Abstract: Systems and methods for Venturi fan-assisted cooling of electrical equipment are provided. In one embodiment, a cooling unit for an enclosure housing electronics is provided. The cooling unit comprises: a fan shroud having at least one electrical fan; and a Venturi chamber having a first inlet for receiving a heated airflow from a heatsink, a second inlet for receiving an airflow from a surrounding environment, and an outlet coupled to the fan shroud, the fan drawing air from the Venturi chamber via the outlet when the fan is on. The Venturi chamber comprises a wall for directing the airflow air from the surrounding environment in from the second inlet and across the heated airflow from the heatsink in a manner to as to draw the heated airflow through the heatsink using a Venturi effect, when the fan is on.

Abstract: A hinge comprises a first member having a protrusion, wherein the protrusion has a cam profile shape; and a second member having a cavity operable to receive the protrusion, wherein a cam profile shape of the cavity corresponds to the cam profile shape of the protrusion such that, when the protrusion is in a first position, a gap is present between the second member and the protrusion and, when the protrusion is in a second position, substantially no gap is present between the second member and the protrusion.

Abstract: An apparatus for dissipating heat from a device is provided. The apparatus includes a heat sink having an elongated shape and defining a groove. A heat spreader composed of a non-isotropic thermal conductor is positioned at least partially within the groove of the heat sink and thermally coupled to the heat sink. The heat spreader is oriented such that the thermal conductor propagates heat along a length of the heat sink. A heat channel composed of a non-isotropic thermal conductor is positioned at least partially within the groove of the heat sink and thermally coupled to the heat spreader. The heat channel is oriented to propagate heat towards the heat spreader.

Abstract: A method for cable management in an electronics enclosure is disclosed. The method involves extruding at least one length of material that forms a cable guide having a plurality of partitions defined by one or more cable dividers and two end clip flanges, where the end clip flanges each have at least one snap guide and at least one locking clip channel. The method further involves sizing at least one cable guide assembly from the length of material, based on a predetermined length for the cable guide assembly, and preparing one or more ends of the at least one cable guide assembly.

Abstract: A cable protection cover for an enclosure is disclosed. The cable protection cover comprises a cover shroud, a pivot bracket for attaching to the enclosure, and a pivot pin for pivotally attaching the cover shroud to the pivot bracket. The pivot bracket and the cover shroud form a cable access aperture providing a through access to an interface of the enclosure for one or more cables. The cable protection cover forms a protective barrier with the cover shroud in a closed position preventing the one or more cables from being disconnected from the interface.

Abstract: A method of manufacturing a chassis is provided. The method comprises casting a first segment having a plurality of connected walls such that a window is cast in each of two of the plurality of connected walls in the first segment; casting a second segment having a plurality of connected walls such that a window is cast in each of two of the plurality of connected walls in the second segment; and coupling the first and second segments together to form the chassis having a window in four walls.

Abstract: A combined-natural-and-forced-convection heat sink system including a plurality of fins protruding from a first surface of a conductive material, a plurality of air channels formed between the first surface and an opposing second surface of the conductive material and at least one fan. The plurality of fins forms a natural-convection heat sink. The plurality of air channels forms a forced-convection heat sink. The natural-convection heat sink and the forced-convection heat sink form a combined-natural-and-forced-convection heat sink. Each air channel has an input end opening on an input surface of the conductive material and each air channel has an output end opening on an output surface of the conductive material. The at least one fan is configured to generate an air flow through the air channels when at least one of the fans is operating.

Abstract: An apparatus for accepting a self-drilling screw is provided. The apparatus comprises a base structure having at least one channel. The at least one channel has a first side, a second side, and a bottom, forming a generally ‘u’ shaped cross section, wherein the first side and the second side are a distance apart such that threads of a self-drilling screw engage with both the first side and the second side when the screw is inserted into the channel.

Abstract: A method for thermal management is provided. The method includes providing thermal isolation between at least one high-power thermally tolerant electronic component and at least one low-power thermally sensitive electronic component housed within an electrical enclosure, providing a first conductive path from the at least one low-power electronic component to a first heatsink, providing a second conductive path from the at least one high-power electronic component to a second heatsink, dissipating heat generated by the at least one low-power thermally sensitive electronic component and dissipating heat generated by the at least one high-power thermally tolerant electronic component to an environment external to the electrical enclosure by channeling the heat generated by the at least one low-power thermally sensitive electronic component and the at least one high-power thermally tolerant electronic component along the first and second conductive path, respectively.

Abstract: A water-resistant and electromagnetic interference shielded enclosure configured to enclose at least one electronic module is provided. The water-resistant and electromagnetic interference shielded enclosure includes a base having a channel, a first L-shaped door rotatably attached to a first edge of the base, a second L-shaped door rotatably attached to a second edge of the base, a flange seal attached to a first flange on the first L-shaped door, and a compressible base-seal inserted into the channel. The compressible base-seal and the flange seal form an enclosure seal when the first L-shaped door and the second L-shaped door are closed.

Abstract: A hinge comprises a first member having a protrusion, wherein the protrusion has a cam profile shape; and a second member having a cavity operable to receive the protrusion, wherein a cam profile shape of the cavity corresponds to the cam profile shape of the protrusion such that, when the protrusion is in a first position, a gap is present between the second member and the protrusion and, when the protrusion is in a second position, substantially no gap is present between the second member and the protrusion.

Abstract: A communication module is provided. The module includes at least one transceiver, a filter, a power amplifier, an enclosure, an internal interface and an external interface. The power amplifier is in communication with the at least one transceiver and filter. Moreover, the at least one transceiver, filter and power amplifier are tuned and calibrated to work with each other. The enclosure is configured to physically retain the at least one transceiver, filter and power amplifier. The internal interface is configured to interface connections between the at least one transceiver and the power amplifier and the external interface configured to provided external connections to the module. In addition, the external interface is coupled to the internal interface.

Abstract: An electronics enclosure is provided. The electronics enclosure includes a heat dissipating body comprising: a heat conducting surface, a first flange adjacent to the heat conducting surface, and a first part of a latch mechanism adjacent to the heat conducting surface. The first part of the latch mechanism is adjacent an edge of the heat conducting surface opposite to the first flange, such that a portion of the heat conducting surface is between the first flange and the first part of the latch mechanism. The electronics enclosure also includes a plurality of electronic modules configured to mount to the heat dissipating body.

Abstract: Systems and methods for proving solar shields are provided. In one embodiment, a solar shield system comprises at least one solar shield having a first set of snap-fit features positioned on the first solar shield to engage with attachment channels of an enclosure; at least one solar shield cover having a flexible hinge integrated therein, the at least one solar shield cover further comprises a second set of snap-fit features for coupling the at least one solar shield cover with the at least one solar shield; and a plurality of fastening devices for securing the at least one solar shield and the at least one solar shield cover to the attachment channels of the enclosure.

Abstract: A method for forming an electronics enclosure is disclosed. The method comprises extruding a backplane having a first extruded length, the backplane comprising slots on opposing sides of the backplane, wherein the slots extend along the first extruded length. The method further comprises extruding at least one door panel at the first extruded length, wherein the backplane and the door panel each have extruded hinge features for pivotally coupling the door panel to the backplane, and coupling at least two cast metal plates to opposing ends of the backplane, where each of the cast metal plates comprise a gland that aligns with the slots of the backplane to create a continuous channel for inserting a seal.

Abstract: A communication system is provided. The communication system includes a serialized radio frequency transceiver module and at least one radio frequency module. The serialized radio frequency transceiver module includes a plurality of optical-module connectors, and a remote serialized radio frequency interface including a plurality of high speed connectors. Each of the at least one radio frequency module includes an interface configured to be coupled to the remote serialized radio frequency interface of the serialized radio frequency transceiver module to pass and receive data signals, and a remote digital-analog radio transceiver input interface coupled to the interface. The remote digital-analog radio transceiver input interface is configured to pass data signals to and from the at least one radio frequency module.

Abstract: A method for cable management in an electronics enclosure is disclosed. The method involves extruding at least one length of material that forms a cable guide having a plurality of partitions defined by one or more cable dividers and two end clip flanges, where the end clip flanges each have at least one snap guide and at least one locking clip channel. The method further involves sizing at least one cable guide assembly from the length of material, based on a predetermined length for the cable guide assembly, and preparing one or more ends of the at least one cable guide assembly.

Abstract: A shelf assembly for a confined space formed within a structure is provided. The shelf assembly includes a fixed portion having a structure attachment interface to fixedly attach the shelf assembly to the structure and a slideable portion that is operable to slide out and extend from the fixed portion of the shelf assembly. The slideable portion has an enclosure attachment interface to attach an electronics enclosure to the slideable portion of the shelf assembly. The slideable portion has a first state and a second state in which the slideable portion is held in a first position or second position, respectively. In the first state, the entire slideable portion of the shelf assembly is positioned within the structure. In the second state, at least the enclosure attachment interface is positioned outside of the structure.

Abstract: A water-resistant and electromagnetic interference shielded enclosure configured to enclose a plurality of electronic components is provided. The enclosure comprises a base having a channel, a first L-shaped door rotatably attached to a first side edge of the base, a second L-shaped door rotatably attached to a second side edge of the base, a door-to-door seal abutted to a flange on the first L-shaped door, and a compressible base-seal inserted into the channel. The compressible base-seal and the door-to-door seal form a three-surface seal when the first L-shaped door and the second L-shaped door are closed.