Abstract: A subscriber station for decrypting and decompressing data is provided on a single chip. The chip includes a DES decryption unit for performing decryption of incoming data with a DES key, a public key decryption unit for decrypting the DES key, a general purpose microprocessor for performing decompression, and a Secure Buffer for protecting the decrypted data prior to decompression. The chip includes an embedded key for the public key decryption unit and a bus for providing a data communication path between the microprocessor and the decryption units.

Abstract: A wireless communication unit for a wireless communication system transmits and receives video, audio and data signals within an RF bandwidth. The RF bandwidth is allocated among the video, audio and data signals to allow the video, audio and data signals to fit within the RF bandwidth. The allocation is performed by buffering the signals, making priority assignments to each of the buffered signals, and transmitting the buffered signals according to the priority assignments. The transmitted signals occupy the RF bandwidth in portions specified by the priority assignments. The priority assignments can be changed during a communication link. The subscriber unit receives a transmission header from another party on the communication link, which may include a request by the other party to change the priority assignments. If such a request is received, the subscriber unit automatically changes the priority assignments in response to the request.

Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.

Abstract: A system for providing information to memory within a local device is provided herein. The system initially receives information transmitted from a remote location and reads predetermined data, including start and end addresses, within the local device. The system computes a checksum based on information received from the remote location and the predetermined data and compares a predetermined checksum to the received information checksum. If the predetermined checksum does not equal the received information checksum, the system requests retransmission of information and repeats the preceding steps (receiving information, computing a checksum, and comparing) until the predetermined checksum equals the received information checksum. The system then provides the valid information to local device memory. The invention may execute a protocol to receive information packets and store the information packets in appropriate memory locations after receiving the information.

Abstract: A semiconductor memory device capacitor is disclosed which has a trench capacitor portion provided in a semiconductor substrate and a fin capacitor portion provided above the substrate. The trench capacitor portion includes (i) a trench extending from an upper surface of the semiconductor substrate downwardly into the substrate, and (ii) an electrically conductive trench electrode provided interior to the trench. And the fin capacitor portion includes (i) a fin electrode having a body portion and two or more electrically conductive fins extending outwardly from the body portion, (ii) a fin dielectric layer conformally coating the two or more electrically conductive fins, and (iii) a cell electrode surrounding and in intimate contact with the two or more electrically conductive fins.

Abstract: Electronic system utilizing semiconductor devices having heat dissipating leadframes are provided by using materials, such as copper, which exhibit good thermal and electrical conductivity, and arranging the lead fingers of the leadframe in a configuration which provides good thermal coupling with the surface of a semiconductor die. Micro-bump bonding techniques are employed to provide additional thermal coupling at the electrical connection point of the leadframe fingers to the die. Leadframe fingers exhibiting a high aspect ratio (height:width) are described. Leadframe fingers extending substantially beyond interior bond pads are described.

Abstract: A wireless communication device may take the form of a cellular telephone, of a portable personal communication device, or even of a desk top personal computer which is equipped to communicate over the wireless cellular communication system in effect in a particular area. The wireless communication device is configured to self-adapt to various operating frequencies and communication protocols which may be present in the cellular communication environment so that the device is able to provide communications in several service areas even though the frequencies of operation and the communication protocols in use in the service areas may be incompatible with one another.

Abstract: A digital network system accommodates a plurality of network protocols. The digital network system includes a backbone bus for communicating digital information. A first switching interface unit is coupled to the backbone bus and has at least one port connected to a first network. A second switching interface unit is also coupled to the backbone bus and has at least one port connected to a second network. The first and second interface units transferring digital information in first and second network protocols, respectively. First and second memories are coupled to the backbone bus and to the first and second switching interface units, respectively, and store digital information to be transferred between the switching interface units via the backbone bus. The first switching interface unit and the first memory are formed on a single substrate, and the second switching interface unit and the second memory are formed on a single substrate.

Abstract: A single chip network interface apparatus includes a host interface circuit for communication with a host system bus, a network interface circuit for interfacing with a network bus, a dual port RAM coupled to the host interface circuit and also coupled to the network interface circuit, and a processor coupled to the dual port ram for converting packets of information between network protocol format and a format suitable for the host system bus.

Abstract: A wireless communication device may take the form of a cellular telephone, of a portable personal communication device, or even of a desk top personal computer which is equipped to communicate over the wireless cellular communication system in effect in a particular area. The wireless communication device is configured to self-adapt to various operating frequencies and communication protocols which may be present in the cellular communication environment so that the device is able to provide communications in several service areas even though the frequencies of operation and the communication protocols in use in the service areas may be incompatible with one another. The wireless communication device may also include facilities for transmitting and receiving video, graphics, and data files over an RF bandwidth.

Abstract: A camera comprising various arrangements for employing optical elements in association with photosensitive elements are described. In some of the arrangements, the optical elements are formed integrally with a substrate containing the photosensitive elements. In other arrangements, an optical element is mounted to a package, or the like, containing the substrate and photosensitive elements. In other arrangements, two or more optical elements are employed, including conventional refractive elements, refractive focusing elements, and refractive beam splitting elements. Utility as solid state image sensors is discussed. Utility for monochromatic and color imaging is discussed. Various devices based on such camera arrangements. and methods of making same are discussed.

Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.

Abstract: The capacity of a cache memory is substantially reduced over that required for a multi-chip distributed shared memory (DSM) implementation to enable the cache memory, a main memory, a processor and requisite logic and control circuitry to fit on a single integrated circuit chip. The increased cache miss rate created by the reduced cache memory capacity is compensated for by the reduced cache miss resolution period resulting from integrating the main memory and processor on the single chip. The reduced cache miss resolution period enables the processor clock rate to be substantially increased, so that a processor having a simple functionality such as a reduced instruction set computer (RISC) processor can be utilized and still provide the required processing speed.

Abstract: An adaptive error detection and correction apparatus for an Asynchronous Transfer Mode (ATM) network device comprises a sensing unit for sensing a congestion condition in the ATM network and a global pacing rate unit for adaptively reducing a maximum allowable transmission ratio of ATM cells containing information to idle ATM cells in response to a sensed congestion condition. A processor stores a number corresponding to a relatively high maximum allowable transmission ratio in the global pacing rate register in the absence of a sensed congestion condition, and stores a number corresponding to a relatively low maximum allowable transmission ratio in the global pacing rate register in response to a sensed congestion condition. A controller adjusts the maximum allowable transmission ratio in accordance with the number stored in the global pacing rate register.

Abstract: A system and method are provided herein for creating and validating an electronic design structural description of a circuit or device from a VHDL description of the circuit or device which includes a compiler for compiling the VHDL description of the circuit or device; a device for locating problems within the compiled description and measuring the effectiveness of solving the problems; a device for passing information including the compiled description to a physical design level; a physical design tool for receiving the information and creating a physical design therefrom; and a device for back annotating the information from the physical design tool to the compiler.

Abstract: A network adapter formed on a single semiconductor substrate. The network adapter includes a host bus interface circuit adapted to be connected to a host data bus. A buffer memory is connected to the host bus interface circuit and temporarily stores digital information received from the host data bus. The digital information received from the host data bus are reformatted into packets according to a network protocol by a reformatting circuits. A processor and a network interface circuit are connected to the reformatting circuits. The processor controls the reformatting of the digital information. The network interface circuit is adapted to be connected to a digital network employing the network protocol.

Abstract: A cell placement for an integrated circuit chip comprises a large number of cells allocated to respective locations on the surface of the chip. The placement is divided into switch boxes that surround the cell locations respectively. A bounding box is constructed around each net of a netlist for the placement. A congestion factor is computed for each switch box as being equal to the number of bounding boxes that overlap the respective switch box. A cost factor for the placement and associated netlist is computed as the maximum value, average value, sum of squares or other function of the congestion factors. The individual congestion factor computation can be modified to require that a pin of a net of one of the bounding boxes overlap or be within a predetermined distance of a switch box in order for the congestion factor to be computed as the sum of the overlapping bounding boxes in order to localize and increase the accuracy of the cost factor estimation.

Abstract: In a physical design automation system for producing an optimized cell placement for an integrated circuit chip, a placement optimization methodology is decomposed into a plurality of cell placement optimization processes that are performed simultaneously by parallel processors on input data representing the chip. The results of the optimization processes are recomposed to produce an optimized cell placement. The fitness of the optimized cell placement is analyzed, and the parallel processors are controlled to selectively repeat performing the optimization processes for further optimizing the optimized cell placement if the fitness does not satisfy a predetermined criterion. The system can be applied to initial placement, routing, placement improvement and other problems. The processors can perform the same optimization process on different placements, or on areas of a single placement.

Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.

Abstract: A semiconductor die is mounted to a die receiving area, which is defined by inner ends of conductive leads to which the die is connected. The die is temporarily retained in a substantially fixed position relative to the die receiving area by various techniques for the purpose of permitting bond wires to be attached between the conductive leads and the die. Preferred techniques include employing a mechanical chuck, dispensing an adhesive between the die and its die receiving area, and forming an ultrasonic bond between the die and the die receiving area. Once electrical connections between the die and the conductive lines are formed, the die need not be retained in a fixed position, as the electrical connections will provide sufficient support for the die. Accordingly, conventional die attach techniques, which expose the semiconductor die to substantially elevated temperatures, are avoided.