Abstract: A coupling device provides galvanic isolation using a leadframe that is configured to support two integrated circuit chips in a coplanar manner. Each chip contains an inductive coupling coil. The lead frame includes a set of bond pads for attaching bond wires to couple to the two integrated circuit chips. Two separated die attach pads support the two chips. Each die attach pad is configured to support one of the two integrated circuit chips with a plurality of cantilevered fingers.

Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.

Abstract: The present disclosure provides a modular insert float system and method that can be inserted into a casing and attached to the casing internal surface by internal slips and sealing components. The system is modular in that three main components: an upper valve assembly, a lower valve assembly, and a pair of casing anchor and seal assemblies along with top and bottom shoes form a kit that can be used for virtually any casing of a given size regardless of the threads, casing material grades, length of joint, or other variations. Further, the system allows for insertion of the casing into the wellbore without damaging the formation from forcing wellbore fluid into the formation and causing the loss of wellbore fluid in the wellbore.

Abstract: An embodiment of coil assembly includes a laterally disposed ferrite ring having a central opening. A laterally disposed annular conductive member is positioned above the ferrite ring and has a plurality of spaced-apart circumferential segments. A plurality of bond wires are connected at opposite ends thereof to outer and inner portions of the plurality of spaced-apart circumferential segments. A layer of mold compound covers the ferrite ring and the bond wires.

Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.

Abstract: Electrostatic charge grounding is achieved by connecting an outer surface touchscreen conductive coating to a grounded conductor in a graphics terminal using an electrostatic charge routing system that provides a path for electrons that accumulate on the conductive coating to pass through one or more non-conductive elements in the graphics terminal. The grounded conductor can be a bezel made of metal or another conductor, a conductive paint layer applied to a bezel or other graphics terminal element, a metal spline pin or a metal screw. The electron path defined by the electrostatic charge routing system can include conductive and dissipative elements such as metal spline pins, metal screws, conductive epoxy, conducting plastic elements providing a short, closed electron bridge.

Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

Abstract: The present disclosure provides a modular insert float system and method that can be inserted into a casing and attached to the casing internal surface by internal slips and sealing components. The system is modular in that three main components: an upper valve assembly, a lower valve assembly, and a pair of casing anchor and seal assemblies along with top and bottom shoes form a kit that can be used for virtually any casing of a given size regardless of the threads, casing material grades, length of joint, or other variations. Further, the system allows for insertion of the casing into the wellbore without damaging the formation from forcing wellbore fluid into the formation and causing the loss of wellbore fluid in the wellbore.

Abstract: An electronics module includes a housing with: (i) a forced convection chamber including an internal forced convection space; and, (ii) a passive chamber including an internal passive space that is separated from the forced convection space. At least one fan is connected to the housing and adapted to induce forced convection airflow in the forced convection space. A heat sink is connected to the housing and includes: (i) a heat input portion exposed to the passive space; and, (ii) a heat output portion exposed to the forced convection space. A circuit board assembly is located in the passive space and includes at least one electronic component that is thermally engaged with the heat input portion of the heat sink. A clamping plate is secured to the heat sink and captures the circuit board to the heat sink. The circuit board is isolated from the fan-induced forced convection airflow.

Abstract: This invention relates to a refillable and/or interchangeable cartridge that can attach and detach from a hairdryer. Prior to, concurrent with or subsequent to hair drying, a user can activate the cartridge to dispel, mist, steam or otherwise disperse the cartridge's product onto the user's hair, skin, scalp or fur. Each cartridge can contain various hair treatment products, styling products and/or nutrients. A cartridge can attach and detach at various points along the hairdryer including but not limited to inside the front outlet or rear inlet, primarily annularly around either the front outlet or rear inlet, along the top of the housing, through the core of the housing, or in the handle. The hairdryer also has improved heat transfer, fluid flow, reduced noise and vibration, weight and a shorter main housing barrel to make it easier for a user to treat and style the user's hair, skin, scalp or fur.

Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

Abstract: Asphalt roofing systems including multiple sealing strips between two overlaid asphalt roof shingles are described. Additional sealing strips can enhance wind and water resistance of a roof. Simulations are carried out with three tab asphalt roofing shingles to determine desirable locations for multiple sealing strips between overlaid shingles.

Abstract: An embedded coil assembly embodiment includes a ferrite ring having an annular axis. The ferrite ring is positioned on a conductive metal surface. A plurality of separate, spaced apart conductive structures extend over the ferrite ring and are attached to the conductive metal surface in a first region of the conductive surface positioned radially outwardly of the annular axis of the ferrite ring and in a second region of the conductive surface positioned radially inwardly of the annular axis of the ferrite ring. An encapsulation layer covers, the ferrite ring and at least a portion of the plurality of conductive structures.

Abstract: Techniques for separately accounting for multiple transactions in the same data packets communicated over a network using Transport Control Protocol (TCP) include receiving an Internet Protocol (IP) data packet that includes Transport Control Protocol (TCP) payload data. The TCP payload is parsed to determine boundary data that indicates a byte location on a boundary between a first transaction and a second transaction. A byte count that indicates a number of bytes in the TCP payload associated with the first transaction is determined based on the boundary data. Accounting data for the first transaction is determined based at least in part on the byte count. These techniques allow a service gateway to bill separately for different requests and responses carried in TCP data packets, such as those for Hypertext Transfer Protocol (HTTP) and Real Time Streaming Protocol (RTSP).

Abstract: Electrostatic charge grounding is achieved by connecting an outer surface touchscreen conductive coating to a grounded conductor in a graphics terminal using an electrostatic charge routing system that provides a path for electrons that accumulate on the conductive coating to pass through one or more non-conductive elements in the graphics terminal. The grounded conductor can be a bezel made of metal or another conductor, a conductive paint layer applied to a bezel or other graphics terminal element, a metal spline pin or a metal screw. The electron path defined by the electrostatic charge routing system can include conductive and dissipative elements such as metal spline pins, metal screws, conductive epoxy, conducting plastic elements providing a short, closed electron bridge.

Abstract: This invention relates to a device comprised of at least two interchangeable modules, wherein at least one module has a power source and/or data storage unit and can transmit power and/or data to all of the electrically and mechanically mated modules. The device is designed for use in extreme weather environments, such as but not limited to, snow, rain, at elevation, and/or under pressure. In addition, each mating point between the at least two modules is waterproof. In a preferred embodiment, the device is comprised of a first module that is an optical head, with at least two optical lenses and can sense and capture image data. A second module is a handle comprised of a battery. When the first and second modules are electrically and mechanically mated, the two modules are secure and waterproof and the device operates as a 360° optical camera with an interchangeable power handle module.

Abstract: A method of forming a packaged electronic device includes fabricating a MEMS structure, such as a BAW structure, on a first semiconductor wafer substrate; forming a cavity in a second semiconductor wafer substrate; and mounting the second substrate on the first substrate such that the MEMS structure is positioned inside the cavity in the second substrate. A wafer level assembly and an integrated circuit package are also described.

Abstract: An embodiment of coil assembly includes a laterally disposed ferrite ring having a central opening. A laterally disposed annular conductive member is positioned above the ferrite ring and has a plurality of spaced-apart circumferential segments. A plurality of bond wires are connected at opposite ends thereof to outer and inner portions of the plurality of spaced-apart circumferential segments. A layer of mold compound covers the ferrite ring and the bond wires.