Abstract: In one embodiment, an electronics enclosure is provided. The electronics enclosure comprises a base operable to secure one or more electronic components in place. The base comprises a back wall to which the electronic components are secured; a first end plate extending from a first end of the back wall; and a second end plate extending from a second end of the back wall.

Abstract: A communication module is provided. In one embodiment, the communication module includes at least one transceiver, a filter communicatively coupled with the at least one transceiver, a power amplifier communicatively coupled to the at least one transceiver and the filter, a primary module chassis configured to hold the at least one transceiver, the filter, and the power amplifier, and a filter suspension frame assembly attached to the primary module chassis. The filter suspension frame assembly is configured to float the at least one transceiver in relation to the primary module chassis.

Abstract: Systems and methods for Venturi fan-assisted cooling of electrical equipment are provided. In one embodiment, a cooling unit for an enclosure housing electronics is provided. The cooling unit comprises: a fan shroud having at least one electrical fan; and a Venturi chamber having a first inlet for receiving a heated airflow from a heatsink, a second inlet for receiving an airflow from a surrounding environment, and an outlet coupled to the fan shroud, the fan drawing air from the Venturi chamber via the outlet when the fan is on. The Venturi chamber comprises a wall for directing the airflow air from the surrounding environment in from the second inlet and across the heated airflow from the heatsink in a manner to as to draw the heated airflow through the heatsink using a Venturi effect, when the fan is on.

Abstract: An apparatus for dissipating heat from a device is provided. The apparatus includes a heat sink having an elongated shape and defining a groove. A heat spreader composed of a non-isotropic thermal conductor is positioned at least partially within the groove of the heat sink and thermally coupled to the heat sink. The heat spreader is oriented such that the thermal conductor propagates heat along a length of the heat sink. A heat channel composed of a non-isotropic thermal conductor is positioned at least partially within the groove of the heat sink and thermally coupled to the heat spreader. The heat channel is oriented to propagate heat towards the heat spreader.

Abstract: An apparatus for transferring heat from a heat spreader is provided. The apparatus includes a heat dissipating member and a heat spreading member adjacent the heat dissipating member, the heat spreading member configured to spread heat laterally across the heat dissipating member, the heat spreading member defining a heat conduction plane. The apparatus also includes a base adjacent to the heat spreading member, wherein the heat spreading member is between the base and the heat dissipating member, and at least one thermal via within the heat conduction plane, the thermal via thermally coupled to the heat spreading member, the at least one thermal via thermally coupled to the heat dissipating member and the base through surface-to-surface contact.

Abstract: A cabinet system comprises a chassis having a plurality of openings, a plurality of modular doors, and at least one radio frequency system. Each opening has removably attached chassis-hinge portions on one of two edges. Each modular door comprises an outside surface, an inside surface opposing the outside surface, and door-hinge receptacles on at least two edges. The door-hinge receptacles receive door-hinge portions. Each door-hinge portion is positioned in a respective door-hinge receptacle on one edge of the plurality of modular doors and is configured to mate with a respective chassis-hinge portion on the one edge of one of the plurality of openings so the mated chassis-hinge portion and door-hinge portion form a hinge to rotatably attach the modular door to the one of the openings. The radio frequency system comprises electronic components attached to the inside surface of at least one of the plurality of modular doors.

Abstract: An apparatus for transferring heat between two corner surfaces is provided. In one embodiment, an apparatus for transferring heat between two corner surfaces is provided. The apparatus comprises a heat transfer body comprising: a first heat conducting side; a second heat conducting side intersecting with the first heat conducting side to form a corner; and a contact face oriented at an acute angle relative the first and second side. The apparatus further comprises at least one wedge having a slip face oriented at an angle configured to interface with the contact face; and at least one fastener configured to apply a force to the at least one wedge. The wedge is configured to translate the force applied by the fastener into a first component in a direction normal to the first heat conducting side and a second component in a direction normal to the second heat conducting side.

Abstract: An apparatus for transferring heat between two surfaces is provided. The apparatus includes a first support plate, a sheet of thermal material adjacent the first support plate, and a second support plate adjacent the sheet of thermal material, wherein the sheet of thermal material is disposed between the first support plate and the second support plate. The apparatus also includes at least one bolt inserted through each of the first support member, the sheet of thermal material, and the second support plate, the at least one bolt configured to be secured into a chassis. Finally, at least one spring is disposed between a shoulder of the at least one bolt and the second support plate.

Abstract: An apparatus for spreading heat over a plurality of fins is provided. The apparatus includes a heat dissipating member composed of metal and having a plurality of fins on a first side of the heat dissipating member. The apparatus also includes a plurality of strips of thermal material having a thermal conductivity in a direction parallel to the heat dissipating member higher than a thermal conductivity of the heat dissipating member, the plurality of strips disposed on a side of the heat dissipating member opposite of the first side and configured to spread heat along the heat dissipating member.

Abstract: An apparatus for dissipating heat through a plurality of fins is provided. The apparatus includes a heat dissipating member composed of metal and having a plurality of fins projecting from a first side of the heat dissipating member. Additionally, the apparatus includes a thermal material within at least one fin of the plurality of fins, the thermal material having a thermal conductivity greater than the thermal conductivity of the at least one fin in a direction normal to the first side of the heat dissipating member. Finally, a thermal spreader thermally coupled to the heat dissipating member, the thermal spreader configured to spread heat across the plurality of fins of the heat dissipating member is included.

Abstract: An apparatus for transferring heat from a heat spreader is provided. The apparatus includes a heat dissipating member and a heat spreading member adjacent the heat dissipating member, the heat spreading member configured to spread heat laterally across the heat dissipating member, the heat spreading member defining a heat conduction plane. The apparatus also includes a base adjacent to the heat spreading member, wherein the heat spreading member is between the base and the heat dissipating member, and at least one thermal via within the heat conduction plane, the thermal via thermally coupled to the heat spreading member, the at least one thermal via thermally coupled to the heat dissipating member and the base through surface-to-surface contact.

Abstract: A heat sink for an electronics enclosure is disclosed. The heat sink comprises a thermal conduction section with an inner surface and an outer surface, the thermal conduction section having an extended profile that tapers from a first end having a first thickness to a second end having a second thickness that is larger than the first thickness. A mounting plate is contiguous with the second end, and the mounting plate is configured to couple the heat sink to a chassis of the electronics enclosure. A thermal interface pad is coupled to the outer surface of the thermal conduction section.

Abstract: An apparatus for enclosing electronic components comprises a chassis enclosure defining an internal chamber and having an upper portion and a lower portion. The upper portion comprises a first front wall having a length dimension greater than a width dimension, and a first pair of opposing side walls that are each contiguous with the first front wall. The lower portion comprises a second front wall having a length dimension less than the length dimension of the first front wall, and a second pair of opposing side walls that are each contiguous with the second front wall. A plurality of heat sink fins are on each of the first front and side walls, and on each of the second front and side walls. Each of the heat sink fins are configured to be substantially parallel to the length dimension of the first front wall and the second front wall, and extend continuously along each wall. The plurality of heat sink fins has an arcuate-like end view profile on each wall of the chassis enclosure.

Abstract: Systems and methods for thermal management for electronic components in a sealed enclosure are provided. In one embodiment, a thermal management system for electronic components in a sealed enclosure comprises: an enclosure for housing electronic components, the enclosure sealed from an external environment; a card cage housed within the enclosure; at least one electronic device card installed in the card cage; and at least one baffle configured to form an airflow channel through at least part of the card cage, wherein the airflow channel directs air warmed by thermal energy from the at least one electronic device card to follow a circular path along an internal surface of the enclosure, wherein the internal surface is configured to conductively remove heat from the air to the environment external to the enclosure.

Abstract: A heat sink for an electronics enclosure is disclosed. The heat sink comprises a thermal conduction section with an inner surface and an outer surface, the thermal conduction section having an extended profile that tapers from a first end having a first thickness to a second end having a second thickness that is larger than the first thickness. A mounting plate is contiguous with the second end, and the mounting plate is configured to couple the heat sink to a chassis of the electronics enclosure. A thermal interface pad is coupled to the outer surface of the thermal conduction section.

Abstract: An apparatus for enclosing electronic components comprises a chassis enclosure defining an internal chamber and having an upper portion and a lower portion. The upper portion comprises a first front wall having a length dimension greater than a width dimension, and a first pair of opposing side walls that are each contiguous with the first front wall. The lower portion comprises a second front wall having a length dimension less than the length dimension of the first front wall, and a second pair of opposing side walls that are each contiguous with the second front wall. A plurality of heat sink fins are on each of the first front and side walls, and on each of the second front and side walls. Each of the heat sink fins are configured to be substantially parallel to the length dimension of the first front wall and the second front wall, and extend continuously along each wall. The plurality of heat sink fins has an arcuate-like end view profile on each wall of the chassis enclosure.

Abstract: A pole mount bracket is provided. The bracket includes at least one extruded portion, a pole mounting portion and a band. The at least one extruded portion has an engaging surface. The engaging surface has a plurality of grooves that allow the extruded portion to bend to the form of a pole. The pole mounting portion is connected to the at least one extruded portion. Moreover, the pole mounting portion is further configured to be selectively coupled to a device. The band is configured to deform the at least one extruded portion about the pole to attach the pole mount bracket to the pole.

Abstract: A method of manufacturing a chassis is provided.

Abstract: A reconfigurable mounting bracket is disclosed. The bracket includes a first face plate configured to attach to an enclosure, a first flange that extends perpendicularly from a first end of the first face plate, and a second flange that extends perpendicularly from a second end of the first face plate, the second flange extending in an opposing direction from the first flange. The reconfigurable mounting bracket accommodates a plurality of attachment options.

Abstract: A cabinet system comprises a chassis having a plurality of openings, a plurality of modular doors, and at least one radio frequency system. Each opening has removably attached chassis-hinge portions on one of two edges. Each modular door comprises an outside surface, an inside surface opposing the outside surface, and door-hinge receptacles on at least two edges. The door-hinge receptacles receive door-hinge portions. Each door-hinge portion is positioned in a respective door-hinge receptacle on one edge of the plurality of modular doors and is configured to mate with a respective chassis-hinge portion on the one edge of one of the plurality of openings so the mated chassis-hinge portion and door-hinge portion form a hinge to rotatably attach the modular door to the one of the openings. The radio frequency system comprises electronic components attached to the inside surface of at least one of the plurality of modular doors.