Abstract: A plurality of devices communicate information over a wireless network at radio frequencies. The information includes digital audio, video and data. Bandwidth among the devices is dynamically allocated, the allocation being based upon the needs of the devices. One embodiment of the wireless network is a Time Division Multiple Access network. Another embodiment is a wireless Ethernet. Yet another embodiment is a Frequency Division Multiplexed network.

Abstract: An electronic system utilizing at least one integrated circuit including a semiconductor integrated circuit chip housed in a package providing external electrical connections for the circuit chip. The system package has only a limited number of external connections available for such use. The system package includes an internal buss, or plurality of busses, which are electrically connected to the circuit chip and to selected external connections or the package to improve the efficiency of utilization of external connections on the package, as well as improving operating characteristics of the integrated circuit chip by improvements to voltage and current distributions to the chip, and also eliminating in some cases the consequences of a poor quality of external electrical connection to the system package itself.

Abstract: A method and apparatus for dissipating heat from a semiconductor device. A heat sink embodying the method includes an exterior surface contoured to better facilitate heat dissipation and/or direct a flow of air or fluid over the heat sink. In one embodiment, the heat sink includes a heat sink layer formed from a powdered metal. In another embodiment, the heat sink layer is contoured with a selected combination of bumps, indentations and holes. In yet another embodiment, the heat sink includes a stack of such heat sink layers which are mechanically interfitted and thermally coupled.

Abstract: A physical design automation system for producing a highest fitness cell placement for an integrated circuit chip includes a decomposition/recomposition processor for decomposing a cell placement optimization process into a plurality of tasks and recomposing the highest fitness cell placement from results of performing the tasks. A plurality of worker processors independently perform the tasks and produce results. A host processor distributively assigns the tasks to the worker processors in response to work requests received therefrom. Each worker processor sends a work request to the host processor after completing a task. The host processor maintains a list of unassigned tasks, assigned tasks and completed tasks, and revises the list to redesignate assigned tasks as unassigned tasks upon determining that the list includes no unassigned tasks and at least one assigned task, thus making the system immune to the failure of one or more processors.

Abstract: Methods of etching optical elements in association with photosensitive elements are described. In some of the arrangements, the optical elements are formed integrally with a substrate containing the photosensitive elements. In other arrangements, an optical element is mounted to a package, or the like, containing the substrate and photosensitive elements. In other arrangements, two or more optical elements are employed, including conventional refractive elements, refractive focusing elements, and refractive beam splitting elements. Utility as solid state image sensors is discussed. Utility for monochromatic and color imaging is discussed.

Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.

Abstract: A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed. A novel device called a "tri-ister" is disclosed.

Abstract: A personal interface system allows a user to access personal records on a database. Each user is provided with a personal interface device. The personal interface device is equipped with wireless and wired communication equipment, allowing a user to access the database anywhere, at any time. A measure of security is provided by a smart card, which must be inserted into the personal interface device.

Abstract: An asynchronous transfer mode (ATM) processing system interconnection or termination unit is implemented on a single integrated circuit chip. The unit includes a universal protocol device having Virtual Channel Memory (VCR) for storing ATM cells for segmentation and reassembly, a Direct Memory Access (DMA) controller for interconnecting the VCR to a host unit, and a Parallel Cell Interface (PCI) for interconnecting the VCR to an ATM network. A Reduced Instruction Set Computer (RISC) microprocessor controls the DMA controller as well as segmentation and reassembly of Conversion Sublayer Payload Data Unit (CS-PDU)s and transfer between the memory, the host and the ATM network and other operations of the device using single clock cycle instructions. The operating program for the RISC microprocessor is stored in a volatile Instruction Random Access Memory (IRAM) in the form of firmware which is downloaded at initialization.

Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.

Abstract: Electronic systems using separate and distinct conductive layers for power and ground are insulated from one another and a patterned signal conductive layer to form a flexible substrate for mounting a semiconductor die in a semiconductor device assembly of the system. TAB technology is utilized to produce an assembly that has superior electrical characteristics because power and ground is conducted on separate low impedance conductive layers. The power and ground leads connecting the semiconductor die and external circuits are selected from the signal trace layer, cut bent downward and attached by bonding to the respective power or ground layer. A tool is disclosed for cutting the selected leads. The present invention further provides a system utilizing a wafer probe card which includes a multi-layer, relatively flexible tape-like substrate having a first conductive layer patterned to have a number of probe leads thereon.

Abstract: A large number of possible placements of cells on an integrated circuit chip are generated and evaluated to determine the placement with the highest fitness. Cells for transposition or "swapping" within each placement using genetic algorithms are selected using greedy algorithms based on the fitness of each cell. The cell fitnesses are evaluated in terms of interconnect congestion, total net wire length or other criteria. Cells are selected for genetic crossover by sorting the cells in order of fitness and multiplying the cell fitnesses by weighting factors that increase non-linearly with rank. The cells are selected using linear random number generation such that cells with higher fitnesses have a higher probability of selection. Cells having lowest fitness are selected for mutation, and transposed to random locations, to adjacent locations, with cells having second worst fitness, to the center of mass of the respective interconnect nets, or with two or more cells in a cyclical manner.

Abstract: A wireless communication unit for a wireless communication system transmits and receives video and audio signals over an RF bandwidth. The RF bandwidth is allocated among the audio and video signals to allow the audio and video signals to fit within the RF bandwidth. The allocation is performed by varying the rates of compression of the audio and video signals. The communication unit is applicable to subscriber units and base stations. Subscriber units such as cellular telephones can display the video images by using fast digital-to-analog converters and a dither technique. During a communication link, the subscriber unit receives a transmission header from another party on the communication link. The transmission header may include a request by the other party to change the allocation of the audio and video signals. If such a request is received, the subscriber unit automatically changes the allocation in response to the request.

Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclosed. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons, by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.

Abstract: Disclosed herein is a method and apparatus for compressing and decompressing audio and video signals. The audio and video signals can be compressed and decompressed according to different standards, such as MPEG-1 and MPEG-2. The audio and video signals can also be compressed and decompressed at different rates. Compression rates can be varied to fit the audio and video signals into a narrow transmission bandwidth, such as an RF transmission bandwidth.

Abstract: A CMOS DRAM integrated circuit includes paired P-type and N-type wells in a substrate. The wells are fabricated using a self-aligning process. Similarly, FETs of the DRAM circuit are fabricated in the wells of the substrate using a self-aligning process to provide FETs of opposite polarity in a DRAM which may have paired memory cells and dummy cells for symmetry of circuitry. One or more layers having an irregular top surface topology may be planarized using mechanical or chemical-mechanical polishing of the topological layer.

Abstract: In a physical design automation system for producing an optimized cell placement for an integrated circuit chip, a placement optimization methodology is decomposed into a plurality of cell placement optimization processes that are performed simultaneously by parallel processors on input data representing the chip. The results of the optimization processes are recomposed to produce an optimized cell placement. The fitness of the optimized cell placement is analyzed, and the parallel processors are controlled to selectively repeat performing the optimization processes for further optimizing the optimized cell placement if the fitness does not satisfy a predetermined criterion. The system can be applied to initial placement, routing, placement improvement and other problems. The processors can perform the same optimization process on different placements, or on areas of a single placement.

Abstract: An electronic system having improved thermal transfer from a semiconductor die in a semiconductor device assembly (package) by at least partially filling a cavity in the package with a thermally conductive fluid, immersing a heat collecting portion of a heat pipe assembly into the fluid, and sealing the cavity. In order that the thermally conductive fluid does not chemically attack the die or its electrical connections, the die and connections can be completely covered with an encapsulating coating of an inorganic dielectric material, such as silicon dioxide, by any of a variety of techniques. The heat pipe provides highly efficient heat transfer from within the package to an external heat sink by means of an evaporation-condensation cooling cycle. The optional dielectric coating over the die permits selection of the thermally conductive fluid from a wider range of fluids by isolating the die and its electrical connections from direct contact with the fluid.

Abstract: A polysilicon interconnect is formed on a microelectronic circuit substrate for conducting signals from a driver to a non-polycrystalline silicon contact which has higher impedance than the interconnect. A plurality of electronic "speed bumps" are spaced along the interconnect for disturbing or disrupting signals propagating along the interconnect toward the contact and thereby reducing undesirable back reflection and ringing. The speed bumps can include capacitance altering elements in the form of dielectric strips, or resistance altering elements in the form of low resistance doped areas or high resistance amorphous areas. The speed bumps can include first and second elements having different values of capacitance or resistance which are spaced along the interconnect in alternating relation.

Abstract: Several inventions are disclosed. A cell architecture using hexagonal shaped cells is disclose. The architecture is not limited to hexagonal shaped cells. Cells may be defined by clusters of two or more hexagons by triangles, by parallelograms, and by other polygons enabling a variety of cell shapes to be accommodated. Polydirectional non-orthogonal three layer metal routing is disclosed. The architecture may be combined with the tri-directional routing for a particularly advantageous design. In the tri-directional routing arraingement, electrical conductors for interconnecting terminals of microelectronic cells of an integrated circuit preferrably extend in three directions that are angularly displaced from each other by 60.degree.. The conductors that extend in the three directions are preferrably formed in three different layers. A method of minimizing wire length in a semiconductor device is disclosed. A method of minimizing intermetal capacitance in a semiconductor device is disclosed.