, Derek E. Williams
  • Patent number: 7786582
    Abstract: A system and method is disclosed for providing a redistribution metal layer in an integrated circuit. The redistribution metal layer is formed from the last metal layer in the integrated circuit during manufacture of the integrated circuit before final passivation is applied. The last metal layer provides sites for solder bump pads used in flip chip interconnection. The redistribution metal layer can be (1) a flat layer deposited over the next to last metal layer through an opening in a dielectric layer, or (2) deposited over an array of vias connected to the next to last metal layer. Space between the solder bump pads is deposited with narrower traces for connecting active circuit areas below. A final passivation layer is deposited to ensure product reliability.
    Type: Grant
    Filed: June 19, 2006
    Date of Patent: August 31, 2010
    Assignee: STMicroelectronics, Inc.
    Inventors: Danielle A. Thomas, Harry Michael Siegel, Antonio A. Do Bento Vieira, Anthony M. Chiu
  • Publication number: 20090320598
    Abstract: A method for testing the microstructure of a welded joint for interior damage due to material creepage, with the following steps is disclosed: creating at least one ultrasonic surface wave by a first test head, receiving of the ultrasonic surface wave by a second test head, determining the acoustic properties within the structural conditions on the basis of the relation between a created and received ultrasonic surface wave, and determining the degree of damage of the interior structural conditions on the basis of the acoustic properties ascertained.
    Type: Application
    Filed: August 2, 2007
    Publication date: December 31, 2009
    Inventors: Korbinian Puchner, Michael Siegel
  • Patent number: 7595017
    Abstract: A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding compound. A film of compliant material is pre-formed to conform the shape of the film to a mold cavity surface of the transfer mold. The pre-formed film is then placed adjacent to the surfaces of the mold cavity of the transfer mold. The mold cavity is filled with molding compound and the integrated circuit is encapsulated. The pre-formation of the film allows materials to be used that are not suitable for use with prior art methods.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: September 29, 2009
    Assignee: STMicroelectronics, Inc.
    Inventors: Harry Michael Siegel, Anthony M. Chiu
  • Publication number: 20090083128
    Abstract: Systems, methods and computer readable media that assist in evaluating the likelihood of success of a new business location. Information about existing business locations may be provided, which includes information about a predicted variable. Data may be collected from either third-party providers, publically available information, or the user that will represent the evaluation variables. A formula is generated that comprises evaluation variables and associated coefficients. The coefficients are determined based on a correlation between the evaluation variables and the predicted variable. Data is collected for a new business location or region in order to determine the value of the evaluation variables for the new business location or region. By applying the coefficients to the evaluation variable values for the new business location or region, an output value of the predicted variable is provided.
    Type: Application
    Filed: August 1, 2008
    Publication date: March 26, 2009
    Applicant: Introspective Solutions, LLC
    Inventor: Jason Michael Siegel
  • Patent number: 7456050
    Abstract: A system and method is disclosed for controlling a height and a planarity of an integrated circuit die. In one advantageous embodiment of the invention, a plurality of patterned metal stops are fabricated on an integrated circuit substrate and covered with die attach material. An integrated circuit die is inserted into the die attach material and placed into a clamping mechanism of a molding machine. The clamping mechanism (1) compresses the die into the die attach material, (2) rotates the die into parallel alignment with the substrate, and (3) pushes the die into contact with the patterned metal stops. In this manner the die height and the die planarity are precisely controlled.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: November 25, 2008
    Assignee: STMicroelectronics, Inc.
    Inventors: Harry Michael Siegel, Robert Henry Bond, Tom Quoc Lao
  • Publication number: 20080063009
    Abstract: A method, apparatus and computer program product are provided for implementing a pointer and stake model for frame alteration code in a network processor. A current pointer and a stake are provided for a packet selected for transmit. The current pointer is maintained for tracking a current position for frame alteration operations in the packet. The stake is maintained for tracking a start of a current header for frame alteration operations in the packet. The current pointer is used by frame alteration code instructions to specify a sequence of operations relative to the current pointer. The specified frame alteration sequence is compact in terms of code size to operate on data within a small window of bytes. Advance pointer instructions allow the current and stake pointers to be advanced an arbitrary number of bytes into the packet.
    Type: Application
    Filed: November 5, 2007
    Publication date: March 13, 2008
    Applicant: International Business Machines
    Inventors: Kerry Imming, John Irish, Joseph Logan, Tolga Ozguner, Michael Siegel
  • Publication number: 20080031256
    Abstract: A system that indicates which frame should next be removed by a scheduler from flow queues within a network device, such as a router, network processor, and like devices is disclosed. The system includes a search engine that searches a set of calendars under the control of a Finite State Machine (FSM), a current pointer, and input signals from an array and a clock line providing current time. Also included is a decision block that determines which of the searches are critical and which, during peak calendar search periods, can be postponed with minimal impact to the system. The postponed searches are then conducted at a time when there is available calendar search capacity.
    Type: Application
    Filed: October 9, 2007
    Publication date: February 7, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Bryan Bullis, Darryl Rumph, Michael Siegel
  • Publication number: 20070179368
    Abstract: The present invention, in one aspect, relates to a method for examining a target for tumors or lesions using what is referred to as “Early Increase in microvascular Blood Supply” (EIBS) that exists in tissues that are close to, but are not themselves, the abnormal tissue and in tissues that precede the development of such lesions or tumors. While the abnormal tissue can be a lesion or tumor, the abnormal tissue can also be tissue that precedes formation of a lesion or tumor, such as a precancerous adenoma, aberrant crypt foci, tissues that precede the development of dysplastic lesions that themselves do not yet exhibit dysplastic phenotype, and tissues in the vicinity of these lesions or pre-dysplastic tissues.
    Type: Application
    Filed: November 27, 2006
    Publication date: August 2, 2007
    Applicants: Northwestern University, Evanston Northwestern Healthcare
    Inventors: Vadim Backman, Hemant Roy, Ramesh Wali, Young Kim, Michael Siegel, Vladimir Turzhitsky