Patents by Inventor Michael A. Tischler

Michael A. Tischler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Control of luminous intensity distribution from an array of point light sources
    Patent number: 8746923
    Abstract: In various embodiments, a lens array comprises a plurality of aspheric lens elements each optically coupled to a light-emitting element and producing an out-of-focus image thereof. The images combine to generate a target luminous intensity distribution, e.g., providing constant illuminance on a plane.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: June 10, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Ian Ashdown, Michael A. Tischler
  • Light-emitting dies incorporating wavelength-conversion materials and related methods
    Patent number: 8748929
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: June 10, 2014
    Assignee: Cooledge Lighting Inc.
    Inventor: Michael A. Tischler
  • Engineered-phosphor LED packages and related methods
    Patent number: 8722439
    Abstract: In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: May 13, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Ian Ashdown
  • Wiring boards for array-based electronic devices
    Patent number: 8704448
    Abstract: In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: April 22, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Paul Palfreyman, Philippe M. Schick, Paul Jungwirth
  • Engineered-phosphor LED packages and related methods
    Patent number: 8686625
    Abstract: In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence.
    Type: Grant
    Filed: April 16, 2013
    Date of Patent: April 1, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Ian Ashdown, Michael A. Tischler, Philippe M. Schick, Tom Pinnington, Henry Ip
  • Light-emitting dies incorporating wavelength-conversion materials and related methods
    Patent number: 8680558
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: March 25, 2014
    Assignee: Cooledge Lighting Inc.
    Inventor: Michael A. Tischler
  • Electronic devices with yielding substrates
    Patent number: 8680567
    Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: March 25, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS
    Publication number: 20140077686
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Application
    Filed: November 20, 2013
    Publication date: March 20, 2014
    Inventor: Michael A. Tischler
  • WIRING BOARDS FOR ARRAY-BASED ELECTRONIC DEVICES
    Publication number: 20140062318
    Abstract: In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
    Type: Application
    Filed: March 13, 2013
    Publication date: March 6, 2014
    Inventors: Michael A. Tischler, Paul Jungwirth
  • WIRING BOARDS FOR ARRAY-BASED ELECTRONIC DEVICES
    Publication number: 20140062315
    Abstract: In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
    Type: Application
    Filed: April 5, 2013
    Publication date: March 6, 2014
    Inventors: Michael A. Tischler, Paul Jungwirth
  • WIRING BOARDS FOR ARRAY-BASED ELECTRONIC DEVICES
    Publication number: 20140062316
    Abstract: In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
    Type: Application
    Filed: August 19, 2013
    Publication date: March 6, 2014
    Inventors: Michael A. Tischler, Paul Palfreyman, Philippe M. Schick, Paul Jungwirth
  • FAILURE MITIGATION IN ARRAYS OF LIGHT-EMITTING DEVICES
    Publication number: 20140062302
    Abstract: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.
    Type: Application
    Filed: September 25, 2013
    Publication date: March 6, 2014
    Inventors: Michael A. Tischler, Philippe M. Schick, Paul Jungwirth, Calvin Wade Sheen
  • LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS
    Publication number: 20140061705
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Application
    Filed: September 30, 2013
    Publication date: March 6, 2014
    Inventor: Michael A. Tischler
  • Solid state white light emitter and display using same
    Patent number: 8659034
    Abstract: A light emitting assembly comprising a solid state device coupleable with a power supply constructed and arranged to power the solid state device to emit from the solid state device a first, relatively shorter wavelength radiation, and a down-converting luminophoric medium arranged in receiving relationship to said first, relatively shorter wavelength radiation, and which in exposure to said first, relatively shorter wavelength radiation, is excited to responsively emit second, relatively longer wavelength radiation. In a specific embodiment, monochromatic blue or UV light output from a light-emitting diode is down-converted to white light by packaging the diode with fluorescent organic and/or inorganic fluorescers and phosphors in a polymeric matrix.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: February 25, 2014
    Assignee: Cree, Inc.
    Inventors: Bruce Baretz, Michael A. Tischler
  • Engineered-phosphor LED packages and related methods
    Patent number: 8659043
    Abstract: In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: February 25, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Ian Ashdown
  • Failure mitigation in arrays of light-emitting devices
    Patent number: 8653539
    Abstract: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.
    Type: Grant
    Filed: July 15, 2011
    Date of Patent: February 18, 2014
    Assignee: Cooledge Lighting, Inc.
    Inventors: Michael Tischler, Philippe Schick, Calvin Wade Sheen, Paul Jungwirth
  • ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
    Publication number: 20140034960
    Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
    Type: Application
    Filed: August 30, 2013
    Publication date: February 6, 2014
    Inventors: Michael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • Light-emitting dies incorporating wavelength-conversion materials and related methods
    Patent number: 8629475
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Grant
    Filed: February 15, 2013
    Date of Patent: January 14, 2014
    Assignee: Cooledge Lighting Inc.
    Inventor: Michael A. Tischler
  • METHODS OF FABRICATING WAFER-LEVEL FLIP CHIP DEVICE PACKAGES
    Publication number: 20130330853
    Abstract: In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon.
    Type: Application
    Filed: March 4, 2013
    Publication date: December 12, 2013
    Inventor: Michael A. Tischler
  • WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS
    Publication number: 20130328172
    Abstract: In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon.
    Type: Application
    Filed: March 4, 2013
    Publication date: December 12, 2013
    Inventor: Michael A. Tischler