Patents by Inventor Michael Renne Ty Tan

Michael Renne Ty Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9921377
    Abstract: A substrate comprises multiple interposers. Each interposer includes interposer elements, where an optical device is coupled to at least some of the interposer elements; two passages formed through the interposer, where each passage is registered with respect to the interposer elements; two blind holes formed in a surface of the interposer, where each blind hole is concentric with a different passage; two annular troughs formed in the surface, each concentric with a different passage, and an annular area separates the annular troughs from an outer diameter of the corresponding concentric passage; and two spherical registration elements, where each registration element is positioned on uncured adhesive on one of the annular areas, where the passages enable a vacuum to be drawn through such that the registration elements are pulled toward the surface of the interposer to self-align to the inner diameter of the blind holes.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: March 20, 2018
    Assignee: Hewlett Packard Enterprise Department LP
    Inventors: Paul K Rosenberg, Sagi V Mathai, Michael Renne Ty Tan
  • Patent number: 9917647
    Abstract: A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: March 13, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sagi Varghese Mathai, Michael Renne Ty Tan, Paul Kessler Rosenberg, Wayne Victor Sorin, Georgios Panotopoulos, Susant K. Patra, Joseph Straznicky
  • Publication number: 20180052266
    Abstract: In the examples provided herein, an apparatus has an optically transparent block having a filter surface. The apparatus also has two or more filters, where each of the filters has thin films fabricated on an optically transparent substrate, and further wherein the thin films of the filters are coupled to the filter surface. Additionally, the apparatus has an optically transparent overmold material encasing the two or more filters, where the overmold material fills a volume between and above neighboring ones of the two or more filters.
    Type: Application
    Filed: April 10, 2015
    Publication date: February 22, 2018
    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Sagi Varghese Mathai, Paul Kessler Rosenberg, Michael Renne Ty Tan
  • Publication number: 20180034242
    Abstract: An array of monolithic wavelength division multiplexed (WDM) vertical cavity surface emitting lasers (VCSELs) is provided with quantum well intermixing. Each VCSEL includes a bottom distributed Bragg reflector (DBR), an upper distributed Bragg reflector, and a laser cavity therebetween. The laser cavity includes a multiple quantum well (MQW) layer sandwiched between a lower separate confinement heterostructure (SCH) and an upper SCH layer. Each MQW region experiences a different amount of quantum well intermixing and concomitantly a different lasing wavelength shift.
    Type: Application
    Filed: January 22, 2015
    Publication date: February 1, 2018
    Inventors: Sagi Varghese MATHAI, Michael Renne Ty TAN
  • Patent number: 9871749
    Abstract: A technique includes using circuit switches to selectively couple packet switches of a switch assembly to the port connectors of the assembly.
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: January 16, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Michael Schlansker, Jean Tourrilhes, Jose Renato G. Santos, Michael Renne Ty Tan, Moray McLaren
  • Patent number: 9869836
    Abstract: Various embodiments of the present invention are directed to optical interconnects. In one embodiment of the present invention, an optical interconnect comprises a laser configured to output an optical signal and a laser-diode driver electronically coupled to the laser. The laser-diode driver induces the laser to output the optical signal in response to an electrical signal received by the laser-diode driver. The optical interconnect includes a diffractive optical element and a plurality of photodetectors. The optical interconnect is positioned to receive the optical signal and configured to split the optical signal into a plurality of optical signals, and each photodetector converts one of the plurality of optical signals into an electrical signal that is output on a separate signal line.
    Type: Grant
    Filed: January 30, 2008
    Date of Patent: January 16, 2018
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Michael Renne Ty Tan, Shih-Yuan Wang, Paul Kessler Rosenberg
  • Publication number: 20170351030
    Abstract: In the examples provided herein, a mounting substrate includes a plurality of filter chips, where each filter chip includes a thin film filter coating on a surface of a different substrate, and the plurality of filter chips are positioned adjacent to each other in a row. A first edge of a first filter chip is flush with a first edge of the mounting substrate, a second edge of the first filter chip is flush with a second edge of the mounting substrate, and the first edge and second edge share a common corner. The flush edges of the first filter chip and the mounting substrate are reference surfaces, the plurality of filter chips are coupled to the mounting substrate via an epoxy, and the reference surfaces are to mate to connector reference surfaces on a connector.
    Type: Application
    Filed: June 3, 2016
    Publication date: December 7, 2017
    Inventors: Sagi Mathai, Paul Kessler Rosenberg, Michael Renne Ty Tan
  • Publication number: 20170351041
    Abstract: In the examples provided herein, an apparatus has a first substrate upon which one or more first filters have been fabricated on a first surface of the first substrate. The apparatus also has a second substrate upon which one or more second filters have been fabricated on a second surface of the second substrate, wherein the one or more first filters and the one or more second filters each transmit a different band of wavelengths. Additionally, the apparatus has a bonding material that bonds the first substrate to the second substrate.
    Type: Application
    Filed: December 19, 2014
    Publication date: December 7, 2017
    Inventors: Sagi Varghese MATHAI, Georgio PANOTOPOULOS, Michael Renne Ty TAN, Paul K ROSENBERG, Wayne V SORIN
  • Publication number: 20170315299
    Abstract: A silicon photonic (SiPh) packaging assembly includes a SiPh interposer and a wafer. The SiPh interposer has one or more optical gratings disposed thereon to couple an optical signal traversing the wafer. The wafer is bonded to the interposer, with the wafer including one or more microlenses, each microlens aligned with a respective optical grating and designed to direct the optical signal traversing the wafer at a desired angle.
    Type: Application
    Filed: October 28, 2014
    Publication date: November 2, 2017
    Inventors: Sagi Varghese MATHAI, Michael Renne Ty TAN, Wayne Victor SORIN
  • Publication number: 20170307834
    Abstract: One example includes an optical coupler. The optical coupler includes a waveguide formed in a first layer of a layered structure that is to propagate an optical signal. The waveguide includes an end portion. The optical coupler also includes a turning mirror that includes a bulk structure and a reflective material deposited on an angular face of the bulk structure to form a surface of the turning mirror. The bulk structure can have a greater cross-sectional size than a cross-sectional size of the waveguide, such that the angular face extends above the first layer of the layered structure and extends into a second layer of the layered structure below the first layer. The surface of the turning mirror can be arranged to reflect the optical signal that is provided from the end portion of the waveguide.
    Type: Application
    Filed: October 24, 2014
    Publication date: October 26, 2017
    Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Sagi MATHAI, Michael Renne Ty TAN
  • Patent number: 9798087
    Abstract: Example implementations relate to mounting optoelectronic devices and wavelength-division multiplexing optical connectors. For example, an implementation includes a transparent interposer having an integrated plurality of lenses. A plurality of optoelectronic devices are mounted to a bottom surface of the transparent interposer, each of the optoelectronic devices being paired to a respective lens of the plurality of lenses. The bottom surface of the transparent interposer is mounted to a substrate within a region of an optical socket. The optical socket receives a filter-based wavelength-division multiplexing (WDM) optical connector. Each lens of the plurality of lenses is paired to a respective filter of the WDM optical connector when the WDM optical connector is mated to the optical socket.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: October 24, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Sagi Mathai, Michael Renne Ty Tan, Wayne Victor Sorin, Paul Kessler Rosenberg
  • Patent number: 9784953
    Abstract: A device for optically coupling two photonic elements may comprise an interposer where each photonic element is axially aligned with an optical pathway in the interposer. Also included is an optics assembly configured to direct a photonic signal along the optical pathway; and a mechanical guide assembly configured to reduce the relative tilt and rotation of photonic elements. Another such device may comprise two connectors where each connector comprises an optical pathway element in which an optics assembly is situated and a photonic element aligned with the optical pathway element. A mechanical guide assembly secures the optical pathway elements in a position so as to reduce the relative tilt and rotation of the photonic elements. A connection for optically coupling two computing units can comprise a partition situated between the computing units and on which an interposer is mounted.
    Type: Grant
    Filed: October 31, 2008
    Date of Patent: October 10, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Paul Kessler Rosenberg, Michael Renne Ty Tan, Huei Pei Kuo, Robert G Walmsley, Eric Peterson
  • Publication number: 20170230116
    Abstract: An apparatus includes a first and second VCSEL, each with an integrated lens. The VCSELs emit a first light beam having first optical modes at first wavelengths and a second light beam having second optical modes at second wavelengths. The apparatus also has an optical block with a first and second surface, a mirror coupled to the second surface, and a wavelength-selective filter coupled to the first surface. The first integrated lens mode matches the first beam to the optical block, and the second integrated lens mode matches the second beam to the optical block such that the first beam and second beam each have substantially a beam waist with a beam waist dimension at the first and second input region, respectively. An exit beam that includes light from the first beam and the second beam is output from the second surface of the optical block.
    Type: Application
    Filed: August 15, 2014
    Publication date: August 10, 2017
    Inventors: Wayne SORIN, Michael Renne Ty TAN, Sagi V MATHAI, Sr., Georgios PANOTOPOULOS, Paul K ROSENBERG
  • Publication number: 20170227714
    Abstract: A photonic interconnect apparatus includes tunable light devices, multiplexers to multiplex optical signals produced by the tunable light devices onto optical paths, and a cyclic arrayed waveguide grating (AWG) to receive the optical signals over the optical paths, and to direct a given optical signal of the received optical signals to a selected output of a plurality of outputs of the cyclic AWG based on a wavelength of the given optical signal. A respective demultiplexer directs the given optical signal to a selected output of a plurality of outputs of the respective demultiplexer according to which coarse wavelength band the wavelength of the given optical signal is part of.
    Type: Application
    Filed: January 29, 2015
    Publication date: August 10, 2017
    Inventors: Mike Schlansker, Jean Tourrilhes, Michael Renne Ty Tan, Joaquin Matres, Wayne Victor Sorin
  • Publication number: 20170214218
    Abstract: A vertical-cavity surface-emitting laser (VCSEL) includes first reflector having a first reflectivity; a second reflector having a second reflectivity, where the second reflectivity is less than the first reflectivity; a gain region between the first and second reflectors; and a substrate having a first surface and a second surface, where the first surface is coupled to the second reflector, and where the second surface is formed into a lens to act upon light emitted the VCSEL through the substrate. The VCSEL lases in a single transverse mode.
    Type: Application
    Filed: September 22, 2014
    Publication date: July 27, 2017
    Inventors: Michael Renne Ty TAN, Wayne V. SORIN, Sagi V. MATHAI
  • Patent number: 9711947
    Abstract: A vertical cavity surface emitting laser (VCSEL) system and method of fabrication are included. The VCSEL system includes a first portion comprising a first mirror and a gain region to amplify an optical signal in response to a data signal, the first portion being fabricated on a first wafer. The system also includes a second portion comprising a second mirror that is partially-reflective to couple the optical signal to an optical fiber. The second portion can be fabricated on a second wafer. The system further includes a supporting structure to couple the first and second portions such that the first and second mirrors are arranged as a laser cavity having a predetermined length to resonate the optical signal.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: July 18, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Michael Renne Ty Tan, David A. Fattal, Jingjing Li, Raymond G. Beausoleil
  • Publication number: 20170168251
    Abstract: A substrate comprises multiple interposers. Each interposer includes interposer elements, where an optical device is coupled to at least some of the interposer elements; two passages formed through the interposer, where each passage is registered with respect to the interposer elements; two blind holes formed in a surface of the interposer, where each blind hole is concentric with a different passage; two annular troughs formed in the surface, each concentric with a different passage, and an annular area separates the annular troughs from an outer diameter of the corresponding concentric passage; and two spherical registration elements, where each registration element is positioned on uncured adhesive on one of the annular areas, where the passages enable a vacuum to be drawn through such that the registration elements are pulled toward the surface of the interposer to self-align to the inner diameter of the blind holes.
    Type: Application
    Filed: July 31, 2014
    Publication date: June 15, 2017
    Inventors: Paul K ROSENBERG, Sagi V MATHAI, Michael Renne Ty TAN
  • Patent number: 9634771
    Abstract: A method for connecting adjacent computing board devices. A source computing board may be provided. An optical engine attaches to the source computing board. A plurality of source optical connectors couples to the optical engine. A first optical connector may be positioned at a location on the source computing board for a first preset type of computing component on an adjacent computing board. A second optical connector may be positioned at a fixed coordinate related to the first optical connector on the source computing board.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: April 25, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Terrel Morris, Paul Kessler Rosenberg, Michael Renne Ty Tan, Gary Gostin, Eric Peterson
  • Publication number: 20170093128
    Abstract: Vertical-cavity surface-emitting lasers (“VCSELs”) and VCSEL arrays are disclosed. In one aspect, a surface-emitting laser includes a grating layer having a sub-wavelength grating to form a resonant cavity with a reflective layer for a wavelength of light to be emitted from a light-emitting layer and an aperture layer disposed within the resonant cavity. The VCSEL includes a charge carrier transport layer disposed between the grating layer and the light-emitting layer. The transport layer has a gap adjacent to the sub-wavelength grating and a spacer region between the gap and the light-emitting layer. The spacer region and gap are dimensioned to be substantially transparent to the wavelength. The aperture layer directs charge carriers to enter a region of the light-emitting layer adjacent to an aperture in the aperture layer and the aperture confines optical modes to be emitted from the light-emitting layer.
    Type: Application
    Filed: June 24, 2016
    Publication date: March 30, 2017
    Inventors: David A. Fattal, Michael Renne Ty Tan, Raymond G. Beausoleil
  • Patent number: 9606313
    Abstract: A system includes a chassis and a slot in the chassis. The slot has a depth dimension along which a removable module may be moved to insert the module in the slot and remove the module from the slot. The system includes waveguides, which have couplers that are arranged at different depths of the slot to couple the waveguides to the module in response to the module being inserted into the slot.
    Type: Grant
    Filed: August 10, 2015
    Date of Patent: March 28, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Arlen L. Roesner, Paul Kessler Rosenberg, Michael Renne Ty Tan