Patents by Inventor Michael F. Lofaro
Michael F. Lofaro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120083123Abstract: A planarization method includes planarizing a semiconductor wafer in a first chemical mechanical polish step to remove overburden and planarize a top layer leaving a thickness of top layer material over underlying layers. The top layer material is planarized in a second chemical mechanical polish step to further remove the top layer and expose underlying layers of a second material and a third material such that a selectivity of the top layer material to the second material to the third material is between about 1:1:1 to about 2:1:1 to provide a planar topography.Type: ApplicationFiled: January 25, 2011Publication date: April 5, 2012Applicants: JSR CORPORATION, INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Josephine B. Chang, Leslie Charns, Jason E. Cummings, Michael A. Guillorn, Lukasz J. Hupka, Dinesh R. Koli, Tomohisa Konno, Mahadevaiyer Krishnan, Michael F. Lofaro, Jakub W. Nalaskowski, Masahiro Noda, Dinesh K. Penigalapati, Tatsuya Yamanaka
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Publication number: 20120083122Abstract: A polishing method includes polishing, in a first polish, a wafer to remove overburden and planarize a top layer leaving a portion remaining on an underlying layer. A second polishing step includes two phases. In a first phase, the top layer is removed and the underlying layer is exposed, with a top layer to underlying layer selectivity of between about 1:1 to about 2:1 to provide a planar topography. In a second phase, residual portions of the top layer are removed from a top of the underlying layer to ensure complete exposure of an underlying layer surface.Type: ApplicationFiled: January 24, 2011Publication date: April 5, 2012Applicants: JSR CORPORATION, INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Leslie Charns, Jason E. Cummings, Lukasz J. Hupka, Dinesh R. Koli, Tomohisa Konno, Mahadevaiyer Krishnan, Michael F. Lofaro, Jakub W. Nalaskowski, Masahiro Noda, Dinesh K. Penigalapati, Tatsuya Yamanaka
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Patent number: 7955160Abstract: A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation.Type: GrantFiled: June 9, 2008Date of Patent: June 7, 2011Assignee: International Business Machines CorporationInventors: Michael A. Cobb, Dinesh R. Koli, Michael F. Lofaro, Dennis G. Manzer, Paraneetha Poloju, James A. Tornello
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Publication number: 20100178766Abstract: An assembly including a main wafer having a body with a front side and a back side, and a handler wafer, is obtained. The main wafer has a plurality of blind electrical vias terminating above the back side. The blind electrical vias have conductive cores with surrounding insulator adjacent side and end regions of the cores. The handler wafer is secured to the front side of the body of the main wafer. An additional step includes exposing the blind electrical vias on the back side. The blind electrical vias are exposed to various heights across the back side. Another step involves applying a first chemical mechanical polish process to the back side, to open any of the surrounding insulator adjacent the end regions of the cores remaining after the exposing step, and to co-planarize the via conductive cores, the surrounding insulator adjacent the side regions of the cores, and the body of the main wafer.Type: ApplicationFiled: January 13, 2009Publication date: July 15, 2010Applicant: International Business Machines CorporationInventors: Paul S. Andry, John M. Cotte, Michael F. Lofaro, Edmund J. Sprogis, James A. Tornello, Cornelia K. Tsang
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Publication number: 20090305616Abstract: A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation.Type: ApplicationFiled: June 9, 2008Publication date: December 10, 2009Inventors: Michael A. Cobb, Dinesh R. Koli, Michael F. Lofaro, Dennis G. Manzer, Praneetha Poloju, James A. Tornello
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Patent number: 7179760Abstract: The present invention relates to a bilayer cap structure for interconnect structures that comprise copper metallization or other conductive metallization. Such bilayer cap structure includes a first cap layer formed by an unbiased high density plasma (HDP) chemical vapor deposition process, and a second cap layer over the first cap layer, where the second cap layer is formed by a biased high density plasma (bHDP) chemical vapor deposition process. During the bHDP chemical vapor deposition process, a low AC bias power is applied to the substrate to increase the ion bombardment on the substrate surface and to induce resputtering of the capping material, thereby forming a seamless second cap layer with excellent reactive ion etching (RIE) selectivity.Type: GrantFiled: May 27, 2005Date of Patent: February 20, 2007Assignee: International Buisness Machines CorporationInventors: Richard A. Conti, Thomas F. Houghton, Michael F. Lofaro, Jeffery B. Maxson, Ann H. McDonald, Yun-Yu Wang, Keith Kwong Hon Wong, Daewon Yang
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Patent number: 7064064Abstract: An integrated circuit structure is disclosed that has a layer of logical and functional devices and an interconnection layer above the layer of logical and functional devices. The interconnection layer has a substrate, conductive features within the substrate and caps positioned only above the conductive features.Type: GrantFiled: February 16, 2005Date of Patent: June 20, 2006Assignee: International Business Machines CorporationInventors: Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin, Steffen K. Kaldor, Mahadevaiyer Krishnan, Kaushik Kumar, Michael F. Lofaro, Sandra G. Malhotra, Chandrasekhar Narayan, David L. Rath, Judith M. Rubino, Katherine L. Saenger, Andrew H. Simon, Sean P. E. Smith, Wei-tsu Tseng
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Patent number: 7022246Abstract: A method is disclosed of fabricating a MIMCAP (a capacitor (CAP) formed by successive layers of metal, insulator, metal (MIM)) and a thin film resistor at the same level. A method is also disclosed of fabricating a MIMCAP and a thin film resistor at the same level, and a novel integration scheme for BEOL (back-end-of-line processing) thin film resistors which positions them closer to FEOL (front-end-of-line processing) devices.Type: GrantFiled: January 6, 2003Date of Patent: April 4, 2006Assignee: International Business Machines CorporationInventors: Anil K. Chinthakindi, Shwu-Jen Jeng, Michael F. Lofaro, Christopher M. Schnabel, Kenneth J. Stein
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Patent number: 6975032Abstract: An integrated circuit structure is disclosed that has a layer of logical and functional devices and an interconnection layer above the layer of logical and functional devices. The interconnection layer has a substrate, conductive features within the substrate and caps positioned only above the conductive features.Type: GrantFiled: December 16, 2002Date of Patent: December 13, 2005Assignee: International Business Machines CorporationInventors: Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin, Steffen K. Kaldor, Mahadevaiyer Krishnan, Kaushik Kumar, Michael F. Lofaro, Sandra G. Malhotra, Chandrasekhar Narayan, David L. Rath, Judith M. Rubino, Katherine L. Saenger, Andrew H. Simon, Sean P. E. Smith, Wei-tsu Tseng
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Publication number: 20040130434Abstract: A method is disclosed of fabricating a MIMCAP (a capacitor (CAP) formed by successive layers of metal, insulator, metal (MIM)) and a thin film resistor at the same level. A method is also disclosed of fabricating a MIMCAP and a thin film resistor at the same level, and a novel integration scheme for BEOL (back-end-of-line processing) thin film resistors which positions them closer to FEOL (front-end-of-line processing) devices.Type: ApplicationFiled: January 6, 2003Publication date: July 8, 2004Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Anil K. Chinthakindi, Shwu-Jen Jeng, Michael F. Lofaro, Christopher M. Schnabel, Kenneth J. Stein
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Publication number: 20040113279Abstract: An integrated circuit structure is disclosed that has a layer of logical and functional devices and an interconnection layer above the layer of logical and functional devices. The interconnection layer has a substrate, conductive features within the substrate and caps positioned only above the conductive features.Type: ApplicationFiled: December 16, 2002Publication date: June 17, 2004Applicant: International Business Machines CorporationInventors: Shyng-Tsong Chen, Timothy J. Dalton, Kenneth M. Davis, Chao-Kun Hu, Fen F. Jamin, Steffen K. Kaldor, Mahadevaiyer Krishnan, Kaushik Kumar, Michael F. Lofaro, Sandra G. Malhotra, Chandrasekhar Narayan, David L. Rath, Judith M. Rubino, Katherine L. Saenger, Andrew H. Simon, Sean P.E. Smith, Wei-tsu Tseng
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Patent number: 6648979Abstract: A semiconductor wafer is cleaned while a sponge or brush is pressed against the wafer with a constant forced applied utilizing a bias in a constant force pencil. The wafer is cleaned in the state wherein a collapsing portion of the constant force pencil with respect to the cleaning sponge cloth is set in such a way that the cleaning pressure, which is applied from the cleaning sponge to the wafer, can be constant and is adjustable. A method for cleaning wafers using a constant force pencil is also described.Type: GrantFiled: January 24, 2001Date of Patent: November 18, 2003Assignee: International Business Machines CorporationInventors: Michael F. Lofaro, Marc Mattaroccia, Leonard C. Stevens, Jr.
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Publication number: 20030073593Abstract: Slurry compositions comprising an oxidizing agent, optionally a copper corrosion inhibitor, abrasive particles; surface active agent, a service of chloride and a source of sulfate ions.Type: ApplicationFiled: August 30, 2002Publication date: April 17, 2003Inventors: Michael Todd Brigham, Donald Francis Canaperi, Michael A. Cobb, William Cote, Kenneth M. Davis, Scott Alan Estes, Edward Jack Gordon, James Willard Hannah, Mahadevaiyer Krishnan, Michael F. Lofaro, Michael Joseph MacDonald, Dean Allen Schaffer, George James Slusser, James A. Tornello, Eric Jeffrey White
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Patent number: 6475072Abstract: A method and apparatus is described incorporating a semiconductor substrate, a CMP tool, a brush cleaning tool, and a chemical wafer cleaning tool. The CMP is performed with a down force of 1 psi, a backside air pressure of 0.5 psi, a platen speed of 50 rpm, a crarrier speed of 30 rpm and a slurry flow rate of 140 milliliters per minute.Type: GrantFiled: September 29, 2000Date of Patent: November 5, 2002Assignee: International Business Machines CorporationInventors: Donald F. Canaperi, Jack Oon Chu, Guy M. Cohen, Lijuan Huang, John Albrecht Ott, Michael F. Lofaro
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Publication number: 20020096191Abstract: A semiconductor wafer is cleaned while a sponge or brush is pressed against the wafer with a constant forced applied utilizing a bias in a constant force pencil. The wafer is cleaned in the state wherein a collapsing portion of the constant force pencil with respect to the cleaning sponge cloth is set in such a way that the cleaning pressure, which is applied from the cleaning sponge to the wafer, can be constant and is adjustable. A method for cleaning wafers using a constant force pencil is also described.Type: ApplicationFiled: January 24, 2001Publication date: July 25, 2002Applicant: International Business Machines CorporationInventors: Michael F. Lofaro, Marc Mattaroccia, Leonard C. Stevens
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Patent number: 6348076Abstract: Slurry compositions comprising an oxidizing agent, copper corrosion inhibitor, abrasive particles; surface active agent and polyelectrolyte are useful for polishing or planarizing chip interconnect/wiring material such as Al, W and especially Cu.Type: GrantFiled: December 28, 1999Date of Patent: February 19, 2002Assignee: International Business Machines CorporationInventors: Donald F. Canaperi, William J. Cote, Paul Feeney, Mahadevaiyer Krishnan, Joyce C. Liu, Michael F. Lofaro, Philip Murphy, Eric Jeffrey White
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Patent number: 6325696Abstract: A chemical-mechanical polishing (CMP) control system controls distribution of pressure across the backside of a semiconductor wafer being polished. The system includes a CMP apparatus having a carrier for supporting a semiconductor wafer. The carrier includes a plurality of dual function piezoelectric actuators. The actuators sense pressure variations across the semiconductor wafer and are individually controllable. A control is connected to the actuators for monitoring sensed pressure variations and controlling the actuators to provide a controlled pressure distribution across the semiconductor wafer.Type: GrantFiled: September 13, 1999Date of Patent: December 4, 2001Assignee: International Business Machines CorporationInventors: Karl E. Boggs, Kenneth M. Davis, William F. Landers, Michael F. Lofaro, Adam D. Ticknor, Ronald D. Fiege
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Patent number: 6267659Abstract: A polishing pad assembly is described for use in a chemical-mechanical polishing apparatus having a polishing platen. The polishing pad assembly includes a first pad disposed on the platen. The first pad comprises a sealable enclosure with a flexible outer skin and partially filled with a porous material. A control is adapted to inject fluid into and to remove fluid from the enclosure. The first pad has a hardness which is variable according to an amount of fluid in the enclosure. A second pad is disposed on the first pad.Type: GrantFiled: May 4, 2000Date of Patent: July 31, 2001Assignee: International Business Machines CorporationInventors: Shyng-Tsong Chen, Michael F. Lofaro, Woody Ray Smith
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Patent number: 6199269Abstract: An aid to the manipulation of microfabricated micro tools in manufacturing and assembly is disclosed. A sequence of micro tools and a manipulator are connected to one another via attachment links as a combination. The attachment links are optimized to readily allow severing of individual micro tools from the combination as needed. The manipulator provides an aid for handling the combination via probe, pliers, clasping, mating or other device. This facilitates human or machine interaction with the combination of micro tools, either for subsequent processing, or for the assembly of the micro tools into a completed product.Type: GrantFiled: October 23, 1997Date of Patent: March 13, 2001Assignee: International Business Machines CorporationInventors: Nancy Anne Greco, Ernest Norman Levine, Michael F. Lofaro, James Gardner Ryan
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Patent number: 6098788Abstract: A seamless micromechanical object is cast by forming a multilevel mold, filling the mold, and selectively removing the mold with respect to the micromechanical object. The mold can have a first level having a first opening therein, and a second level on the first level, the second level having a second opening therein, the second opening smaller than the first opening. The object may contain a controlled void, for example a micromechanical auger with a void formed therethrough to be used as a capillary to drain off fluids when the auger is in use.Type: GrantFiled: September 9, 1997Date of Patent: August 8, 2000Assignee: International Business Machines CorporationInventors: Nancy Anne Greco, Ernest Norman Levine, Michael F. Lofaro, James Gardner Ryan