Patents by Inventor Michael A. Tischler

Michael A. Tischler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stress relief for array-based electronic devices
    Patent number: 8928014
    Abstract: In accordance with certain embodiments, an electric device includes a flexible substrate having first and second conductive traces on a first surface thereof and separated by a gap therebetween, an electronic component spanning the gap, and a stiffener configured to substantially prevent flexing of the substrate proximate the gap during flexing of the substrate.
    Type: Grant
    Filed: August 12, 2013
    Date of Patent: January 6, 2015
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Paul Palfreyman, Philippe M. Schick
  • FORMATION OF PHOSPHOR REGIONS FOR BROAD-AREA LIGHTING SYSTEMS
    Publication number: 20150000120
    Abstract: In accordance with certain embodiments, phosphor arrangements are formed via adhering phosphors to activated regions on a substrate and transferring them to a different substrate.
    Type: Application
    Filed: August 7, 2014
    Publication date: January 1, 2015
    Inventors: Michael A. Tischler, Calvin W. Sheen
  • ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
    Publication number: 20150001465
    Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
    Type: Application
    Filed: August 11, 2014
    Publication date: January 1, 2015
    Inventors: Michael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • High efficiency LEDS and LED lamps
    Patent number: 8921134
    Abstract: In various embodiments, lighting systems include an electrically insulating carrier having a plurality of conductive elements disposed thereon, a light-emitting array, and at least one power source. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting strings, each light-emitting string comprising a plurality of light-emitting diodes (LEDs) electrically connected in series. Each LED has at least two electrical contacts, and each electrical contact is electrically connected to a conductive element by a solder. The power source provides power to the light-emitting strings.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: December 30, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Vladimir Odnoblyudov, David Keogh
  • PORTABLE LIGHTING SYSTEMS INCORPORATING DEFORMABLE LIGHT SHEETS
    Publication number: 20140369033
    Abstract: In accordance with certain embodiments, illumination systems include a flexible light sheet that may be wound within and unwound from, or folded within and unfolded from, a storage unit having a power source for powering light-emitting elements on the light sheet.
    Type: Application
    Filed: June 6, 2014
    Publication date: December 18, 2014
    Inventors: Paul Palfreyman, Michael A. Tischler
  • LIGHTING SYSTEMS INCORPORATING FLEXIBLE LIGHT SHEETS DEFORMABLE TO PRODUCE DESIRED LIGHT DISTRIBUTIONS
    Publication number: 20140369038
    Abstract: In accordance with certain embodiments, lighting systems include flexible light sheets having light-emitting elements with first luminous intensity distributions disposed thereover, and the light sheets are curved or folded to produce a second luminous intensity distribution different from the first luminous intensity distribution.
    Type: Application
    Filed: June 12, 2014
    Publication date: December 18, 2014
    Inventors: Michael A. Tischler, Paul Palfreyman, Calvin Wade Sheen
  • SEALED AND SEALABLE LIGHTING SYSTEMS INCORPORATING FLEXIBLE LIGHT SHEETS AND RELATED METHODS
    Publication number: 20140362566
    Abstract: In accordance with certain embodiments, lighting systems include flexible light sheets and one or more sealed regions containing light-emitting elements, the sealed regions defined by seals between a top housing and a bottom housing and/or the light sheet.
    Type: Application
    Filed: June 11, 2014
    Publication date: December 11, 2014
    Inventors: Michael A. Tischler, Paul Palfreyman
  • Light-emitting dies incorporating wavelength-conversion materials and related methods
    Patent number: 8907362
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: December 9, 2014
    Assignee: Cooledge Lighting Inc.
    Inventor: Michael A. Tischler
  • Electronic devices with yielding substrates
    Patent number: 8907370
    Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
    Type: Grant
    Filed: January 31, 2014
    Date of Patent: December 9, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Philippe M. Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • Wafer-level flip chip device packages and related methods
    Patent number: 8896010
    Abstract: In accordance with certain embodiments, semiconductor dies are at least partially coated with a polymer and a conductive adhesive prior being bonded to a substrate having electrical traces thereon.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: November 25, 2014
    Assignee: Cooledge Lighting Inc.
    Inventor: Michael A. Tischler
  • Polymeric binders incorporating light-detecting elements and related methods
    Patent number: 8884326
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: November 11, 2014
    Assignee: Cooledge Lighting Inc.
    Inventor: Michael A. Tischler
  • Wiring boards for array-based electronic devices
    Patent number: 8884534
    Abstract: In accordance with certain embodiments, lighting systems include one or more lightsheets each including a plurality of strings of light-emitting elements, control elements, and power conductors for supplying power to the light-emitting elements and control elements.
    Type: Grant
    Filed: March 3, 2014
    Date of Patent: November 11, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Paul Palfreyman, Philippe M. Schick, Paul Jungwirth
  • Methods of fabricating wafer-level flip chip device packages
    Patent number: 8877561
    Abstract: In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: November 4, 2014
    Assignee: Cooledge Lighting Inc.
    Inventor: Michael A. Tischler
  • LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS
    Publication number: 20140319560
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Application
    Filed: July 24, 2013
    Publication date: October 30, 2014
    Inventor: Michael A. Tischler
  • ILLUMINATION DEVICE CONTROL SYSTEMS AND METHODS
    Publication number: 20140312788
    Abstract: In various embodiments, a control system for an electronic circuit iteratively applies voltage to and senses current from a load to regulate operation of the load.
    Type: Application
    Filed: May 7, 2014
    Publication date: October 23, 2014
    Inventors: Michael A. Tischler, William P. Coetzee, Paul Jungwirth
  • Solid state white light emitter and display using same
    Patent number: 8860058
    Abstract: A light emitting assembly comprising a solid state device coupleable with a power supply constructed and arranged to power the solid state device to emit from the solid state device a first, relatively shorter wavelength radiation, and a down-converting luminophoric medium arranged in receiving relationship to said first, relatively shorter wavelength radiation, and which in exposure to said first, relatively shorter wavelength radiation, is excited to responsively emit second, relatively longer wavelength radiation. In a specific embodiment, monochromatic blue or UV light output from a light-emitting diode is down-converted to white light by packaging the diode with fluorescent organic and/or inorganic fluorescers and phosphors in a polymeric matrix.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: October 14, 2014
    Assignee: Cree, Inc.
    Inventors: Bruce Baretz, Michael A. Tischler
  • Failure mitigation in arrays of light-emitting devices
    Patent number: 8860318
    Abstract: In accordance with certain embodiments, an illumination system comprising a plurality of power strings features elements facilitating compensation for failure of one or more light-emitting elements connected along each power string.
    Type: Grant
    Filed: September 25, 2013
    Date of Patent: October 14, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Philippe M. Schick, Paul Jungwirth, Calvin Wade Sheen
  • Engineered-phosphor LED packages and related methods
    Patent number: 8853729
    Abstract: In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: October 7, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Michael A. Tischler, Ian Ashdown
  • Light-emitting devices having engineered phosphor elements
    Patent number: 8847261
    Abstract: A light-emitting device includes a light-emitting die and, at least partially surrounding the light-emitting die, a phosphor element comprising (i) a binder and (ii) disposed within the binder, one or more wavelength-conversion materials for absorbing at least a portion of light emitted from the light-emitting die and emitting converted light having a different wavelength. The phosphor element has an outer contour having (i) a curved region that defines only a portion of a hemisphere having a hemisphere radius, and (ii) a base opposite the curved region having a positive non-zero centroid z-offset within the hemisphere.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: September 30, 2014
    Assignee: Cooledge Lighting Inc.
    Inventors: Ian Ashdown, Michael A. Tischler, Philippe M. Schick, Tom Pinnington, Henry Ip
  • THERMAL MANAGEMENT IN ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
    Publication number: 20140264427
    Abstract: In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Inventor: Michael A. Tischler