Abstract: There is disclosed a vehicle backing system configurable by a driver or spotter as a function of the type of the vehicle being backed up and a spotter's position and/or a position of another vehicle located at a rear of a first vehicle.

Abstract: There is disclosed a vehicle backing system configurable by a driver or spotter as a function of the type of the vehicle being backed up and a spotter's position and/or a position of another vehicle located at a rear of a first vehicle.

Abstract: A communication module is provided. In one embodiment, the communication module includes at least one transceiver, a filter communicatively coupled with the at least one transceiver, a power amplifier communicatively coupled to the at least one transceiver and the filter, a primary module chassis configured to hold the at least one transceiver, the filter, and the power amplifier, and a filter suspension frame assembly attached to the primary module chassis. The filter suspension frame assembly is configured to float the at least one transceiver in relation to the primary module chassis.

Abstract: A heat sink with angled fins comprising a first set of fins forming air channels, a second set of fins forming air channels and a heat sink base coupled to the first set of fins and the second set of fins. The first set of fins and the second set of fins are separated by a region along a length of the heat sink base. The fins in the first set of fins are at a first angle with respect to the length of the heat sink base and the fins in the second set of fins are at a second angle with respect to the length of the heat sink base.

Abstract: A communication module is provided. The module includes at least one transceiver, a filter, a power amplifier, an enclosure, an internal interface and an external interface. The power amplifier is in communication with the at least one transceiver and filter. Moreover, the at least one transceiver, filter and power amplifier are tuned and calibrated to work with each other. The enclosure is configured to physically retain the at least one transceiver, filter and power amplifier. The internal interface is configured to interface connections between the at least one transceiver and the power amplifier and the external interface configured to provided external connections to the module. In addition, the external interface is coupled to the internal interface.

Abstract: An apparatus for dissipating heat through a plurality of fins is provided. The apparatus includes a heat dissipating member composed of metal and having a plurality of fins projecting from a first side of the heat dissipating member. Additionally, the apparatus includes a thermal material within at least one fin of the plurality of fins, the thermal material having a thermal conductivity greater than the thermal conductivity of the at least one fin in a direction normal to the first side of the heat dissipating member. Finally, a thermal spreader thermally coupled to the heat dissipating member, the thermal spreader configured to spread heat across the plurality of fins of the heat dissipating member is included.

Abstract: A method for forming an electronics enclosure is disclosed. The method comprises extruding a backplane having a first extruded length, the backplane comprising slots on opposing sides of the backplane, wherein the slots extend along the first extruded length. The method further comprises extruding at least one door panel at the first extruded length, wherein the backplane and the door panel each have extruded hinge features for pivotally coupling the door panel to the backplane, and coupling at least two cast metal plates to opposing ends of the backplane, where each of the cast metal plates comprise a gland that aligns with the slots of the backplane to create a continuous channel for inserting a seal.

Abstract: A water-resistant and electromagnetic interference shielded enclosure configured to enclose a plurality of electronic components is provided. The enclosure comprises a base having a channel, a first L-shaped door rotatably attached to a first side edge of the base, a second L-shaped door rotatably attached to a second side edge of the base, a door-to-door seal abutted to a flange on the first L-shaped door, and a compressible base-seal inserted into the channel. The compressible base-seal and the door-to-door seal form a three-surface seal when the first L-shaped door and the second L-shaped door are closed.

Abstract: In one embodiment, an electronics enclosure is provided. The electronics enclosure comprises a base operable to secure one or more electronic components in place. The base comprises a back wall to which the electronic components are secured; a first end plate extending from a first end of the back wall; and a second end plate extending from a second end of the back wall.

Abstract: A water-resistant and electromagnetic interference shielded enclosure configured to enclose at least one electronic module is provided. The water-resistant and electromagnetic interference shielded enclosure includes a base having a channel, a first L-shaped door rotatably attached to a first edge of the base, a second L-shaped door rotatably attached to a second edge of the base, a flange seal attached to a first flange on the first L-shaped door, and a compressible base-seal inserted into the channel. The compressible base-seal and the flange seal form an enclosure seal when the first L-shaped door and the second L-shaped door are closed.

Abstract: In one embodiment, a locking mechanism comprises: a lever-arm-component coupled to a first side of an module and a second side of the module that opposes the first side; the lever-arm-component rotates about a first axis; first and second latching-arm-components including latching-hooks, the first latching-arm-component coupled to the lever-arm-component on the first side and rotating about a second axis that run parallel to and offset from the first axis; the second latching-arm-component coupled to the lever-arm-component on the second side and rotating about the second axis; and a secondary fastener. The first and second axes are oriented in an over-center configuration such that when the lever-arm-component is rotated about the first axis from a first to second position, the second axis will pass through a locking axis and the latching-hooks apply a force against a mechanism of the enclosure that presses the module against a heat sink of the enclosure.

Abstract: A cable protection cover for an enclosure is disclosed. The cable protection cover includes a cover shroud, a pivot bracket for attaching to the enclosure, and a pivot pin for pivotally attaching the cover shroud to the pivot bracket. The pivot bracket and the cover shroud form a cable access aperture providing a through access to an interface of the enclosure for one or more cables. The cable protection cover forms a protective barrier with the cover shroud in a closed position preventing the one or more cables from being disconnected from the interface.

Abstract: An apparatus for spreading heat over a plurality of fins is provided. The apparatus includes a heat dissipating member composed of metal and having a plurality of fins on a first side of the heat dissipating member. The apparatus also includes a plurality of strips of thermal material having a thermal conductivity in a direction parallel to the heat dissipating member higher than a thermal conductivity of the heat dissipating member, the plurality of strips disposed on a side of the heat dissipating member opposite of the first side and configured to spread heat along the heat dissipating member.

Abstract: A method for thermal management is provided. The method includes providing thermal isolation between at least one high-power thermally tolerant electronic component and at least one low-power thermally sensitive electronic component housed within an electrical enclosure, providing a first conductive path from the at least one low-power electronic component to a first heatsink, providing a second conductive path from the at least one high-power electronic component to a second heatsink, dissipating heat generated by the at least one low-power thermally sensitive electronic component and dissipating heat generated by the at least one high-power thermally tolerant electronic component to an environment external to the electrical enclosure by channeling the heat generated by the at least one low-power thermally sensitive electronic component and the at least one high-power thermally tolerant electronic component along the first and second conductive path, respectively.

Abstract: A shelf assembly for a confined space formed within a structure is provided. The shelf assembly includes a fixed portion having a structure attachment interface to fixedly attach the shelf assembly to the structure and a slideable portion that is operable to slide out and extend from the fixed portion of the shelf assembly. The slideable portion has an enclosure attachment interface to attach an electronics enclosure to the slideable portion of the shelf assembly. The slideable portion has a first state and a second state in which the slideable portion is held in a first position or second position, respectively. In the first state, the entire slideable portion of the shelf assembly is positioned within the structure. In the second state, at least the enclosure attachment interface is positioned outside of the structure.

Abstract: An electronics enclosure is provided. The electronics enclosure includes a heat dissipating body comprising: a heat conducting surface, a first flange adjacent to the heat conducting surface, and a first part of a latch mechanism adjacent to the heat conducting surface. The first part of the latch mechanism is adjacent an edge of the heat conducting surface opposite to the first flange, such that a portion of the heat conducting surface is between the first flange and the first part of the latch mechanism. The electronics enclosure also includes a plurality of electronic modules configured to mount to the heat dissipating body.

Abstract: A reconfigurable mounting bracket is disclosed. The bracket includes a first face plate configured to attach to an enclosure, a first flange that extends perpendicularly from a first end of the first face plate, and a second flange that extends perpendicularly from a second end of the first face plate, the second flange extending in an opposing direction from the first flange. The reconfigurable mounting bracket accommodates a plurality of attachment options.

Abstract: Systems and methods for providing solar shields are provided. In one embodiment, a solar shield system includes at least one solar shield having a first set of snap-fit features positioned on the first solar shield to engage with attachment channels of an enclosure; at least one solar shield cover having a flexible hinge integrated therein, the at least one solar shield cover further includes a second set of snap-fit features for coupling the at least one solar shield cover with the at least one solar shield; and a plurality of fastening devices for securing the at least one solar shield and the at least one solar shield cover to the attachment channels of the enclosure.

Abstract: A pole mount bracket is provided. The bracket includes at least one extruded portion, a pole mounting portion and a band. The at least one extruded portion has an engaging surface. The engaging surface has a plurality of grooves that allow the extruded portion to bend to the form of a pole. The pole mounting portion is connected to the at least one extruded portion. Moreover, the pole mounting portion is further configured to be selectively coupled to a device. The band is configured to deform the at least one extruded portion about the pole to attach the pole mount bracket to the pole.