Patents by Inventor Michael A. Tischler

Michael A. Tischler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS
    Publication number: 20160087179
    Abstract: In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon.
    Type: Application
    Filed: November 25, 2015
    Publication date: March 24, 2016
    Inventor: Michael A. TISCHLER
  • WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS
    Publication number: 20160087180
    Abstract: In accordance with certain embodiments, semiconductor dies are at least partially coated with a polymer and a conductive adhesive prior being bonded to a substrate having electrical traces thereon.
    Type: Application
    Filed: November 30, 2015
    Publication date: March 24, 2016
    Inventor: Michael A. TISCHLER
  • STRESS RELIEF FOR ARRAY-BASED ELECTRONIC DEVICES
    Publication number: 20160079212
    Abstract: In accordance with certain embodiments, an electric device includes a flexible substrate having first and second conductive traces on a first surface thereof and separated by a gap therebetween, an electronic component spanning the gap, and a stiffener configured to substantially prevent flexing of the substrate proximate the gap during flexing of the substrate.
    Type: Application
    Filed: November 23, 2015
    Publication date: March 17, 2016
    Inventors: Michael A. TISCHLER, Paul PALFREYMAN, Philippe M. SCHICK
  • Light-emitting dies incorporating wavelength-conversion materials and related methods
    Patent number: 9276178
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Grant
    Filed: February 17, 2015
    Date of Patent: March 1, 2016
    Assignee: Cooledge Lighting, Inc.
    Inventor: Michael A. Tischler
  • Non-linear system control methods
    Patent number: 9270169
    Abstract: In various embodiments, a control system for an electronic circuit iteratively applies voltage to and senses current from a load to regulate operation of the load.
    Type: Grant
    Filed: November 11, 2014
    Date of Patent: February 23, 2016
    Assignee: Cooledge Lighting, Inc.
    Inventors: Michael A. Tischler, William P. Coetzee, Paul Jungwirth
  • Electronic devices with yielding substrates
    Patent number: 9252373
    Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
    Type: Grant
    Filed: May 5, 2015
    Date of Patent: February 2, 2016
    Assignee: Cooledge Lighting, Inc.
    Inventors: Michael A. Tischler, Philippe Schick, Ian Ashdown, Calvin Wade Sheen, Paul Jungwirth
  • Illumination device control systems and methods
    Patent number: 9252662
    Abstract: In various embodiments, a control system for an electronic circuit iteratively applies voltage to and senses current from a load to regulate operation of the load.
    Type: Grant
    Filed: June 16, 2015
    Date of Patent: February 2, 2016
    Assignee: Cooledge Lighting, Inc.
    Inventors: Michael A. Tischler, William P. Coetzee, Paul Jungwirth
  • LED LIGHTING SYSTEM INCORPORATING FOLDED LIGHT SHEETS
    Publication number: 20160025311
    Abstract: In accordance with certain embodiments, flexible light sheets are folded to define first and second portions of the light sheet divided by the fold, and the first and second portions of the light sheet may both feature light-emitting elements thereon.
    Type: Application
    Filed: July 28, 2015
    Publication date: January 28, 2016
    Inventor: Michael A. Tischler
  • Engineered-phosphor LED packages and related methods
    Patent number: 9246070
    Abstract: In accordance with certain embodiments, a phosphor element at least partially surrounding a light-emitting die is shaped to influence color-temperature divergence.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: January 26, 2016
    Assignee: Cooledge Lighting, Inc.
    Inventors: Tom Pinnington, Henry Ip, Michael A. Tischler, Ian Ashdown, Philippe M. Schick
  • HIGH EFFICIENCY LEDS AND LED LAMPS
    Publication number: 20160010805
    Abstract: In various embodiments, lighting systems include an electrically insulating carrier having a plurality of conductive elements disposed thereon, a light-emitting array, and at least one power source. The light-emitting array is disposed over the carrier and includes a plurality of light-emitting strings, each light-emitting string comprising a plurality of electrically connected light-emitting diodes (LEDs). Each LED has at least two electrical contacts, and each electrical contact is electrically connected to a conductive element. The power source provides power to the light-emitting strings.
    Type: Application
    Filed: September 22, 2015
    Publication date: January 14, 2016
    Inventors: Michael A. Tischler, Vladimir Odnoblyudov, David Keogh
  • Wafer-level flip chip device packages and related methods
    Patent number: 9236502
    Abstract: In accordance with certain embodiments, semiconductor dies are at least partially coated with a polymer and a conductive adhesive prior being bonded to a substrate having electrical traces thereon.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: January 12, 2016
    Assignee: Cooledge Lighting, Inc.
    Inventor: Michael A. Tischler
  • Wafer-level flip chip device packages and related methods
    Patent number: 9231178
    Abstract: In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: January 5, 2016
    Assignee: Cooledge Lighting, Inc.
    Inventor: Michael A. Tischler
  • Broad-area lighting systems
    Patent number: 9222648
    Abstract: In accordance with certain embodiments, thermal stresses are mitigated in illumination systems by mating optical substrates with a plurality of discrete substrates each having one or more light-emitting elements thereon.
    Type: Grant
    Filed: October 31, 2012
    Date of Patent: December 29, 2015
    Assignee: Cooledge Lighting, Inc.
    Inventors: Philippe M. Schick, Michael A. Tischler
  • Stress relief for array-based electronic devices
    Patent number: 9224934
    Abstract: In accordance with certain embodiments, an electric device includes a flexible substrate having first and second conductive traces on a first surface thereof and separated by a gap therebetween, an electronic component spanning the gap, and a stiffener configured to substantially prevent flexing of the substrate proximate the gap during flexing of the substrate.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: December 29, 2015
    Assignee: Cooledge Lighting, Inc.
    Inventors: Michael A. Tischler, Paul Palfreyman, Philippe M. Schick
  • Methods of fabricating wafer-level flip chip device packages
    Patent number: 9214615
    Abstract: In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon.
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: December 15, 2015
    Assignee: Cooledge Lighting Inc.
    Inventor: Michael A. Tischler
  • ENGINEERED-PHOSPHOR LED PACKAGES AND RELATED METHODS
    Publication number: 20150357533
    Abstract: In accordance with certain embodiments, regions of spatially varying wavelength-conversion particle concentration are formed over light-emitting dies.
    Type: Application
    Filed: August 13, 2015
    Publication date: December 10, 2015
    Inventors: Michael A. Tischler, Ian Ashdown, Tom Pinnington, Henry Ip
  • THERMAL MANAGEMENT IN ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
    Publication number: 20150333239
    Abstract: In accordance with certain embodiments, heat-dissipating elements are integrated with semiconductor dies and substrates in order to facilitate heat dissipation therefrom during operation.
    Type: Application
    Filed: July 7, 2015
    Publication date: November 19, 2015
    Inventor: Michael A. Tischler
  • Light-emitting dies incorporating wavelength-conversion materials and related methods
    Patent number: 9190581
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., freestanding white light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: November 17, 2015
    Assignee: Cooledge Lighting Inc.
    Inventor: Michael A. Tischler
  • ILLUMINATION DEVICE CONTROL SYSTEMS AND METHODS
    Publication number: 20150326117
    Abstract: In various embodiments, a control system for an electronic circuit iteratively applies voltage to and senses current from a load to regulate operation of the load.
    Type: Application
    Filed: June 16, 2015
    Publication date: November 12, 2015
    Inventors: Michael A. Tischler, William P. Coetzee, Paul Jungwirth
  • Polymeric binders incorporating light-detecting elements
    Patent number: 9184351
    Abstract: In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.
    Type: Grant
    Filed: September 24, 2014
    Date of Patent: November 10, 2015
    Assignee: Cooledge Lighting Inc.
    Inventor: Michael A. Tischler