Abstract: Method and device for wet treating a defined peripheral edge-region of a wafer-shaped article having a first surface plane W1, a second surface plane W2 and an edge surface. The device includes a support for holding the wafer-shaped article; liquid dispensing members for dispensing liquid onto the first surface plane W1 of the wafer-shaped article not facing the support and liquid guiding member connected to the support for guiding at least a part of the liquid around the edge surface of the wafer-shaped article towards the second surface plane W2 of the wafer-shaped article facing the support thereby wetting at least the edge surface, wherein the liquid guiding member has the form of a ring.