Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

Abstract: Non-prismatic radial folded fin heat sinks include fin arrays comprised of folded fins joined to a thermally conductive central core. The fin arrays can have either a constant or variable bend radius. The non-prismatic radial folded fins can be made by stamping patterns into sheet metal prior to folding the sheet metal in opposite directions at various intervals to form outer and inner folds. By arranging the fins in a non-prismatic radial pattern around the central core, airflow generated by an overhead fan is better utilized, thus improving the cooling effect of the device.

Abstract: A socket for an electronic assembly. The socket may include a first finger that is coupled to a second finger. The socket may further have a plurality of contacts that are located within contact openings of the first and second fingers. The fingers may be separated by spaces that reduce the effective coefficient of thermal expansion.

Abstract: A socket for an electronic assembly. The socket may include a first finger that is coupled to a second finger. The socket may further have a plurality of contacts that are located within contact openings of the first and second fingers. The fingers may be separated by spaces that reduce the effective coefficient of thermal expansion.

Abstract: A socket for an electronic assembly. In one embodiment, the socket includes a first finger that is coupled to a second finger. The socket further includes a plurality of contacts that are located within contact openings of the first and second fingers. The fingers are separated by spaces that reduce the effective coefficient of thermal expansion.

Abstract: An electronic assembly which includes a heat sink that is attached to a substrate by a clip. The assembly includes an integrated circuit package that is mounted to the substrate. The clip has an arm which extends around an edge of the substrate and attaches the heat sink to the substrate. The clip also presses the heat sink into the package. Attaching the heat sink directly to the package may reduce the flatness requirements of the sink and the cost of producing the assembly.

Abstract: A fastener for an electronic assembly. The fastener may have a spring arm that extends from a stem. The fastener can attach a cover to a heat sink of an electronic assembly. The stem may be inserted into a boss of the cover. The spring arm may exert a force onto the heat sink to press the sink into an integrated circuit package of the assembly.