Patents by Inventor Michael Sutton

Michael Sutton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12291420
    Abstract: A spool unloading device comprising: a spindle; a first bulk spool of material is mounted on the spindle, wherein the spindle is rotatably controlled to dispense the material; a series of pulleys for receiving the unspooled material such that a variable length of the material is stored within the device before exiting the device to an upstream equipment; and a drive mechanism for indexing the unspooled material exiting the spool unloading machine at a controlled rate.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: May 6, 2025
    Assignee: INNOVATIVE AUTOMATION INC.
    Inventors: Michael Lalonde, Zac Cutt, Michael Sutton, Robert Dorion
  • Publication number: 20240257517
    Abstract: A tagging system gathers all events (tagged and untagged) generated by remote sensors at a location or facility over time. Based on the gathered events the tagging system uses machine learning to train a model to learn the sensor layout of a facility or location and the timing between the triggering of sensors. Once trained, the model can predict the movement and location of individuals and objects throughout the facility based on a starting tagged event. Given a series of tagged and untagged events, the system can use the movement predictions of the model to tag the untagged events in the series with the identification of an individual or object that triggered the generation of the untagged event.
    Type: Application
    Filed: January 30, 2023
    Publication date: August 1, 2024
    Applicant: Verint Americas Inc.
    Inventors: Michael Sutton, Zvi Figov, Nir Naor
  • Publication number: 20240248007
    Abstract: An autonomous surface vessel includes an elongate body, and a sampling system operatively coupled to the body and including one or more sampling modules, wherein each sampling module includes a housing including a storage container, a sampling material receivable within the storage container, an actuation system operatively coupled to the sampling material via a lead line, and an end cap operatively coupled to the lead line and matable with an open end of the storage container. A computer system is in communication with the sampling system to operate the actuation system, wherein each sampling module is actuatable between a stowed state, where the sampling material is received within the storage container and the end cap sealingly engages the open end, and a deployed state, where the end cap is disengaged from the open end and the sampling material is drawn out of the sampling container.
    Type: Application
    Filed: April 22, 2022
    Publication date: July 25, 2024
    Applicant: EXXONMOBIL TECHNOLOGY AND ENGINEERING COMPANY
    Inventors: William P. Meurer, David T. Wang, Gregory W. Shipman, Jeffrey D. Spitzenberger, Michael Sutton, Jeffrey C. Bridges, Paul Moreno
  • Patent number: 11989118
    Abstract: Systems, devices, and methods are provided for fingerprinting requests, such as transaction records. A transaction record or other suitable request may be parsed to identify a parameter values for a set of fields relevant to fingerprinting. A transaction record representation may be generated based on transaction input data, transaction output data, intermediate data, or combinations thereof. A fingerprint may be generated from the transaction record implementation. Fingerprints may be used to identify various test cases that can be used for regression testing.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: May 21, 2024
    Assignee: Amazon Technologies, Inc.
    Inventors: Michael Sutton, Zhongwei Yao, Kevin Kwon, Andrew Evenson, Ruoshi Li
  • Patent number: 11676884
    Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: June 13, 2023
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Michael Sutton, Sreenivasan K Koduri, Subhashish Mukherjee
  • Publication number: 20220396450
    Abstract: A system comprising: a source of a tape comprising a material associated with an adhesive and at least one removable liner; an applicator head; a cutting mechanism; at least one drive feeding mechanism configured to index the tape from the source to the applicator head at a controlled rate; wherein the applicator head is controllable to apply the material on a surface or a substrate; and wherein the applicator head comprises a cutting mechanism configured to sever the material while leaving the at least one removable liner intact.
    Type: Application
    Filed: November 9, 2020
    Publication date: December 15, 2022
    Inventors: Michael LALONDE, Zac CUTT, Michael SUTTON, Robert DORION
  • Publication number: 20220396451
    Abstract: An applicator head for applying an adhesive tape on a surface or substrate, wherein the adhesive tape comprises a material and at least one removable liner, the applicator head comprising: an application tip; a cutting mechanism positioned adjacent an outer most point of the application tip; a positioning device is configured such that the cutting mechanism severs the material while maintaining the at least one removable liner intact.
    Type: Application
    Filed: November 9, 2020
    Publication date: December 15, 2022
    Inventors: Michael LALONDE, Zac CUTT, Michael SUTTON, Robert DORION
  • Publication number: 20220388805
    Abstract: A spool unloading device comprising: a spindle; a first bulk spool of material is mounted on the spindle, wherein the spindle is rotatably controlled to dispense the material; a series of pulleys for receiving the unspooled material such that a variable length of the material is stored within the device before exiting the device to an upstream equipment; and a drive mechanism for indexing the unspooled material exiting the spool unloading machine at a controlled rate.
    Type: Application
    Filed: November 9, 2020
    Publication date: December 8, 2022
    Inventors: Michael LALONDE, Zac CUTT, Michael SUTTON, Robert DORION
  • Publication number: 20220388797
    Abstract: A feeding system configured to transport a material to a tape applicator, the feeding system comprising: a flexible conduit coupled between a spool unloading device and a tape applicator, wherein the flexible conduit receives the material from a source; and a fluid amplifier coupled to the flexible conduit to facilitate movement of the material therein by creating a vacuum effect.
    Type: Application
    Filed: November 9, 2020
    Publication date: December 8, 2022
    Inventors: Michael LALONDE, Zac CUTT, Michael SUTTON, Robert DORION
  • Publication number: 20210249336
    Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.
    Type: Application
    Filed: April 27, 2021
    Publication date: August 12, 2021
    Inventors: Benjamin Michael Sutton, Sreenivasan K. Koduri, Subhashish Mukherjee
  • Patent number: 10991641
    Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: April 27, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Michael Sutton, Sreenivasan K Koduri, Subhashish Mukherjee
  • Patent number: 10978239
    Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: April 13, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Haiying Li, Benjamin Michael Sutton, Ming Li
  • Patent number: 10854370
    Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: December 1, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Haiying Li, Benjamin Michael Sutton, Ming Li
  • Publication number: 20200266131
    Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.
    Type: Application
    Filed: May 5, 2020
    Publication date: August 20, 2020
    Inventors: Benjamin Michael Sutton, Sreenivasan K. Koduri, Subhashish Mukherjee
  • Patent number: 10643929
    Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.
    Type: Grant
    Filed: May 12, 2014
    Date of Patent: May 5, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Michael Sutton, Sreenivasan K Koduri, Subhashish Mukherjee
  • Patent number: 10323478
    Abstract: The present disclosure provides a modular insert float system and method that can be inserted into a casing and attached to the casing internal surface by internal slips and sealing components. The system is modular in that three main components: an upper valve assembly, a lower valve assembly, and a pair of casing anchor and seal assemblies along with top and bottom shoes form a kit that can be used for virtually any casing of a given size regardless of the threads, casing material grades, length of joint, or other variations. Further, the system allows for insertion of the casing into the wellbore without damaging the formation from forcing wellbore fluid into the formation and causing the loss of wellbore fluid in the wellbore.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: June 18, 2019
    Inventors: Kevin Berscheidt, Michael Sutton, Cleo Holland
  • Patent number: 10256027
    Abstract: An embodiment of coil assembly includes a laterally disposed ferrite ring having a central opening. A laterally disposed annular conductive member is positioned above the ferrite ring and has a plurality of spaced-apart circumferential segments. A plurality of bond wires are connected at opposite ends thereof to outer and inner portions of the plurality of spaced-apart circumferential segments. A layer of mold compound covers the ferrite ring and the bond wires.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: April 9, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Haiying Li, Benjamin Michael Sutton, Ming Li
  • Publication number: 20180336994
    Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.
    Type: Application
    Filed: November 10, 2017
    Publication date: November 22, 2018
    Inventors: Haiying Li, Benjamin Michael Sutton, Ming Li
  • Publication number: 20180266206
    Abstract: The present disclosure provides a modular insert float system and method that can be inserted into a casing and attached to the casing internal surface by internal slips and sealing components. The system is modular in that three main components: an upper valve assembly, a lower valve assembly, and a pair of casing anchor and seal assemblies along with top and bottom shoes form a kit that can be used for virtually any casing of a given size regardless of the threads, casing material grades, length of joint, or other variations. Further, the system allows for insertion of the casing into the wellbore without damaging the formation from forcing wellbore fluid into the formation and causing the loss of wellbore fluid in the wellbore.
    Type: Application
    Filed: March 15, 2017
    Publication date: September 20, 2018
    Inventors: Kevin BERSCHEIDT, Michael SUTTON, Cleo HOLLAND
  • Patent number: D822900
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: July 10, 2018
    Assignee: Mohawk Innovations, Ltd.
    Inventors: Sarah Pavis, David Michael Sutton