Patents by Inventor Michael Gould
Michael Gould has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240246724Abstract: Described herein are various coupling systems to be used with storage units that are selectively coupled and decoupled. The coupling systems may be used with storage units that are stackable and/or transportable, thus allowing the storage units to function well within a large stationary environment, such as a basement, and also for a subset of the storage units to be selected and easily moved to another location.Type: ApplicationFiled: April 5, 2024Publication date: July 25, 2024Inventors: Christopher S. Hoppe, Michael John Caelwaerts, Samuel A. Gould, Aaron M. Williams, Aaron S. Blumenthal, Michael Stearns, Grant T. Squiers, Steven W. Hyma, Jason D. Thurner, Yaron Brunner
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Patent number: 12038604Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: GrantFiled: December 1, 2023Date of Patent: July 16, 2024Assignee: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Patent number: 12038777Abstract: Hybrid analog-digital processing systems are described. An example of a hybrid analog-digital processing system includes photonic accelerator configured to perform matrix-vector multiplication using light. The photonic accelerator exhibits a frequency response having a first bandwidth (e.g., less than 3 GHz). The hybrid analog-digital processing system further includes a plurality of analog-to-digital converters (ADCs) coupled to the photonic accelerator, and a plurality of digital equalizers coupled to the plurality of ADCs, wherein the digital equalizers are configured to set a frequency response of the hybrid analog-digital processing system to a second bandwidth greater than the first bandwidth.Type: GrantFiled: June 25, 2021Date of Patent: July 16, 2024Assignee: Lightmatter, Inc.Inventors: Michael Gould, Carl Ramey, Nicholas C. Harris, Darius Bunandar
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Publication number: 20240219635Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: ApplicationFiled: March 15, 2024Publication date: July 4, 2024Applicant: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Publication number: 20240187111Abstract: Systems and methods for performing signed matrix operations using a linear photonic processor are provided. The linear photonic processor is formed as an array of first amplitude modulators and second amplitude modulators, the first amplitude modulators configured to encode elements of a vector into first optical signals and the second amplitude modulators configured to encode a product between the vector elements and matrix elements into second optical signals. An apparatus may be used to implement a signed value of an output of the linear processor. The linear photonic processor may be configured to perform matrix-vector and/or matrix-matrix operations.Type: ApplicationFiled: February 14, 2024Publication date: June 6, 2024Applicant: Lightmatter, Inc.Inventors: Darius Bunandar, Nicholas C. Harris, Michael Gould, Carl Ramey, Tomo Lazovich
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Publication number: 20240178923Abstract: Described herein are techniques for intra-chip communication within tiled photonic interposers. A photonic interposer may rely on a combination of photonic lanes and electric lanes. For example, a photonic interposer may comprise a photonic integrated circuit (PIC) lithographically patterned with an array of photonic tiles, each photonic tile comprising an on-chip communication unit. The array of photonic tiles is arranged in rows and columns. A plurality of electric lanes place the on-chip communication units of photonic tiles of different rows in electrical communication with one another. A plurality of photonic lanes place the on-chip communication units of photonic tiles of different columns in optical communication with one another.Type: ApplicationFiled: November 22, 2023Publication date: May 30, 2024Applicant: Lightmatter, Inc.Inventors: Darius Bunandar, Mykhailo Tymchenko, Shashank Gupta, Michael Gould, Alexander Sludds, Carlos Dorta-Quinones, Anthony Kopa, Adam Mendrela, Clifford Chao, Hamid Eslampour, Ritesh Jain, Chain-min Richard Ho, Nicholas C. Harris
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Publication number: 20240111094Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: ApplicationFiled: December 1, 2023Publication date: April 4, 2024Applicant: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Publication number: 20240103219Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: ApplicationFiled: December 1, 2023Publication date: March 28, 2024Applicant: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Patent number: 11936434Abstract: Systems and methods for performing signed matrix operations using a linear photonic processor are provided. The linear photonic processor is formed as an array of first amplitude modulators and second amplitude modulators, the first amplitude modulators configured to encode elements of a vector into first optical signals and the second amplitude modulators configured to encode a product between the vector elements and matrix elements into second optical signals. An apparatus may be used to implement a signed value of an output of the linear processor. The linear photonic processor may be configured to perform matrix-vector and/or matrix-matrix operations.Type: GrantFiled: April 26, 2023Date of Patent: March 19, 2024Assignee: Lightmatter, Inc.Inventors: Darius Bunandar, Nicholas C. Harris, Michael Gould, Carl Ramey, Tomo Lazovich
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Publication number: 20240063936Abstract: Systems and methods for increasing throughput of a photonic processor by using photonic degrees of freedom (DOF) are provided. The photonic processor includes a multiplexer configured to multiplex, using at least one photonic DOF, multiple encoded optical signals into a multiplexed optical signal. The photonic processor also includes a detector coupled to an output of an optical path including the multiplexer, the detector being configured to generate a first current based on the multiplexed optical signal or a demultiplexed portion of the multiplexed optical signal. The photonic processor further includes a modulator coupled to and output of the detector, the modulator being configured to generate a second current by modulating the first current.Type: ApplicationFiled: May 22, 2023Publication date: February 22, 2024Applicant: Lightmatter, Inc.Inventors: Darius Bunandar, Michael Gould, Nicholas C. Harris, Carl Ramey
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Patent number: 11860413Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: GrantFiled: November 29, 2022Date of Patent: January 2, 2024Assignee: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Publication number: 20230408764Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: ApplicationFiled: August 24, 2023Publication date: December 21, 2023Applicant: Lightmatter, Inc.Inventors: NICHOLAS C. HARRIS, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Publication number: 20230400632Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: ApplicationFiled: August 24, 2023Publication date: December 14, 2023Applicant: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Publication number: 20230358957Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: ApplicationFiled: July 21, 2023Publication date: November 9, 2023Applicant: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko
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Publication number: 20230353252Abstract: Systems and methods for performing signed matrix operations using a linear photonic processor are provided. The linear photonic processor is formed as an array of first amplitude modulators and second amplitude modulators, the first amplitude modulators configured to encode elements of a vector into first optical signals and the second amplitude modulators configured to encode a product between the vector elements and matrix elements into second optical signals. An apparatus may be used to implement a signed value of an output of the linear processor. The linear photonic processor may be configured to perform matrix-vector and/or matrix-matrix operations.Type: ApplicationFiled: April 26, 2023Publication date: November 2, 2023Applicant: Lightmatter, Inc.Inventors: Darius Bunandar, Nicholas C. Harris, Michael Gould, Carl Ramey, Tomo Lazovich
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Publication number: 20230314742Abstract: Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.Type: ApplicationFiled: March 27, 2023Publication date: October 5, 2023Applicant: Lightmattter, Inc.Inventors: Carlos Dorta-Quinones, Mykhailo Tymchenko, Anthony Kopa, Michael Gould, Bradford Turcott, Robert Turner, Reza Baghdadi, Shashank Gupta, Ajay Joshi, Nicholas C. Harris, Darius Bunandar
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Publication number: 20230308188Abstract: Photonic interposers that enable low-power, high-bandwidth inter-chip (e.g., board-level and/or rack-level) as well as intra-chip communication are described. Described herein are techniques, architectures and processes that improve upon the performance of conventional computers. Some embodiments provide photonic interposers that use photonic tiles, where each tile includes programmable photonic circuits that can be programmed based on the needs of a particular computer architecture. Some tiles are instantiations of a common template tile that are stitched together in a 1D or a 2D arrangement. Some embodiments described herein provide a programmable physical network designed to connect pairs of tiles together with photonic links.Type: ApplicationFiled: March 27, 2023Publication date: September 28, 2023Applicant: Lightmatter, Inc.Inventors: Carlos Dorta-Quinones, Ryan Braid, Anthony Kopa, Michael Gould, Nathaniel Bowman, Karl C. Buckenmaier, Joseph Stadolnik, III, Shashank Gupta, James Carr, Nicholas C. Harris, Darius Bunandar
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Patent number: 11768662Abstract: Photonic processors are described. The photonic processors described herein are configured to perform matrix-matrix (e.g., matrix-vector) multiplication. Some embodiments relate to photonic processors arranged according to a dual-rail architecture, in which numeric values are encoded in the difference between a pair optical signals (e.g., in the difference between the powers of the optical signals). Relative to other architectures, these photonic processors exhibit increased immunity to noise. Some embodiments relate to photonic processors including modulatable detector-based multipliers. Modulatable detectors are detectors designed so that the photocurrent can be modulated according to an electrical control signal. Photonic processors designed using modulatable detector-based multipliers are significantly more compact than other types of photonic processors.Type: GrantFiled: February 17, 2023Date of Patent: September 26, 2023Assignee: Lightmatter, Inc.Inventors: Nicholas C. Harris, Darius Bunandar, Michael Gould, Carl Ramey, Shashank Gupta, Carlos Dorta-Quinones
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Publication number: 20230289142Abstract: Photonic processors are described. The photonic processors described herein are configured to perform matrix-matrix (e.g., matrix-vector) multiplication. Some embodiments relate to photonic processors arranged according to a dual-rail architecture, in which numeric values are encoded in the difference between a pair optical signals (e.g., in the difference between the powers of the optical signals). Relative to other architectures, these photonic processors exhibit increased immunity to noise. Some embodiments relate to photonic processors including modulatable detector-based multipliers. Modulatable detectors are detectors designed so that the photocurrent can be modulated according to an electrical control signal. Photonic processors designed using modulatable detector-based multipliers are significantly more compact than other types of photonic processors.Type: ApplicationFiled: February 17, 2023Publication date: September 14, 2023Applicant: Lightmatter, Inc.Inventors: Nicholas C. Harris, Darius Bunandar, Michael Gould, Carl Ramey, Shashank Gupta, Carlos Dorta-Quinones
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Patent number: 11754783Abstract: Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.Type: GrantFiled: May 6, 2021Date of Patent: September 12, 2023Assignee: Lightmatter, Inc.Inventors: Nicholas C. Harris, Carl Ramey, Michael Gould, Thomas Graham, Darius Bunandar, Ryan Braid, Mykhailo Tymchenko