Patents by Inventor Michael Nowak

Michael Nowak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210331034
    Abstract: A tongue strengthening device includes an intraoral bolus simulator having a sensor input component. An extraoral user interface is connected to the intraoral bolus. The intraoral bolus simulator is moveable relative to the extraoral user interface in response to a movement of a user's tongue. The sensor input component is configured to detect a pressure or force applied to the intraoral bolus simulator and/or to detect movement of the intraoral bolus simulator relative to the extraoral user interface.
    Type: Application
    Filed: April 7, 2021
    Publication date: October 28, 2021
    Applicant: Trudell Medica| lnternational
    Inventors: Brandon Coultes, Bart Nowak, Michael Lavdas, Michael Nuttall, Marcus Sieffert, Ronak Sakaria, Andreas Rifani, Cameron Roadhouse
  • Publication number: 20210325847
    Abstract: Methods and systems include ways to implement change analysis of an automated production line including at least one robot. Monitoring a plurality of operating parameters associated with the automated production line including the at least one robot is followed by recording at least one change to the plurality of operating parameters. A notification is then provided identifying the at least one change to the plurality of operating parameters. The notification can include mapping the at least one change onto a graphical representation of the automated production line, thereby identifying a portion of the automated production line affected by the at least one change. As a result, at least one of the operating parameters can be adjusted in response to the notification. An action can also be performed in response to the notification. In this manner, the change analysis can optimize operation of the automated production line.
    Type: Application
    Filed: June 28, 2021
    Publication date: October 21, 2021
    Inventors: Ashok Prajapati, Kenneth W. Krause, Michael B. Longo, Rick E. Wunderlich, Judy Evans, Glenn Nowak
  • Publication number: 20210292341
    Abstract: The present invention relates to macrocyclic indole derivatives of general formula (I): in which R1, R2, R3, R4, R5, R6, A and L are as defined herein, methods of preparing said compounds, intermediate compounds useful for preparing said compounds, pharmaceutical compositions and combinations comprising said compounds, and the use of said compounds for manufacturing pharmaceutical compositions for the treatment or prophylaxis of diseases, in particular of hyperproliferative disorders, as a sole agent or in combination with other active ingredients.
    Type: Application
    Filed: November 15, 2018
    Publication date: September 23, 2021
    Inventors: Laura Furst, Michael H. Serrano-Wu, Christopher Lemke, David McKinney, Mark Fitzgerald, Christopher Nasveschuk, Kiel Lazarski, Steven James Ferrara, Guo Wei, Patrick Ryan McCarren, Kai Thede, Anne Mengel, Clara Christ, Joachim Kuhnke, Sarah Anna Liesa Johannes, Philipp Buchgraber, Ulrich Klar, Ulrike Sack, Stefan Kaulfuss, Amaury Ernesto Fernandez-Montalvan, Nicolas Werbeck, Ursula Mönning, Katrin Nowak-Reppel
  • Publication number: 20210277022
    Abstract: The present invention relates to macrocyclic indole derivatives of general formula (I): in which R1, R2, R3, R4, R5, R6, A and L are as defined herein, methods of preparing said compounds, intermediate compounds useful for preparing said compounds, pharmaceutical compositions and combinations comprising said compounds, and the use of said compounds for manufacturing pharmaceutical compositions for the treatment or prophylaxis of diseases, in particular of hyperproliferative disorders, as a sole agent or in combination with other active ingredients.
    Type: Application
    Filed: November 15, 2018
    Publication date: September 9, 2021
    Inventors: Kai Thede, Anne Mengel, Clara Christ, Joachim Kuhnke, Sarah Anna Liesa Johannes, Philipp Buchgraber, Ulrich Klar, Ulrike Sack, Stefan Kaulfuss, Amaury Ernesto Fernandez-Montalvan, Nicolas Werbeck, Ursula Mönning, Katrin Nowak-Reppel, Jeremie Xavier Mortier, Patrick Ryan McCarren, Michael H. Serrano-Wu, Christopher Lemke, David McKinney, Mark Fitzgerald, Christopher Nasveschuk, Kiel Lazarski, Steven James Ferrara, Laura Furst, Guo Wei, Rebecca Ann Flarvey, Daniel Payne, Thomas Pesnot, Craig Wilson
  • Publication number: 20210269456
    Abstract: The present invention relates to substituted macrocyclic indole derivatives of general formula (I): in which R1, R2, R3, R4, R5, R6, A and L are as defined herein, methods of preparing said compounds, intermediate compounds useful for preparing said compounds, pharmaceutical compositions and combinations comprising said compounds, and the use of said compounds for manufacturing pharmaceutical compositions for the treatment or prophylaxis of diseases, in particular of hyperproliferative disorders, as a sole agent or in combination with other active ingredients.
    Type: Application
    Filed: November 15, 2018
    Publication date: September 2, 2021
    Inventors: Kai Thede, Anne Mengel, Clara Christ, Joachim Kuhnke, Sarah Anna Liesa Johannes, Philipp Buchgraber, Ulrich Klar, Ulrike Sack, Stefan Kaulfuss, Amaury Ernesto Fernandez-Montalvan, Nicolas Werbeck, Ursula Mönning, Katrin Nowak-Reppel, Sven Wittrock, David McKinney, Michael H. Serrano-Wu, Christopher Lemke, Mark Fitzgerald, Christopher Nasveschuk, Kiel Lazarski, Steven James Ferrara, Laura Furst, Guo Wei, Patrick Ryan McCarren, Rebecca Ann Harvey
  • Patent number: 10903240
    Abstract: An integrated circuit (IC) includes a glass substrate and a buried oxide layer. The IC additionally includes a first semiconductor device coupled to the glass substrate. The first semiconductor device includes a first gate and a first portion of a semiconductive layer coupled to the buried oxide layer. The first gate is located between the glass substrate and the first portion of the semiconductive layer and between the glass substrate and the buried oxide layer. The IC additionally includes a second semiconductor device coupled to the glass substrate. The second semiconductor device includes a second gate and a second portion of the semiconductive layer. The second gate is located between the glass substrate and the second portion of the semiconductive layer. The first portion is discontinuous from the second portion.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: January 26, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Shiqun Gu, Daniel Daeik Kim, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Jeffrey Lan, David Francis Berdy
  • Patent number: 10707959
    Abstract: A system for locating an asset can include a first light fixture disposed in a volume of space and having a first transceiver, a first light source, and a first modulation circuit, where the first light source emits a first light output that defines a first line of sight, where the first modulation circuit generates and sends a first VLC signal that is part of the first light output, where a first light fixture location of the first light fixture in the volume of space is previously determined using the first transceiver during an auto-commissioning process. The system can also include a communication device associated with the asset, where the asset is disposed in the volume of space, where the communication device includes a second transceiver, where the second transceiver receives the first VLC signal from the first transceiver.
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: July 7, 2020
    Assignee: Signify Holding B.V.
    Inventors: Rajeev Verma, Michael Nowak, Stephanie F. Lee
  • Patent number: 10695789
    Abstract: A device for processing a strip guided along a running direction may include a roller holder disposed on a base frame so as to be pivotable about a pivot axis oriented substantially parallel to a strip running surface. A first processing roller may be disposed on the roller holder in the running direction and at a distance from the pivot axis perpendicular to the running direction and offset from the pivot axis such that by pivoting the roller holder, the first processing roller is moved toward the strip and the processing roller is moved away from the strip. A first counter-processing roller may be disposed transversely to the running direction at a further distance from the pivot axis than the first processing roller such that the first processing and counter-processing rollers interact to guide the strip if the first processing roller is moved toward the strip.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: June 30, 2020
    Assignee: thyssenkrupp AG
    Inventors: Detlef Bosselmann, Michael Nowak, Gerold Raspudic, Josef Schneider, Reinhard Täger
  • Patent number: 10582609
    Abstract: A passive on glass (POG) on filter capping apparatus may include an acoustic filter die. The apparatus may further include a capping die electrically coupled to the acoustic filter die. The capping die may include a 3D inductor.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: March 3, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Changhan Hobie Yun, Jonghae Kim, Xiaoju Yu, Mario Francisco Velez, Wei-Chuan Chen, Niranjan Sunil Mudakatte, Matthew Michael Nowak, Christian Hoffmann, Rodrigo Pacher Fernandes, Manuel Hofer, Peter Bainschab, Edgar Schmidhammer, Stefan Leopold Hatzl
  • Patent number: 10546852
    Abstract: A semiconductor device comprises a complementary metal oxide semiconductor (CMOS) device and a heterojunction bipolar transistor (HBT) integrated on a single die. The CMOS device may comprise silicon. The HBT may comprise III-V materials. The semiconductor device may be employed in a radio frequency front end (RFFE) module to reduce size and parasitics of the RFFE module and to provide cost and cycle time savings.
    Type: Grant
    Filed: May 3, 2018
    Date of Patent: January 28, 2020
    Assignee: QUALCOMM Incorporated
    Inventors: Ranadeep Dutta, Matthew Michael Nowak
  • Publication number: 20200003448
    Abstract: A facility management portal and associated user interface can be used for remote monitoring, servicing, and commissioning of a Building Management System (BMS) and associated devices. Building stakeholders can use the facility management portal to configure smart thermostat devices with various settings or parameters associated therewith. For example, building stakeholders may create device profiles associated with smart thermostat devices and provide different device profiles to different groups of thermostat devices installed in a building. Moreover, stakeholders can use the facility management portal to monitor data such as energy consumption and air quality associated with buildings. Building tenants can interact with control devices such as smart thermostats and associated mobile applications to initiate maintenance or emergency notifications relayed through the facility management portal.
    Type: Application
    Filed: June 26, 2019
    Publication date: January 2, 2020
    Inventors: Alan S. Schwegler, Paul Michael Nowak, Michael F. Kornacki, Ryan J. Bykowski, Kierstyn R. Robbins, Bridget E. Kapler, Vineet Binodshanker Sinha, Sayan Chakraborty, Kerry M. Bell
  • Publication number: 20190341381
    Abstract: A semiconductor device comprises a complementary metal oxide semiconductor (CMOS) device and a heterojunction bipolar transistor (HBT) integrated on a single die. The CMOS device may comprise silicon. The HBT may comprise III-V materials. The semiconductor device may be employed in a radio frequency front end (RFFE) module to reduce size and parasitics of the RFFE module and to provide cost and cycle time savings.
    Type: Application
    Filed: May 3, 2018
    Publication date: November 7, 2019
    Inventors: Ranadeep DUTTA, Matthew Michael NOWAK
  • Publication number: 20190342005
    Abstract: A system for locating an asset can include a first light fixture disposed in a volume of space and having a first transceiver, a first light source, and a first modulation circuit, where the first light source emits a first light output that defines a first line of sight, where the first modulation circuit generates and sends a first VLC signal that is part of the first light output, where a first light fixture location of the first light fixture in the volume of space is previously determined using the first transceiver during an auto-commissioning process. The system can also include a communication device associated with the asset, where the asset is disposed in the volume of space, where the communication device includes a second transceiver, where the second transceiver receives the first VLC signal from the first transceiver.
    Type: Application
    Filed: July 15, 2019
    Publication date: November 7, 2019
    Inventors: Rajeev Verma, Michael Nowak, Stephanie F. Lee
  • Publication number: 20190259780
    Abstract: An integrated circuit (IC) includes a glass substrate and a buried oxide layer. The IC additionally includes a first semiconductor device coupled to the glass substrate. The first semiconductor device includes a first gate and a first portion of a semiconductive layer coupled to the buried oxide layer. The first gate is located between the glass substrate and the first portion of the semiconductive layer and between the glass substrate and the buried oxide layer. The IC additionally includes a second semiconductor device coupled to the glass substrate. The second semiconductor device includes a second gate and a second portion of the semiconductive layer. The second gate is located between the glass substrate and the second portion of the semiconductive layer. The first portion is discontinuous from the second portion.
    Type: Application
    Filed: May 3, 2019
    Publication date: August 22, 2019
    Inventors: Shiqun GU, Daniel Daeik KIM, Matthew Michael NOWAK, Jonghae KIM, Changhan Hobie YUN, Je-Hsiung Jeffrey LAN, David Francis BERDY
  • Patent number: 10355781
    Abstract: A system for locating an asset can include a first light fixture disposed in a volume of space and having a first transceiver, a first light source, and a first modulation circuit, where the first light source emits a first light output that defines a first line of sight, where the first modulation circuit generates and sends a first VLC signal that is part of the first light output, where a first light fixture location of the first light fixture in the volume of space is previously determined using the first transceiver during an auto-commissioning process. The system can also include a communication device associated with the asset, where the asset is disposed in the volume of space, where the communication device includes a second transceiver, where the second transceiver receives the first VLC signal from the first transceiver.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: July 16, 2019
    Assignee: Eaton Intelligent Power Limited
    Inventors: Rajeev Verma, Michael Nowak, Stephanie F. Lee
  • Patent number: 10332911
    Abstract: An integrated circuit (IC) includes a glass substrate and a buried oxide layer. The IC additionally includes a first semiconductor device coupled to the glass substrate. The first semiconductor device includes a first gate and a first portion of a semiconductive layer coupled to the buried oxide layer. The first gate is located between the glass substrate and the first portion of the semiconductive layer and between the glass substrate and the buried oxide layer. The IC additionally includes a second semiconductor device coupled to the glass substrate. The second semiconductor device includes a second gate and a second portion of the semiconductive layer. The second gate is located between the glass substrate and the second portion of the semiconductive layer. The first portion is discontinuous from the second portion.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: June 25, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Shiqun Gu, Daeik Daniel Kim, Matthew Michael Nowak, Jonghae Kim, Changhan Hobie Yun, Je-Hsiung Jeffrey Lan, David Francis Berdy
  • Publication number: 20190132942
    Abstract: A passive on glass (POG) on filter capping apparatus may include an acoustic filter die. The apparatus may further include a capping die electrically coupled to the acoustic filter die. The capping die may include a 3D inductor.
    Type: Application
    Filed: October 30, 2017
    Publication date: May 2, 2019
    Inventors: Changhan Hobie YUN, Jonghae KIM, Xiaoju YU, Mario Francisco VELEZ, Wei-Chuan CHEN, Niranjan Sunil MUDAKATTE, Matthew Michael NOWAK, Christian HOFFMANN, Rodrigo PACHER FERNANDES, Manuel HOFER, Peter BAINSCHAB, Edgar SCHMIDHAMMER, Stefan Leopold HATZL
  • Patent number: 10271745
    Abstract: Examples of monolithic integrated emitter-detector array in a flexible substrate for biometric sensing and associated devices and methods are disclosed. One disclosed example device includes a flexible substrate; a first array of emitters embedded in the flexible substrate, the first array of emitters configured to emit first electromagnetic (EM) signals; a first array of detectors embedded in the flexible substrate, the first array of detectors configured to detect reflections of the first EM signals; a first scanning circuit coupled to the first array of emitters, the first scanning circuit configured to selectively activate individual emitters of the first array of emitters; and a first sensing circuit coupled to individual detectors of the first array of detectors, the first sensing circuit configured to receive a detection signal from at least one of the detectors of the first array of detectors.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: April 30, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Shiqun Gu, Matthew Michael Nowak, Kenneth Kaskoun, Eugene Dantsker, Russel Allyn Martin
  • Patent number: 10242957
    Abstract: Ground shielding is achieved by a conductor shield having conductive surfaces that immediately surround individual chips within a multichip module or device, such as a multichip module or device with flip-chip (FC) bumps. Intra-module shielding between individual chips within the multichip module or device is achieved by electromagnetic or radio-signal (RF) isolation provided by the surfaces of the conductor shield immediately surrounding each of the chips. The conductor shield is directly connected to one or more grounded conductor portions of a substrate or interposer to ensure reliable grounding.
    Type: Grant
    Filed: February 27, 2015
    Date of Patent: March 26, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Daeik Daniel Kim, Changhan Hobie Yun, Mario Francisco Velez, David Francis Berdy, Chengjie Zuo, Jonghae Kim, Matthew Michael Nowak
  • Publication number: 20190067435
    Abstract: A nanowire transistor is provided that includes a well implant having a local isolation region for insulating a replacement metal gate from a parasitic channel. In addition, the nanowire transistor includes oxidized caps in the extension regions that inhibit parasitic gate-to-source and gate-to-drain capacitances.
    Type: Application
    Filed: October 25, 2018
    Publication date: February 28, 2019
    Inventors: Mustafa Badaroglu, Vladimir Machkaoutsan, Stanley Seungchul Song, Jeffrey Junhao Xu, Matthew Michael Nowak, Choh Fei Yeap