Abstract: A method, a repair device and a repair system for repairing a corrosion damage of a surface of an object exposed to weather. The method includes laserless pre-cleaning of the surface with the corrosion damage, laser cleaning of the surface with the corrosion damage and coating of the surface treated by laser cleaning with a protective layer.

Abstract: An integrated circuit (IC) includes a glass substrate and a buried oxide layer. The IC additionally includes a first semiconductor device coupled to the glass substrate. The first semiconductor device includes a first gate and a first portion of a semiconductive layer coupled to the buried oxide layer. The first gate is located between the glass substrate and the first portion of the semiconductive layer and between the glass substrate and the buried oxide layer. The IC additionally includes a second semiconductor device coupled to the glass substrate. The second semiconductor device includes a second gate and a second portion of the semiconductive layer. The second gate is located between the glass substrate and the second portion of the semiconductive layer. The first portion is discontinuous from the second portion.

Abstract: A system for locating an asset can include a first light fixture disposed in a volume of space and having a first transceiver, a first light source, and a first modulation circuit, where the first light source emits a first light output that defines a first line of sight, where the first modulation circuit generates and sends a first VLC signal that is part of the first light output, where a first light fixture location of the first light fixture in the volume of space is previously determined using the first transceiver during an auto-commissioning process. The system can also include a communication device associated with the asset, where the asset is disposed in the volume of space, where the communication device includes a second transceiver, where the second transceiver receives the first VLC signal from the first transceiver.

Abstract: A device for processing a strip guided along a running direction may include a roller holder disposed on a base frame so as to be pivotable about a pivot axis oriented substantially parallel to a strip running surface. A first processing roller may be disposed on the roller holder in the running direction and at a distance from the pivot axis perpendicular to the running direction and offset from the pivot axis such that by pivoting the roller holder, the first processing roller is moved toward the strip and the processing roller is moved away from the strip. A first counter-processing roller may be disposed transversely to the running direction at a further distance from the pivot axis than the first processing roller such that the first processing and counter-processing rollers interact to guide the strip if the first processing roller is moved toward the strip.

Abstract: A passive on glass (POG) on filter capping apparatus may include an acoustic filter die. The apparatus may further include a capping die electrically coupled to the acoustic filter die. The capping die may include a 3D inductor.

Abstract: A semiconductor device comprises a complementary metal oxide semiconductor (CMOS) device and a heterojunction bipolar transistor (HBT) integrated on a single die. The CMOS device may comprise silicon. The HBT may comprise III-V materials. The semiconductor device may be employed in a radio frequency front end (RFFE) module to reduce size and parasitics of the RFFE module and to provide cost and cycle time savings.

Abstract: A facility management portal and associated user interface can be used for remote monitoring, servicing, and commissioning of a Building Management System (BMS) and associated devices. Building stakeholders can use the facility management portal to configure smart thermostat devices with various settings or parameters associated therewith. For example, building stakeholders may create device profiles associated with smart thermostat devices and provide different device profiles to different groups of thermostat devices installed in a building. Moreover, stakeholders can use the facility management portal to monitor data such as energy consumption and air quality associated with buildings. Building tenants can interact with control devices such as smart thermostats and associated mobile applications to initiate maintenance or emergency notifications relayed through the facility management portal.

Abstract: A semiconductor device comprises a complementary metal oxide semiconductor (CMOS) device and a heterojunction bipolar transistor (HBT) integrated on a single die. The CMOS device may comprise silicon. The HBT may comprise III-V materials. The semiconductor device may be employed in a radio frequency front end (RFFE) module to reduce size and parasitics of the RFFE module and to provide cost and cycle time savings.

Abstract: A system for locating an asset can include a first light fixture disposed in a volume of space and having a first transceiver, a first light source, and a first modulation circuit, where the first light source emits a first light output that defines a first line of sight, where the first modulation circuit generates and sends a first VLC signal that is part of the first light output, where a first light fixture location of the first light fixture in the volume of space is previously determined using the first transceiver during an auto-commissioning process. The system can also include a communication device associated with the asset, where the asset is disposed in the volume of space, where the communication device includes a second transceiver, where the second transceiver receives the first VLC signal from the first transceiver.

Abstract: An integrated circuit (IC) includes a glass substrate and a buried oxide layer. The IC additionally includes a first semiconductor device coupled to the glass substrate. The first semiconductor device includes a first gate and a first portion of a semiconductive layer coupled to the buried oxide layer. The first gate is located between the glass substrate and the first portion of the semiconductive layer and between the glass substrate and the buried oxide layer. The IC additionally includes a second semiconductor device coupled to the glass substrate. The second semiconductor device includes a second gate and a second portion of the semiconductive layer. The second gate is located between the glass substrate and the second portion of the semiconductive layer. The first portion is discontinuous from the second portion.

Abstract: A system for locating an asset can include a first light fixture disposed in a volume of space and having a first transceiver, a first light source, and a first modulation circuit, where the first light source emits a first light output that defines a first line of sight, where the first modulation circuit generates and sends a first VLC signal that is part of the first light output, where a first light fixture location of the first light fixture in the volume of space is previously determined using the first transceiver during an auto-commissioning process. The system can also include a communication device associated with the asset, where the asset is disposed in the volume of space, where the communication device includes a second transceiver, where the second transceiver receives the first VLC signal from the first transceiver.

Abstract: An integrated circuit (IC) includes a glass substrate and a buried oxide layer. The IC additionally includes a first semiconductor device coupled to the glass substrate. The first semiconductor device includes a first gate and a first portion of a semiconductive layer coupled to the buried oxide layer. The first gate is located between the glass substrate and the first portion of the semiconductive layer and between the glass substrate and the buried oxide layer. The IC additionally includes a second semiconductor device coupled to the glass substrate. The second semiconductor device includes a second gate and a second portion of the semiconductive layer. The second gate is located between the glass substrate and the second portion of the semiconductive layer. The first portion is discontinuous from the second portion.

Abstract: A passive on glass (POG) on filter capping apparatus may include an acoustic filter die. The apparatus may further include a capping die electrically coupled to the acoustic filter die. The capping die may include a 3D inductor.

Abstract: Examples of monolithic integrated emitter-detector array in a flexible substrate for biometric sensing and associated devices and methods are disclosed. One disclosed example device includes a flexible substrate; a first array of emitters embedded in the flexible substrate, the first array of emitters configured to emit first electromagnetic (EM) signals; a first array of detectors embedded in the flexible substrate, the first array of detectors configured to detect reflections of the first EM signals; a first scanning circuit coupled to the first array of emitters, the first scanning circuit configured to selectively activate individual emitters of the first array of emitters; and a first sensing circuit coupled to individual detectors of the first array of detectors, the first sensing circuit configured to receive a detection signal from at least one of the detectors of the first array of detectors.

Abstract: Ground shielding is achieved by a conductor shield having conductive surfaces that immediately surround individual chips within a multichip module or device, such as a multichip module or device with flip-chip (FC) bumps. Intra-module shielding between individual chips within the multichip module or device is achieved by electromagnetic or radio-signal (RF) isolation provided by the surfaces of the conductor shield immediately surrounding each of the chips. The conductor shield is directly connected to one or more grounded conductor portions of a substrate or interposer to ensure reliable grounding.

Abstract: A nanowire transistor is provided that includes a well implant having a local isolation region for insulating a replacement metal gate from a parasitic channel. In addition, the nanowire transistor includes oxidized caps in the extension regions that inhibit parasitic gate-to-source and gate-to-drain capacitances.

Abstract: A device for processing a strip guided along a running direction may include a roller holder disposed on a base frame so as to be pivotable about a pivot axis oriented substantially parallel to a strip running surface. A first processing roller may be disposed on the roller holder in the running direction and at a distance from the pivot axis perpendicular to the running direction and offset from the pivot axis such that by pivoting the roller holder, the first processing roller is moved toward the strip and the processing roller is moved away from the strip. A first counter-processing roller may be disposed transversely to the running direction at a further distance from the pivot axis than the first processing roller such that the first processing and counter-processing rollers interact to guide the strip if the first processing roller is moved toward the strip.

Abstract: A nanowire transistor is provided that includes a well implant having a local isolation region for insulating a replacement metal gate from a parasitic channel. In addition, the nanowire transistor includes oxidized caps in the extension regions that inhibit parasitic gate-to-source and gate-to-drain capacitances.

Abstract: A tunable capacitor may include a first terminal having a first semiconductor component with a first polarity. The tunable capacitor may also include a second terminal having a second semiconductor component with a second polarity. The second component may be adjacent to the first semiconductor component. The tunable capacitor may further include a first conductive material electrically coupled to a first depletion region at a first sidewall of the first semiconductor component.

Abstract: Exemplary methods, apparatuses, and systems generate a first candidate list of users that meet a first set one or more characteristics and a second candidate list of users that meet a second set one or more characteristics. When a user appears in both of the first and second candidate lists, the user is selected to receive only the first survey or only the second survey based upon a first priority value for the first survey and a second priority value for the second survey.