Patents by Inventor Michael T. Crocker
Michael T. Crocker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12219706Abstract: Examples described herein relate to an apparatus that includes a flexible conductor covered in an insulative material and at least one conductor region in contact with the flexible conductor. In some examples, melting of the at least one conductor region is to cause a conductive coupling of the flexible conductor with a second conductor and wherein the flexible conductor is adapted to conductively couple a first circuit board oriented orthogonal to a second circuit board. In some examples, the at least one conductor region comprises at least one solder ball of a grid array. In some examples, the at least one conductor region is re-solderable.Type: GrantFiled: June 22, 2021Date of Patent: February 4, 2025Assignee: Intel CorporationInventors: Jonathan W. Thibado, Aaron Gorius, Michael T. Crocker, Matthew J. Adiletta, John C. Gulick, Emery E. Frey
-
Patent number: 12082370Abstract: Examples described herein relate to a system. The system can include a container that contains fluid to provide two phase immersion liquid cooling (2PILC) for a system within the container. The container can enclose a first circuit board with a first side of the first circuit board is conductively coupled to at least one device. The container can enclose a motherboard conductively coupled to a second side of the first circuit board with a first side of the motherboard is conductively coupled to the second side of the first circuit board. The motherboard can include at least four edges. Connectors can conductively connect the motherboard with a second circuit board. The second circuit board can include at least four edges and an edge of the motherboard is oriented approximately 90 degrees to an edge of the second circuit board. At least one device can include one or more of: a processor, memory device, accelerator device, or network interface.Type: GrantFiled: June 2, 2021Date of Patent: September 3, 2024Assignee: Intel CorporationInventors: Aaron Gorius, Michael T. Crocker, Jonathan W. Thibado, Matthew J. Adiletta, John C. Gulick, Emery E. Frey
-
Publication number: 20240080988Abstract: A system includes a processor, such as a CPU, surrounded by high-density memory with lower profile than a standard DIMM. The low profile, high-density memory provides multiple memory channels for the processor. With the memory configuration, the system can maintain the memory configurability with increased density and increased memory channels for the processor.Type: ApplicationFiled: November 10, 2023Publication date: March 7, 2024Inventors: Todd A. HINCK, Michael T. CROCKER, Xiang LI, Vijaya K. BODDU
-
Patent number: 11728665Abstract: In some examples, a control unit is configured to adjust charge termination voltage of a rechargeable energy storage device. The control unit is adapted to charge the rechargeable energy storage device to a charge termination voltage where the rechargeable energy storage device has capacity to support peak load but comes close to a system shutdown voltage after supporting peak load. The control unit is also adapted to increase the charge termination voltage if a voltage of the rechargeable energy storage device is near a system shutdown voltage after supporting peak load.Type: GrantFiled: April 15, 2021Date of Patent: August 15, 2023Assignee: Intel CorporationInventors: Naoki Matsumura, Simon N. Peffers, Steven Lloyd, Michael T. Crocker, Aaron Gorius
-
Publication number: 20230180434Abstract: A two-phase immersion cooling system for integrated circuit assemblies may be formed utilizing a heat dissipation device thermally coupled to at least one integrated circuit device, wherein the heat dissipation device includes at least one surface and at least one projection extending from the at least one surface, wherein the at least one projection includes at least one sidewall, and wherein the at least one sidewall of the at least one projection includes at least one surface area enhancement structure. Utilizing such a heat dissipation device can boost nucleate boiling, improve boiling performance, reduce superheat required to initiate boiling, boost the critical heat flux during boiling, and can translate to a greater number of integrated circuit devices/packages that can be placed into a single immersion cooling system.Type: ApplicationFiled: December 6, 2021Publication date: June 8, 2023Applicant: Intel CorporationInventors: David Shia, Jin Yang, Jimmy Chuang, Mohanraj Prabjugoud, Michael T. Crocker
-
Patent number: 11349734Abstract: Examples may include racks for a data center and sleds for the racks, the sleds arranged to house physical resources for the data center. The sleds and racks can be arranged to be autonomously manipulated, such as, by a robot. The sleds and racks can include features to facilitate automated installation, removal, maintenance, and manipulation by a robot.Type: GrantFiled: July 9, 2019Date of Patent: May 31, 2022Assignee: Intel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Michael T. Crocker
-
Publication number: 20220107465Abstract: Apparatus and methods employing wormhole structures supporting ultra-high density optical routing systems. Microstructures comprising wormhole tunnels are formed in optical looms with wormhole openings arranged in patterns, such as a high-density XY grid. Optical fibers are inserted into respective wormhole tunnels, and sleeves are used to precisely align fiber ends. A rack loom comprising a wormhole backplane is fabricated in a similar manner, with wormhole openings arrayed in the same patterns. The sleeves comprise plug-receptacle sleeve pairs, where when an optical loom (or connector bar of the optical loom) face urged toward the front face of the rack loom, the plug and receptacle sleeves are mated, resulting in precise alignment of the optical fiber ends in the pairs of sleeves. Palpebral structures may also be fabricated to provide a self-cleaning function with optional lubrication.Type: ApplicationFiled: December 16, 2021Publication date: April 7, 2022Inventors: Ralph JENSEN, Michael T. CROCKER, Aaron GORIUS, Kevin P. MA
-
Publication number: 20220107741Abstract: Racks and rack pods to support a plurality of sleds are disclosed herein. Switches for use in the rack pods are also disclosed herein. A rack comprises a plurality of sleds and a plurality of electromagnetic waveguides. The plurality of sleds are vertically spaced from one another. The plurality of electromagnetic waveguides communicate data signals between the plurality of sleds.Type: ApplicationFiled: December 13, 2021Publication date: April 7, 2022Inventors: Matthew J. ADILETTA, Myles WILDE, Aaron GORIUS, Michael T. CROCKER, Paul H. DORMITZER, Mark A. SCHMISSEUR
-
Patent number: 11233712Abstract: Technologies for connecting data cables in a data center are disclosed. In the illustrative embodiment, racks of the data center are grouped into different zones based on the distance from the racks in a given zone to a network switch. All of the racks in a given zone are connected to the network switch using data cables of the same length. In some embodiments, certain physical resources such as storage may be placed in racks that are in zones closer to the network switch and therefore use shorter data cables with lower latency. An orchestrator server may, in some embodiments, schedule workloads or create virtual servers based on the different zones and corresponding latency of different physical resources.Type: GrantFiled: December 30, 2016Date of Patent: January 25, 2022Assignee: Intel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Michael T. Crocker
-
Publication number: 20210400813Abstract: Examples described herein relate to an apparatus that includes a flexible conductor covered in an insulative material and at least one conductor region in contact with the flexible conductor. In some examples, melting of the at least one conductor region is to cause a conductive coupling of the flexible conductor with a second conductor and wherein the flexible conductor is adapted to conductively couple a first circuit board oriented orthogonal to a second circuit board. In some examples, the at least one conductor region comprises at least one solder ball of a grid array. In some examples, the at least one conductor region is re-solderable.Type: ApplicationFiled: June 22, 2021Publication date: December 23, 2021Inventors: Jonathan W. THIBADO, Aaron GORIUS, Michael T. CROCKER, Matthew J. ADILETTA, John C. GULICK, Emery E. FREY
-
Patent number: 11200104Abstract: Racks and rack pods to support a plurality of sleds are disclosed herein. Switches for use in the rack pods are also disclosed herein. A rack comprises a plurality of sleds and a plurality of electromagnetic waveguides. The plurality of sleds are vertically spaced from one another. The plurality of electromagnetic waveguides communicate data signals between the plurality of sleds.Type: GrantFiled: November 29, 2017Date of Patent: December 14, 2021Assignee: Intel CorporationInventors: Matthew J. Adiletta, Myles Wilde, Aaron Gorius, Michael T. Crocker, Paul H. Dormitzer, Mark A. Schmisseur
-
Publication number: 20210385971Abstract: Examples described herein relate to a system. The system can include a container that contains fluid to provide two phase immersion liquid cooling (2PILC) for a system within the container. The container can enclose a first circuit board with a first side of the first circuit board is conductively coupled to at least one device. The container can enclose a motherboard conductively coupled to a second side of the first circuit board with a first side of the motherboard is conductively coupled to the second side of the first circuit board. The motherboard can include at least four edges. Connectors can conductively connect the motherboard with a second circuit board. The second circuit board can include at least four edges and an edge of the motherboard is oriented approximately 90 degrees to an edge of the second circuit board. At least one device can include one or more of: a processor, memory device, accelerator device, or network interface.Type: ApplicationFiled: June 2, 2021Publication date: December 9, 2021Inventors: Aaron GORIUS, Michael T. CROCKER, Jonathan W. THIBADO, Matthew J. ADILETTA, John C. GULICK, Emery E. FREY
-
Publication number: 20210234377Abstract: In some examples, a control unit is configured to adjust charge termination voltage of a rechargeable energy storage device. The control unit is adapted to charge the rechargeable energy storage device to a charge termination voltage where the rechargeable energy storage device has capacity to support peak load but comes close to a system shutdown voltage after supporting peak load. The control unit is also adapted to increase the charge termination voltage if a voltage of the rechargeable energy storage device is near a system shutdown voltage after supporting peak load.Type: ApplicationFiled: April 15, 2021Publication date: July 29, 2021Applicant: Intel CorporationInventors: Naoki Matsumura, Simon N. Peffers, Steven Lloyd, Michael T. Crocker, Aaron Gorius
-
Patent number: 10985587Abstract: In some examples, a control unit is configured to adjust charge termination voltage of a rechargeable energy storage device. The control unit is adapted to charge the rechargeable energy storage device to a charge termination voltage where the rechargeable energy storage device has capacity to support peak load but comes close to a system shutdown voltage after supporting peak load. The control unit is also adapted to increase the charge termination voltage if a voltage of the rechargeable energy storage device is near a system shutdown voltage after supporting peak load.Type: GrantFiled: August 7, 2018Date of Patent: April 20, 2021Assignee: Intel CorporationInventors: Naoki Matsumura, Simon N. Peffers, Steven Lloyd, Michael T. Crocker, Aaron Gorius
-
Patent number: 10910746Abstract: Sleds for operation in racks of data centers are disclosed herein. A sled includes a circuit board substrate, one or more physical resources, and one or more memory devices. The circuit board substrate has a top side and a bottom side arranged opposite the top side. The one or more physical resources are coupled to the top side of the circuit board substrate. The one or more memory devices are coupled to the bottom side of the circuit board substrate. Additionally, the sled includes a connector to electrically couple the one or more physical resources to the one or more memory devices.Type: GrantFiled: December 3, 2018Date of Patent: February 2, 2021Assignee: Intel CorporationInventors: Russell Aoki, Aaron Gorius, Michael T. Crocker, Matthew J. Adiletta
-
Patent number: 10788630Abstract: Technologies for blind mating of optical connectors in a rack of a data center are disclosed. In the illustrative embodiment, a sled can be slid into a rack and an optical connector on the sled will blindly mate with a corresponding optical connector on the rack. The illustrative optical connector on the sled includes two guide post receivers which mate with corresponding guide posts on the optical connector on the rack such that, when mated, optical fibers of the optical connector on the rack will be aligned and optically coupled with corresponding optical fibers on the optical connector of the sled.Type: GrantFiled: December 30, 2016Date of Patent: September 29, 2020Assignee: Intel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Michael T. Crocker
-
Patent number: 10674238Abstract: Examples may include racks for a data center and sleds for the racks, the sleds arranged to house physical resources for the data center. The sleds can house physical resources and heat sinks thermally coupled to the physical resources. The physical resources are arranged on the sleds and the heat sinks are configured so as to limit thermal shadowing between physical resources to reduce interference with airflow provided by fans of the racks.Type: GrantFiled: February 2, 2017Date of Patent: June 2, 2020Assignee: Intel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Michael T. Crocker
-
Publication number: 20200052494Abstract: In some examples, a control unit is configured to adjust charge termination voltage of a rechargeable energy storage device. The control unit is adapted to charge the rechargeable energy storage device to a charge termination voltage where the rechargeable energy storage device has capacity to support peak load but comes close to a system shutdown voltage after supporting peak load. The control unit is also adapted to increase the charge termination voltage if a voltage of the rechargeable energy storage device is near a system shutdown voltage after supporting peak load.Type: ApplicationFiled: August 7, 2018Publication date: February 13, 2020Applicant: Intel CorporationInventors: Naoki Matsumura, Simon N. Peffers, Steven Lloyd, Michael T. Crocker, Aaron Gorius
-
Publication number: 20190387291Abstract: Examples may include racks for a data center and sleds for the racks, the sleds arranged to house physical resources for the data center. The sleds and racks can be arranged to be autonomously manipulated, such as, by a robot. The sleds and racks can include features to facilitate automated installation, removal, maintenance, and manipulation by a robot.Type: ApplicationFiled: July 9, 2019Publication date: December 19, 2019Inventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Michael T. Crocker
-
Patent number: 10474460Abstract: Technologies for optical communication in a rack cluster in a data center are disclosed. In the illustrative embodiment, a network switch is connected to each of 1,024 sleds by an optical cable that enables communication at a rate of 200 gigabits per second. The optical cable has low loss, allowing for long cable lengths, which in turn allows for connecting to a large number of sleds. The optical cable also has a very high intrinsic bandwidth limit, allowing for the bandwidth to be upgraded without upgrading the optical infrastructure.Type: GrantFiled: September 3, 2018Date of Patent: November 12, 2019Assignee: Intel CorporationInventors: Matthew J. Adiletta, Aaron Gorius, Myles Wilde, Michael T. Crocker