Patents by Inventor Michael T. Crocker
Michael T. Crocker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7490479Abstract: According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.Type: GrantFiled: March 30, 2005Date of Patent: February 17, 2009Assignee: Intel CorporationInventors: Tod A. Byquist, Michael T. Crocker
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Publication number: 20080282775Abstract: According to some embodiments, a test fluid may be provided into a chamber associated with a cooling system for an electronic integrated circuit. Moreover, a valve may be partially inserted into an opening of the chamber to seal the chamber. The valve may include a first sealing portion to seal the chamber at the opening when the valve shaft is inserted the first distance. The valve may then be inserted an intermediate distance, between the first distance and a second distance, to unseal the chamber. Note that the valve may include a second sealing portion, offset from the first sealing portion, to seal the chamber at the opening when the valve is inserted the second distance. The valve may further define a passage, between the first and second sealing portions, to permit a flow of the test fluid when the valve is inserted the intermediate distance.Type: ApplicationFiled: July 28, 2008Publication date: November 20, 2008Inventors: Russell S. Aoki, Michael T. Crocker, Daniel P. Carter
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Patent number: 7430119Abstract: According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the plurality of fins may be aligned to an impeller inlet velocity angle. The impeller inlet velocity angle may be based on an operational speed of the plurality of blades and an angle of the plurality of blades with respect to a center of the impeller.Type: GrantFiled: September 29, 2006Date of Patent: September 30, 2008Assignee: Intel CorporationInventors: Gavin D. Stanley, Kazimierz L. Kozyra, Daniel P. Carter, Michael T. Crocker
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Patent number: 7418998Abstract: According to some embodiments, a first sealing portion is provided on a valve shaft to seal a chamber. The first sealing portion may, for example, seal the chamber when the valve shaft is inserted a first distance into an opening of the chamber. A second sealing portion may also be provided on the valve shaft to seal the chamber when the valve shaft is inserted a second distance into the opening.Type: GrantFiled: June 30, 2005Date of Patent: September 2, 2008Assignee: Intel CorporationInventors: Russell S. Aoki, Michael T. Crocker, Daniel P. Carter
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Patent number: 7400503Abstract: According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented with respect to the axis.Type: GrantFiled: July 26, 2007Date of Patent: July 15, 2008Assignee: Intel CorporationInventors: Michael T. Crocker, Daniel P. Carter, Kazimierz L. Kozyra
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Publication number: 20080080139Abstract: According to some embodiments, an apparatus may comprise a cold plate comprising a plurality of fins and an impeller comprising a plurality of blades. An output fluid velocity angle defined by the plurality of fins may be aligned to an impeller inlet velocity angle. The impeller inlet velocity angle may be based on an operational speed of the plurality of blades and an angle of the plurality of blades with respect to a center of the impeller.Type: ApplicationFiled: September 29, 2006Publication date: April 3, 2008Inventors: Gavin D. Stanley, Kazimierz L. Kozyra, Daniel P. Carter, Michael T. Crocker
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Patent number: 7273090Abstract: According to some embodiments, systems for an integrated cold plate and heat exchanger may be provided. In some embodiments, a device may comprise a cold plate to transfer heat to a fluid and a heat spreader integral with the cold plate, the heat spreader to accept heat from an electronic device. In some embodiments, the heat spreader and the cold plate are monolithic.Type: GrantFiled: June 29, 2005Date of Patent: September 25, 2007Assignee: Intel CorporationInventors: Michael T. Crocker, Daniel P. Carter
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Patent number: 7262967Abstract: According to some embodiments, systems for low cost coaxial liquid cooling may be provided. In some embodiments, a system may comprise an axis. The system may further comprise a heat exchanger coupled to a pump, wherein the heat exchanger and the pump are oriented with respect to the axis.Type: GrantFiled: June 29, 2005Date of Patent: August 28, 2007Assignee: Intel CorporationInventors: Michael T. Crocker, Daniel P. Carter, Kazimierz L. Kozyra
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Patent number: 7200934Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.Type: GrantFiled: September 5, 2003Date of Patent: April 10, 2007Assignee: Intel CorporationInventors: Daniel P. Carter, Michael T. Crocker, Ben M. Broili, Tod A. Byquist, David J. Llapitan
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Patent number: 7143820Abstract: A system in which a heat exchanger includes a core, a plurality of fins extending outwardly from the core, and an element disposed within the cavity of the core. The heat exchanger also includes a first cap coupled to the first end of the core, and a second cap coupled to the second end of the core where the second cap comprises an inlet and an outlet.Type: GrantFiled: December 31, 2004Date of Patent: December 5, 2006Assignee: Intel CorporationInventors: Michael T. Crocker, Daniel P. Carter
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Patent number: 7124811Abstract: According to some embodiments, systems for an integrated pump and cold plate may be provided. In some embodiments, a pump may comprise a housing defining an inlet to accept a fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, and a cold plate disposed at least partially within the housing. In some embodiments, the pump may also or alternatively comprise a motor to power the impeller, wherein the motor comprises a rotor and at least two magnets disposed within the housing and at least two electromagnetic coils disposed outside of the housing.Type: GrantFiled: December 31, 2004Date of Patent: October 24, 2006Assignee: Intel CorporationInventors: Michael T. Crocker, Daniel P. Carter, Kazimierz L. Kozyra
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Patent number: 7117931Abstract: According to some embodiments, systems for low cost liquid cooling may be provided. In some embodiments, a system may comprise a core having a first end and a second end, wherein the core defines a cavity extending between the first and second ends, a plurality of fins extending outwardly from the core between the first and second ends, an inlet to accept a fluid, an outlet to evacuate the fluid, and a shaped element disposed within the cavity of the core, wherein the shaped element is to direct the fluid within the cavity. According to some embodiments, the system may further comprise a pump that may comprise a housing defining an inlet to accept the fluid and an outlet to evacuate the fluid, an impeller disposed within the housing, wherein the impeller is to move the fluid toward the outlet, a motor to power the impeller, and a cold plate disposed at least partially within the housing.Type: GrantFiled: December 31, 2004Date of Patent: October 10, 2006Assignee: Intel CorporationInventors: Michael T. Crocker, Daniel P. Carter
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Patent number: 7120020Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.Type: GrantFiled: November 19, 2003Date of Patent: October 10, 2006Assignee: Intel CorporationInventors: Daniel P. Carter, Michael T. Crocker
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Patent number: 6902377Abstract: A fan impeller is part of a fan assembly designed to maximize both intake and expelled air during use. The fan impeller employs a distinct airfoil shape for the fan blades to substantially move the ambient air. A low constant blade angle and overlapping blades are employed to improve the blade lift and consequent mass flow and exit pressure. The blade stall is eliminated, as evidenced by a smoothened fan curve, for more efficient operation. The blade sweep angle is optimally arranged to control radial flow characteristics of the ambient air. Housing sidewalls are removed from the fan assembly to remove parasitic drag and improve the motion of air passing through the fan.Type: GrantFiled: April 21, 2003Date of Patent: June 7, 2005Assignee: Intel CorporationInventor: Michael T. Crocker
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Publication number: 20040208746Abstract: A fan impeller is part of a fan assembly designed to maximize both intake and expelled air during use. The fan impeller employs a distinct airfoil shape for the fan blades to substantially move the ambient air. A low constant blade angle and overlapping blades are employed to improve the blade lift and consequent mass flow and exit pressure. The blade stall is eliminated, as evidenced by a smoothened fan curve, for more efficient operation. The blade sweep angle is optimally arranged to control radial flow characteristics of the ambient air. Housing sidewalls are removed from the fan assembly to remove parasitic drag and improve the motion of air passing through the fan.Type: ApplicationFiled: April 21, 2003Publication date: October 21, 2004Inventor: Michael T. Crocker
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Publication number: 20040080914Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.Type: ApplicationFiled: November 19, 2003Publication date: April 29, 2004Applicant: Intel Corporation.Inventors: Daniel P. Carter, Michael T. Crocker, Ben M. Broili, Tod A. Byquist, David J. Llapitan
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Publication number: 20040045163Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.Type: ApplicationFiled: September 5, 2003Publication date: March 11, 2004Applicant: Intel CorporationInventors: Daniel P. Carter, Michael T. Crocker, Ben M. Broili, Tod A. Byquist, David J. Llapitan
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Patent number: 6671172Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.Type: GrantFiled: September 10, 2001Date of Patent: December 30, 2003Assignee: Intel CorporationInventors: Daniel P. Carter, Michael T. Crocker, Ben M. Broili, Tod A. Byquist, David J. Llapitan
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Patent number: 6657862Abstract: Non-prismatic radial folded fin heat sinks include fin arrays comprised of folded fins joined to a thermally conductive central core. The fin arrays can have either a constant or variable bend radius. The non-prismatic radial folded fins can be made by stamping patterns into sheet metal prior to folding the sheet metal in opposite directions at various intervals to form outer and inner folds. By arranging the fins in a non-prismatic radial pattern around the central core, airflow generated by an overhead fan is better utilized, thus improving the cooling effect of the device.Type: GrantFiled: September 10, 2001Date of Patent: December 2, 2003Assignee: Intel CorporationInventors: Michael T. Crocker, Daniel P. Carter, Tod A. Byquist, Ben M. Broili
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Publication number: 20030131970Abstract: A heat sink (and method of forming a heat sink) is provided that includes a core having a central axis and a plurality of cooling fins arranged about the core. Each fin has a base and a tip. The fins may be shaped to capture a tangential component of air from the fan. At least one portion (such as upper portion) of the fins may be bent. A lower portion of each fin may also be bent.Type: ApplicationFiled: January 17, 2002Publication date: July 17, 2003Inventors: Daniel P. Carter, Michael T. Crocker, Ben M. Broili