Patents by Inventor Michael A. Tischler

Michael A. Tischler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FORMATION OF UNIFORM PHOSPHOR REGIONS FOR BROAD-AREA LIGHTING SYSTEMS
    Publication number: 20160240749
    Abstract: In accordance with certain embodiments, phosphor arrangements are formed via adhering phosphors to activated regions on a substrate and transferring them to a different substrate.
    Type: Application
    Filed: April 27, 2016
    Publication date: August 18, 2016
    Inventors: Michael A. Tischler, Calvin W. Sheen
  • Modular LED lighting systems
    Patent number: 9410683
    Abstract: In accordance with various embodiments, a modular lighting system features multiple light panels each having multiple light-emitting elements thereon, as well as connectors for electrically and mechanically interconnecting the light panels.
    Type: Grant
    Filed: May 15, 2015
    Date of Patent: August 9, 2016
    Assignee: Cooledge Lighting, Inc.
    Inventors: Michael A. Tischler, Paul Palfreyman
  • LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS
    Publication number: 20160225960
    Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
    Type: Application
    Filed: April 12, 2016
    Publication date: August 4, 2016
    Inventors: Michael A. TISCHLER, Alborz AMINI, Thomas PINNINGTON, Henry IP, Gianmarco SPIGA
  • SYSTEMS FOR ADHESIVE BONDING OF ELECTRONIC DEVICES
    Publication number: 20160218025
    Abstract: In accordance with certain embodiments, an apparatus for bonding electronic components such as light-emitting elements each to a connection point on a substrate via an adhesive includes a platform for supporting the substrate, a membrane for covering the electronic components, a source of pressure for urging the membrane against the electronic components, whereby pressure is applied between each electronic component and its corresponding connection point, and a source of energy for at least partially curing the adhesive.
    Type: Application
    Filed: January 26, 2016
    Publication date: July 28, 2016
    Inventors: Michael A. TISCHLER, Alborz AMINI
  • SYSTEMS AND METHODS FOR RECYCLING ELECTRONIC SYSTEMS
    Publication number: 20160219763
    Abstract: In accordance with certain embodiments, devices are recycled by removing one or more electronic components from a portion of the device and urging one or more regions of the portion of the device toward an abrasion head. The abrasion head mechanically removes at least a portion of patternable material in each of the one or more regions. The steps are repeated for subsequent portions of the device.
    Type: Application
    Filed: January 25, 2016
    Publication date: July 28, 2016
    Inventors: Michael A. TISCHLER, Calvin Wade SHEEN
  • METHODS FOR ADHESIVE BONDING OF ELECTRONIC DEVICES
    Publication number: 20160218264
    Abstract: In accordance with certain embodiments, electronic components such as light-emitting elements are bonded to connection points on a substrate via pressure applied via a membrane and curing of a pressure-activated adhesive.
    Type: Application
    Filed: January 26, 2016
    Publication date: July 28, 2016
    Inventors: Michael A. Tischler, Alborz Amini
  • SYSTEMS AND METHODS FOR PATTERNING COMPOSITE MATERIALS AND FABRICATING ILLUMINATION SYSTEMS
    Publication number: 20160219722
    Abstract: In accordance with certain embodiments, patterns are formed in composite materials by selectively urging one or more regions of the composite material toward an abrasion head, whereby the abrasion head mechanically removes portions of a patternable material from the composite material in each region.
    Type: Application
    Filed: January 25, 2016
    Publication date: July 28, 2016
    Inventors: Michael A. TISCHLER, Calvin Wade SHEEN
  • HIGH EFFICIENCY LEDS AND LED LAMPS
    Publication number: 20160218144
    Abstract: In various embodiments, lighting systems include an electrically insulating carrier having a plurality of conductive elements disposed thereon and a light-emitting array. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting diodes (LEDs) that are interconnected in parallel in a first direction and interconnected in series in a second direction different from the first direction.
    Type: Application
    Filed: April 1, 2016
    Publication date: July 28, 2016
    Inventors: Michael A. TISCHLER, Vladimir ODNOBLYUDOV, David KEOGH
  • THERMAL MANAGEMENT IN ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
    Publication number: 20160204324
    Abstract: In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.
    Type: Application
    Filed: March 22, 2016
    Publication date: July 14, 2016
    Inventor: Michael A. Tischler
  • SYSTEMS FOR UNIFORM LED LIGHTING
    Publication number: 20160195240
    Abstract: In accordance with certain embodiments, groups of light-emitting elements having different distributions in one or more optical characteristics are utilized to provide direct and indirect illumination.
    Type: Application
    Filed: January 5, 2016
    Publication date: July 7, 2016
    Inventors: Ricardo A. PELEJO, Michael A. TISCHLER
  • METHODS FOR UNIFORM LED LIGHTING
    Publication number: 20160195251
    Abstract: In accordance with certain embodiments, a substrate having first and second groups of light-emitting elements having different distributions in one or more optical characteristics thereon is deformed such that the first and second groups of light-emitting elements are not simultaneously observable.
    Type: Application
    Filed: January 5, 2016
    Publication date: July 7, 2016
    Inventors: Ricardo A. PELEJO, Michael A. TISCHLER
  • ILLUMINATION DEVICE CONTROL SYSTEMS AND METHODS
    Publication number: 20160190927
    Abstract: In various embodiments, a control system for an electronic circuit iteratively applies voltage to and senses current from a load to regulate operation of the load.
    Type: Application
    Filed: December 21, 2015
    Publication date: June 30, 2016
    Inventors: Michael A. Tischler, William P. Coetzee, Paul Jungwirth
  • ILLUMINATION DEVICE CONTROL SYSTEMS AND METHODS
    Publication number: 20160192448
    Abstract: In various embodiments, a control system for an electronic circuit iteratively applies voltage to and senses current from a load to regulate operation of the load.
    Type: Application
    Filed: December 21, 2015
    Publication date: June 30, 2016
    Inventors: Michael A. TISCHLER, William P. COETZEE, Paul JUNGWIRTH
  • AUTOMATED TEST SYSTEMS AND METHODS FOR LIGHT-EMITTING ARRAYS
    Publication number: 20160161294
    Abstract: In accordance with certain embodiments, multiple light-emitting elements of a light-emitting device are tested via imaging and image analysis.
    Type: Application
    Filed: November 23, 2015
    Publication date: June 9, 2016
    Inventors: Henry IP, Michael A. TISCHLER, Chi Wai HO
  • Light-emitting dies incorporating wavelength-conversion materials and related methods
    Patent number: 9343444
    Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
    Type: Grant
    Filed: March 18, 2015
    Date of Patent: May 17, 2016
    Assignee: Cooledge Lighting, Inc.
    Inventors: Michael A. Tischler, Alborz Amini, Thomas Pinnington, Henry Ip, Gianmarco Spiga
  • Light-emitting dies incorporating wavelength-conversion materials and related methods
    Patent number: 9343443
    Abstract: In accordance with certain embodiments, electronic devices feature a polymeric binder, a frame defining an aperture therethrough, and a semiconductor die (e.g., a light-emitting or a light-detecting element) suspended in the binder and within the aperture of the frame.
    Type: Grant
    Filed: January 30, 2015
    Date of Patent: May 17, 2016
    Assignee: Cooledge Lighting, Inc.
    Inventors: Michael A. Tischler, Alborz Amini, Thomas Pinnington, Henry Ip, Gianmarco Spiga
  • Thermal management in electronic devices with yielding substrates
    Patent number: 9324930
    Abstract: In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: April 26, 2016
    Assignee: Cooledge Lighting, Inc.
    Inventor: Michael A. Tischler
  • ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
    Publication number: 20160113087
    Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
    Type: Application
    Filed: December 21, 2015
    Publication date: April 21, 2016
    Inventors: Michael A. TISCHLER, Philippe M. SCHICK, Ian ASHDOWN, Calvin Wade SHEEN, Paul JUNGWIRTH
  • ENGINEERED-PHOSPHOR LED PACKAGES AND RELATED METHODS
    Publication number: 20160104823
    Abstract: In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence.
    Type: Application
    Filed: December 16, 2015
    Publication date: April 14, 2016
    Inventors: Tom PINNINGTON, Henry IP, Michael A. TISCHLER, Ian ASHDOWN, Philippe M. SCHICK
  • LIGHT-EMITTING DIES INCORPORATING WAVELENGTH-CONVERSION MATERIALS AND RELATED METHODS
    Publication number: 20160099389
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Application
    Filed: October 9, 2015
    Publication date: April 7, 2016
    Inventor: Michael A. Tischler