Abstract: A spool unloading device comprising: a spindle; a first bulk spool of material is mounted on the spindle, wherein the spindle is rotatably controlled to dispense the material; a series of pulleys for receiving the unspooled material such that a variable length of the material is stored within the device before exiting the device to an upstream equipment; and a drive mechanism for indexing the unspooled material exiting the spool unloading machine at a controlled rate.

Abstract: A tagging system gathers all events (tagged and untagged) generated by remote sensors at a location or facility over time. Based on the gathered events the tagging system uses machine learning to train a model to learn the sensor layout of a facility or location and the timing between the triggering of sensors. Once trained, the model can predict the movement and location of individuals and objects throughout the facility based on a starting tagged event. Given a series of tagged and untagged events, the system can use the movement predictions of the model to tag the untagged events in the series with the identification of an individual or object that triggered the generation of the untagged event.

Abstract: An autonomous surface vessel includes an elongate body, and a sampling system operatively coupled to the body and including one or more sampling modules, wherein each sampling module includes a housing including a storage container, a sampling material receivable within the storage container, an actuation system operatively coupled to the sampling material via a lead line, and an end cap operatively coupled to the lead line and matable with an open end of the storage container. A computer system is in communication with the sampling system to operate the actuation system, wherein each sampling module is actuatable between a stowed state, where the sampling material is received within the storage container and the end cap sealingly engages the open end, and a deployed state, where the end cap is disengaged from the open end and the sampling material is drawn out of the sampling container.

Abstract: Systems, devices, and methods are provided for fingerprinting requests, such as transaction records. A transaction record or other suitable request may be parsed to identify a parameter values for a set of fields relevant to fingerprinting. A transaction record representation may be generated based on transaction input data, transaction output data, intermediate data, or combinations thereof. A fingerprint may be generated from the transaction record implementation. Fingerprints may be used to identify various test cases that can be used for regression testing.

Abstract: A hybrid experimental-numerical approach is disclosed to determine the Mixed Mode (I/III) dynamic fracture initiation toughness of engineering materials. Cylindrical Aluminum alloy specimens with a V-notch spiral crack on the surface at spiral angles of 0°, 11.25°, 22.5°, 33.75°, and 45° are subjected to dynamic torsion load using torsional Hopkinson bar apparatus. The torque applied to the specimen at the onset of fracture is measured through strain gages attached to the incident and transmitter bars. A stereo digital image correlation is performed to measure the full-field deformation, and the crack mouth opening displacement as a function of loading time and is used to estimate the time at which the crack initiation is started. The dynamic stress intensity factors are extracted numerically based on the dynamic interaction integral method using Abaqus. The Mode-I (KId), Mode-III (KIIId), and Mixed Mode (K(I/III)d) dynamic initiation toughness is presented as a function of spiral angles and loading rate.

Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.

Abstract: An applicator head for applying an adhesive tape on a surface or substrate, wherein the adhesive tape comprises a material and at least one removable liner, the applicator head comprising: an application tip; a cutting mechanism positioned adjacent an outer most point of the application tip; a positioning device is configured such that the cutting mechanism severs the material while maintaining the at least one removable liner intact.

Abstract: A system comprising: a source of a tape comprising a material associated with an adhesive and at least one removable liner; an applicator head; a cutting mechanism; at least one drive feeding mechanism configured to index the tape from the source to the applicator head at a controlled rate; wherein the applicator head is controllable to apply the material on a surface or a substrate; and wherein the applicator head comprises a cutting mechanism configured to sever the material while leaving the at least one removable liner intact.

Abstract: A spool unloading device comprising: a spindle; a first bulk spool of material is mounted on the spindle, wherein the spindle is rotatably controlled to dispense the material; a series of pulleys for receiving the unspooled material such that a variable length of the material is stored within the device before exiting the device to an upstream equipment; and a drive mechanism for indexing the unspooled material exiting the spool unloading machine at a controlled rate.

Abstract: A feeding system configured to transport a material to a tape applicator, the feeding system comprising: a flexible conduit coupled between a spool unloading device and a tape applicator, wherein the flexible conduit receives the material from a source; and a fluid amplifier coupled to the flexible conduit to facilitate movement of the material therein by creating a vacuum effect.

Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.

Abstract: A self contained, automatic water quality monitoring and treatment system includes a water quality interface control module having a signal processor configured to: receive signaling containing information about a baseline test of pH and ORP levels of water to be monitored and also about a subsequent test of the pH and ORP levels of water to be monitored later in time to the baseline test; determine corresponding signaling containing information about the quality of the water being monitored based upon a percentage of change between the baseline test and the subsequent test later in time to the baseline of the pH and ORP levels of water being monitored; and provide the corresponding signaling for remote awareness, including wireless signaling for providing mobile or Internet awareness, and/or for controlling the treatment of the water being monitored.

Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.

Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.

Abstract: A hybrid experimental-numerical approach is disclosed to determine the Mixed Mode (I/III) dynamic fracture initiation toughness of engineering materials. Cylindrical Aluminum alloy specimens with a V-notch spiral crack on the surface at spiral angles of 0°, 11.25°, 22.5°, 33.75°, and 45° are subjected to dynamic torsion load using torsional Hopkinson bar apparatus. The torque applied to the specimen at the onset of fracture is measured through strain gages attached to the incident and transmitter bars. A stereo digital image correlation is performed to measure the full-field deformation, and the crack mouth opening displacement as a function of loading time and is used to estimate the time at which the crack initiation is started. The dynamic stress intensity factors are extracted numerically based on the dynamic interaction integral method using Abaqus. The Mode-I (KId), Mode-III (KIIId), and Mixed Mode (K(I/III)d) dynamic initiation toughness is presented as a function of spiral angles and loading rate.

Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.

Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.

Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.