Patents by Inventor Michael A. Tischler

Michael A. Tischler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ENGINEERED-PHOSPHOR LED PACKAGES AND RELATED METHODS
    Publication number: 20140264409
    Abstract: In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Inventors: Ian Ashdown, Michael A. Tischler, Philippe M. Schick, Tom Pinnington, Henry Ip
  • ENGINEERED-PHOSPHOR LED PACKAGES AND RELATED METHODS
    Publication number: 20140264404
    Abstract: In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence.
    Type: Application
    Filed: February 20, 2014
    Publication date: September 18, 2014
    Inventors: Ian Ashdown, Michael A. Tischler, Philippe M. Schick, Tom Pinnington, Henry Ip
  • STRESS RELIEF FOR ARRAY-BASED ELECTRONIC DEVICES
    Publication number: 20140264407
    Abstract: In accordance with certain embodiments, an electric device includes a flexible substrate having first and second conductive traces on a first surface thereof and separated by a gap therebetween, an electronic component spanning the gap, and a stiffener configured to substantially prevent flexing of the substrate proximate the gap during flexing of the substrate.
    Type: Application
    Filed: August 12, 2013
    Publication date: September 18, 2014
    Inventors: Michael A. Tischler, Paul Palfreyman, Philippe M. Schick
  • Formation of uniform phosphor regions for broad-area lighting systems
    Patent number: 8828759
    Abstract: In accordance with certain embodiments, phosphor arrangements are formed via adhering phosphors to activated regions on a substrate and transferring them to a different substrate.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: September 9, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Calvin W. Sheen
  • POLYMERIC BINDERS INCORPORATING LIGHT-DETECTING ELEMENTS AND RELATED METHODS
    Publication number: 20140246747
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Application
    Filed: March 25, 2014
    Publication date: September 4, 2014
    Inventor: Michael A. Tischler
  • ENGINEERED-PHOSPHOR LED PACKAGES AND RELATED METHODS
    Publication number: 20140231848
    Abstract: In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies.
    Type: Application
    Filed: October 11, 2013
    Publication date: August 21, 2014
    Inventors: Michael A. Tischler, Ian Ashdown
  • ENGINEERED-PHOSPHOR LED PACKAGES AND RELATED METHODS
    Publication number: 20140231850
    Abstract: In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies.
    Type: Application
    Filed: January 28, 2014
    Publication date: August 21, 2014
    Inventors: Michael A. Tischler, Ian Ashdown, Tom Pinnington, Henry Ip
  • DISCRETE PHOSPHOR CHIPS FOR LIGHT-EMITTING DEVICES AND RELATED METHODS
    Publication number: 20140227812
    Abstract: In accordance with certain embodiments, phosphor chips are formed and subsequently attached to light-emitting elements.
    Type: Application
    Filed: February 14, 2014
    Publication date: August 14, 2014
    Inventor: Michael A. Tischler
  • CONTROL OF LUMINOUS INTENSITY DISTRIBUTION FROM AN ARRAY OF POINT LIGHT SOURCES
    Publication number: 20140218915
    Abstract: In various embodiments, a lens array comprises a plurality of aspheric lens elements each optically coupled to a light-emitting element and producing an out-of-focus image thereof. The images combine to generate a target luminous intensity distribution, e.g., providing constant illuminance on a plane.
    Type: Application
    Filed: March 6, 2014
    Publication date: August 7, 2014
    Inventors: Ian Ashdown, Michael A. Tischler
  • LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS
    Publication number: 20140203308
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Application
    Filed: March 24, 2014
    Publication date: July 24, 2014
    Inventor: Michael A. Tischler
  • Light-emitting dies incorporating wavelength-conversion materials and related methods
    Patent number: 8785960
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: July 22, 2014
    Assignee: Cooledge Lighting Inc.
    Inventor: Michael A. Tischler
  • Wiring boards for array-based electronic devices
    Patent number: 8786200
    Abstract: In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
    Type: Grant
    Filed: April 5, 2013
    Date of Patent: July 22, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Paul Jungwirth
  • ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
    Publication number: 20140191257
    Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
    Type: Application
    Filed: January 31, 2014
    Publication date: July 10, 2014
    Inventors: Michael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • Engineered-phosphor LED packages and related methods
    Patent number: 8766527
    Abstract: A light-emitting device includes a light-emitting die and, at least partially surrounding the light-emitting die, a phosphor element comprising (i) a binder and (ii) disposed within the binder, one or more wavelength-conversion materials for absorbing at least a portion of light emitted from the light-emitting die and emitting converted light having a different wavelength. The phosphor element has an outer contour having (i) a curved region that defines only a portion of a hemisphere having a hemisphere radius, and (ii) a base opposite the curved region having a non-zero centroid z-offset within the hemisphere, a ratio of the centroid z-offset to the hemisphere radius having a value ranging from 0.3 to 0.8.
    Type: Grant
    Filed: November 25, 2013
    Date of Patent: July 1, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Ian Ashdown, Michael A. Tischler, Philippe M. Schick, Tom Pinnington, Henry Ip
  • WIRING BOARDS FOR ARRAY-BASED ELECTRONIC DEVICES
    Publication number: 20140175993
    Abstract: In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
    Type: Application
    Filed: March 3, 2014
    Publication date: June 26, 2014
    Inventors: Michael A. Tischler, Paul Palfreyman, Philippe M. Schick, Paul Jungwirth
  • WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS
    Publication number: 20140175481
    Abstract: In accordance with certain embodiments, semiconductor dies are at least partially coated with a polymer and a conductive adhesive prior being bonded to a substrate having electrical traces thereon.
    Type: Application
    Filed: July 24, 2013
    Publication date: June 26, 2014
    Inventor: Michael A. Tischler
  • Illumination device control systems and methods
    Patent number: 8760075
    Abstract: In various embodiments, a control system for an electronic circuit iteratively applies voltage to and senses current from a load to regulate operation of the load.
    Type: Grant
    Filed: August 13, 2013
    Date of Patent: June 24, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, William P. Coetzee, Paul Jungwirth
  • Light-emitting dies incorporating wavelength-conversion materials and related methods
    Patent number: 8759125
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Grant
    Filed: January 24, 2013
    Date of Patent: June 24, 2014
    Assignee: Cooledge Lighting Inc.
    Inventor: Michael A. Tischler
  • LIGHT-EMITTING ELEMENT REPAIR IN ARRAY-BASED LIGHTING DEVICES
    Publication number: 20140167611
    Abstract: In accordance with certain embodiments, patches with replacement light-emitting elements thereon are utilized to repair lighting-system fault locations.
    Type: Application
    Filed: August 15, 2013
    Publication date: June 19, 2014
    Inventors: Michael A. Tischler, Tom Pinnington, Philippe M. Schick, Paul Jungwirth
  • Engineered-phosphor LED package and related methods
    Patent number: 8754435
    Abstract: In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies.
    Type: Grant
    Filed: February 19, 2013
    Date of Patent: June 17, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Ian Ashdown