Abstract: A method for manufacturing a semiconductor device includes forming a buried layer of a semiconductor substrate. An active region is formed adjacent at least a portion of the buried layer. At least part of the active region is removed to form a shallow trench opening. A dielectric layer is formed proximate the active region at least partially within the shallow trench opening. At least part of the dielectric layer is removed to form a collector contact region. A collector contact may be formed at the collector contact region. The collector contact may be operable to electrically contact the buried layer.

Abstract: An attachment of a vehicle axle to an axle suspension of a vehicle, such as a utility vehicle, includes a first plate element arranged on the upper side of the vehicle axle, a second plate element arranged on the lower side of the vehicle axle, and at least one spring clip, which connects the vehicle axle to an axle spring suspension of the axle suspension via the plate elements. To simplify assembly and mounting of this attachment, at least one web which is attached on its upper side to the first plate element and on its lower side to the second plate element may be arranged on each side of the vehicle axle so that the vehicle axle is completely surrounded and enclosed by the webs and the plate elements.

Abstract: The present invention is directed to a structure and method of forming an integrated circuit MIM capacitor having a relatively capacitance without the need for an additional mask step. Methods of forming integrated circuit capacitors include the steps of forming a standard via and one or more enlarged vias in an electrically insulating layer during the same patterning process and then forming an electrically conductive first electrode layer which fills the standard via and overlays the enlarged vias in a conformal manner. A dielectric layer is then formed over the electrically conductive first electrode layer. Next, an electrically conductive second electrode layer is formed over the dielectric layer, which overlays and/or fills the enlarged vias. A step is then performed to planarize the second electrode layer, the dielectric layer, and the first electrode layer to define the electrodes of a capacitor.

Abstract: A method for manufacturing a semiconductor device includes forming a buried layer of a semiconductor substrate. An active region is formed adjacent at least a portion of the buried layer. At least part of the active region is removed to form a shallow trench opening. A dielectric layer is formed proximate the active region at least partially within the shallow trench opening. At least part of the dielectric layer is removed to form a collector contact region. A collector contact may be formed at the collector contact region. The collector contact may be operable to electrically contact the buried layer.

Abstract: A method for manufacturing a semiconductor device includes forming a buried layer of a semiconductor substrate. An active region is formed adjacent at least a portion of the buried layer. A first isolation structure is formed adjacent at least a portion of the buried layer. A second isolation structure is formed adjacent at least a portion of the active region. A base layer is formed adjacent at least a portion of the active region. A dielectric layer is formed adjacent at least a portion of the base layer, and then at least part of the dielectric layer is removed at an emitter contact location and at a sinker contact location. An emitter structure is formed at the emitter contact location. Forming the emitter structure includes etching the semiconductor device at the sinker contact location to form a sinker contact region. The sinker contact region has a first depth. The method may also include forming a gate structure.

Abstract: A composite laminate or layer structure includes a substrate (2) and a cover layer (4) bonded thereon. The substrate is made up of at least one layer (3) of fiber-reinforced synthetic material. The cover layer includes at least one layer (5) of metal fibers and/or threads (6), and a metal sheet (7) forming the outer surface skin (8) of the layer structure. The metal sheet is bonded by soldering or sintering onto the metal fibers and/or threads (6), while the layer of metal fibers and/or threads in turn is bonded to the underlying fiber-reinforced synthetic material (3) by being mutually and integrally permeated by a synthetic resin matrix and bonding material. Also, the metal fibers and/or threads (6) may be intermeshed with the fibers of the synthetic material (3).

Abstract: The present invention is directed to a structure and method of forming an integrated circuit MIM capacitor having a relatively capacitance without the need for an additional mask step. Methods of forming integrated circuit capacitors include the steps of forming a standard via and one or more enlarged vias in an electrically insulating layer during the same patterning process and then forming an electrically conductive first electrode layer which fills the standard via and overlays the enlarged vias in a conformal manner. A dielectric layer is then formed over the electrically conductive first electrode layer. Next, an electrically conductive second electrode layer is formed over the dielectric layer, which overlays and/or fills the enlarged vias. A step is then performed to planarize the second electrode layer, the dielectric layer, and the first electrode layer to define the electrodes of a capacitor.

Abstract: An attachment of a vehicle axle to an axle suspension of a vehicle, in particular a utility vehicle, includes a first plate element arranged on the upper side of the vehicle axle, a second plate element arranged on the lower side of the vehicle axle, and at least one spring clip, which connects the vehicle axle to an axle spring suspension of the axle suspension via the plate elements. To simplify assembly and mounting of this attachment, at least one web which is attached on its upper side to the first plate element and on its lower side to the second plate element may be arranged on each side of the vehicle axle so that the vehicle axle is completely surrounded and enclosed by the webs and the plate elements.

Abstract: The present invention is directed to a structure and method of forming an integrated circuit MIM capacitor having a relatively capacitance without the need for an additional mask step. Methods of forming integrated circuit capacitors include the steps of forming a standard via and one or more enlarged vias in an electrically insulating layer during the same patterning process and then forming an electrically conductive first electrode layer which fills the standard via and overlays the enlarged vias in a conformal manner. A dielectric layer is then formed over the electrically conductive first electrode layer. Next, an electrically conductive second electrode layer is formed over the dielectric layer, which overlays and/or fills the enlarged vias. A step is then performed to planarize the second electrode layer, the dielectric layer, and the first electrode layer to define the electrodes of a capacitor.

Abstract: The invention relates to a composite material having a substrate, which contains at least one fiber layer, and a cover layer, which adjoins the substrate and which, at least adjacent to the at least one fiber layer, contains metallic fibers and/or threads. The at least one fiber layer of the substrate and the metallic fibers and/or threads of the cover layer being saturated with binder and, as a result, the substrate and the cover layer are formed together or connected. Metallic, ceramic or glass-type particles are embedded in the cover layer in the area of the metallic fibers and/or threads. Preferably, the particles may be one or more or a combination of TiC, TiN, TiAl, Fe, steel, Ni, Si, metal alloys, diamond, or glass. In addition, the invention provides a process for manufacturing a composite material and articles of manufacture comprising the composite material, especially for rotor blades or propellers.

Abstract: A blade for a fluid flow machine such as a jet turbine engine includes a blade body (2) that is to be exposed to the fluid flow and therefore is subject to damage by erosion due to abrasive particle entrained in the fluid flow and due to thermal loading. The blade body (2) is a layered body including base layers (6) of a fiber reinforced synthetic material and a metallic cover layer (7) applied as an erosion protective layer onto at least a portion or the entirety of the surface of the base layers (6). The cover layer (7) includes metallic fibers or threads (9A, 9B) which are bonded with the fiber reinforced synthetic material of the adjacent base layers (6) by the same synthetic resin binder material permeating through and forming a matrix for all the layers (6 and 7). The metallic fibers or threads (9A, 9B) embedded in a synthetic resin matrix are characterized by a high degree of erosion resistance and a good tolerance for defects in the case of local impact or erosion damage.

Abstract: A vibration damper for rotor housings includes a rubber-elastic damping band (6) that encircles the outer circumference of the rotor housing (4) in a contour fitting manner. A clamping band (7) encircles the damping band (6) and secures the damping band to the housing (4). The clamping band is made of a material having a different modulus of elasticity than the material of the rotor housing, which achieves a detuning of the vibrational system including the rotor housing and the vibration damper as components. Such a detuning reduces the vibrational tendency of the rotor housing. Frictional rubbing between the damping band and the housing surface, and between the damping band and the clamping band effectively damps or dissipates the energy of any vibration that does occur.

Abstract: A guide vane for an axial guide baffle of an axial flow engine, such as a jet engine, is adjustable in its position about a guide vane adjustment axis extending radially to a rotational engine axis. The guide vane has a vane body and an adjustment lever extending at an angle of about 90.degree. away from the adjustment axis. The vane body, the adjustment lever, and at least one bearing journal form an integral one piece construction either of molded fiber composite material or of forged, e.g. drop forged, metal.

Abstract: A protective sheet for a resin pre-impregnated fiber board (prepreg) incorporates ferromagnetic material. This permits effective and safe manipulation of the fiber board during processing (trimming) and in the manufacture of fiber components.

Abstract: A continuous line for plating on indeterminant lengths of metallic strip material where space is limited by providing a line of modular construction and upwardly sloping through the plating operation. The modular line includes feeding of the metallic strip from an overhead coil, solution tanks disposed on an upwardly inclined path for the cleaning, etching, deoxidizing and rinsing of the strip surfaces, plating tanks for the continuous electrodeposition of metal onto both surfaces of the strip, rinsing tanks and driers and then winding the plated strip onto a second coil.

Abstract: A water spray quench process and apparatus for the hardening of steel agricultural discs and like articles with minimum warpage and maximum exposure to the quenching water. A steel article heated in a furnace to a temperature above its austenitizing temperature is moved horizontally into a quenching station, supported on several support pins below the article with a positioning member above the article, and sprayed with water from a series of nozzles both above and below the article to rapidly and effectively quench the article to a minimum temperature. Once the article has been cooled by the quenching water, it is expelled from the quench station.

Abstract: A washer-type spring, commonly called a Belleville spring, which has an improved fatigue life and residual compressive stresses resulting from the creation of a carbon gradient through the spring thickness. This improved spring is formed from a plain carbon or low alloy steel which, after blanking, cutting and forming, is heated to a temperature above the austenitizing temperature in a carbon-rich atmosphere, held at this temperature until suitably carburized, and then quenched.

Abstract: A washer-type spring, commonly called a Belleville spring, which has an improved fatigue life and residual compressive stresses resulting from the creation of a carbon gradient through the spring thickness. This improved spring is formed from a plain carbon or low alloy steel which, after blanking, cutting and forming, is heated to a temperature above the austenitizing temperature in a carbon-rich atmosphere, held at this temperature until suitably carburized, and then quenched.