Patents by Inventor Michael Teich
Michael Teich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10698025Abstract: Probe systems and methods for collecting an optical image of a device under test (DUT) are disclosed herein. The probe systems include a chuck, a chuck thermal module, an enclosure, an imaging device, and a flow-regulating structure. The chuck defines a support surface configured to support a substrate and the chuck thermal module is configured to regulate a temperature of the chuck. The enclosure defines an enclosed volume, which contains the support surface of the chuck, and an aperture. The imaging device is at least partially external the enclosed volume and the enclosure and the imaging device defines a gap therebetween. The gap at least partially defines a fluid conduit that permits fluid flow between the enclosed volume and an external region. The flow-regulating structure is configured to regulate fluid flow through the fluid conduit. The methods include methods of utilizing the systems.Type: GrantFiled: June 19, 2019Date of Patent: June 30, 2020Assignee: FormFactor Beaverton, Inc.Inventors: Michael Teich, Axel Becker
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Publication number: 20200025823Abstract: Probe systems and methods for collecting an optical image of a device under test (DUT) are disclosed herein. The probe systems include a chuck, a chuck thermal module, an enclosure, an imaging device, and a flow-regulating structure. The chuck defines a support surface configured to support a substrate and the chuck thermal module is configured to regulate a temperature of the chuck. The enclosure defines an enclosed volume, which contains the support surface of the chuck, and an aperture. The imaging device is at least partially external the enclosed volume and the enclosure and the imaging device defines a gap therebetween. The gap at least partially defines a fluid conduit that permits fluid flow between the enclosed volume and an external region. The flow-regulating structure is configured to regulate fluid flow through the fluid conduit. The methods include methods of utilizing the systems.Type: ApplicationFiled: June 19, 2019Publication date: January 23, 2020Inventors: Michael Teich, Axel Becker
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Patent number: 10281492Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting assembly extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting assembly includes an electrically conductive support surface, which is configured to support a substrate that includes the DUT. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly.Type: GrantFiled: October 5, 2017Date of Patent: May 7, 2019Assignee: FormFactor Beaverton, Inc.Inventors: Michael Teich, Karsten Stoll, Walter Matthias Clauss, Swen Schmiedchen
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Publication number: 20180031608Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting assembly extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting assembly includes an electrically conductive support surface, which is configured to support a substrate that includes the DUT. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting assembly.Type: ApplicationFiled: October 5, 2017Publication date: February 1, 2018Inventors: Michael Teich, Karsten Stoll, Walter Matthias Clauss, Swen Schmiedchen
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Publication number: 20170292974Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting stack extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting stack includes an electrically conductive support surface and a temperature-controlled chuck. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting stack.Type: ApplicationFiled: April 8, 2016Publication date: October 12, 2017Inventors: Michael Teich, Karsten Stoll, Walter Matthias Clauss, Swen Schmiedchen
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Patent number: 9784763Abstract: Shielded probe systems are disclosed herein. The shielded probe systems are configured to test a device under test (DUT) and include an enclosure that defines an enclosure volume, a translation stage with a stage surface, a substrate-supporting stack extending from the stage surface, an electrically conductive shielding structure, an isolation structure, and a thermal shielding structure. The substrate-supporting stack includes an electrically conductive support surface and a temperature-controlled chuck. The electrically conductive shielding structure defines a shielded volume. The isolation structure electrically isolates the electrically conductive shielding structure from the enclosure and from the translation stage. The thermal shielding structure extends within the enclosure volume and at least partially between the enclosure and the substrate-supporting stack.Type: GrantFiled: April 8, 2016Date of Patent: October 10, 2017Assignee: Cascade Microtech, Inc.Inventors: Michael Teich, Karsten Stoll, Walter Matthias Clauss, Swen Schmiedchen
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Publication number: 20170248973Abstract: Probe systems and methods including active environmental control are disclosed herein. The methods include placing a substrate, which includes a device under test (DUT), on a support surface of a chuck. The support surface extends within a measurement environment that is at least partially surrounded by a measurement chamber. The methods further include determining a variable associated with a moisture content of the measurement environment and receiving a temperature associated with the measurement environment. The methods also include supplying a purge gas stream to the measurement chamber at a purge gas flow rate and selectively varying the purge gas flow rate such that a dew point temperature of the measurement environment is within a target dew point temperature range. The methods further include providing a test signal to the DUT and receiving a resultant signal from the DUT. The systems include probe systems that perform the methods.Type: ApplicationFiled: February 29, 2016Publication date: August 31, 2017Inventors: Michael Teich, Jörg Kiesewetter, Ulf Hackius, Frank Zill, Mirko Kreher
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Patent number: 9632108Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.Type: GrantFiled: April 2, 2014Date of Patent: April 25, 2017Assignee: HSBC Bank USA, National AssociationInventors: Michael Teich, Stojan Kanev, Hans-Jurgen Fleischer
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Patent number: 9395411Abstract: In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.Type: GrantFiled: July 29, 2013Date of Patent: July 19, 2016Assignee: CASCADE MICROTECH, INC.Inventors: Joerg Kiesewetter, Stojan Kanev, Michael Teich, Karsten Stoll, Axel Schmidt
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Patent number: 9254533Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.Type: GrantFiled: June 7, 2012Date of Patent: February 9, 2016Assignee: GlobalFoundries, Inc.Inventors: Jerome D. Cohen, Robert G. Haas, Enrico Herz, Michael Teich, Christopher L. Tessler
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Publication number: 20140239991Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.Type: ApplicationFiled: April 2, 2014Publication date: August 28, 2014Applicant: CASCADE MICROTECH, INC.Inventors: Michael Teich, Stojan Kanev, Hans-Jurgen Fleischer
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Patent number: 8800952Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.Type: GrantFiled: March 28, 2012Date of Patent: August 12, 2014Assignee: International Business Machines CorporationInventors: Jerome D. Cohen, Robert G. Haas, Enrico Herz, Michael Teich, Christopher L. Tessler
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Patent number: 8692567Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.Type: GrantFiled: July 31, 2009Date of Patent: April 8, 2014Inventors: Michael Teich, Stojan Kanev, Hans-Jurgen Fleischer
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Publication number: 20140028337Abstract: In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.Type: ApplicationFiled: July 29, 2013Publication date: January 30, 2014Applicant: Cascade Microtech, Inc.Inventors: Joerg Kiesewetter, Stojan Kanev, Michael Teich, Karsten Stoll, Axel Schmidt
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Patent number: 8497693Abstract: In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.Type: GrantFiled: October 1, 2008Date of Patent: July 30, 2013Assignee: Cascade Microtech, Inc.Inventors: Joerg Kiesewetter, Stojan Kanev, Michael Teich, Karsten Stoll, Axel Schmidt
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Patent number: 8344744Abstract: An arrangement is provided for testing DUTs with a chuck that has a support surface for supporting of a DUT as well as for supplying the support surface with a defined potential, or for connecting the DUT. The arrangement further includes a positioning device for positioning the chuck as well as an electromagnetic shielding housing enclosing at least the chuck. Inside the housing and adjacent to the chuck, a signal preamplifier is arranged whose signal port facing the chuck is electrically connected with the support surface, wherein the signal preamplifier is moveable together with the chuck by the positioning device in a way that it holds its position constant relative to the chuck during positioning. The signal preamplifier is connected to a measurement unit outside of the housing via a measurement cable.Type: GrantFiled: June 18, 2010Date of Patent: January 1, 2013Assignee: Cascade Microtech, Inc.Inventors: Axel Schmidt, Botho Hirschfeld, Stojan Kanev, Andrej Rumiantsev, Michael Teich
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Publication number: 20120241116Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.Type: ApplicationFiled: June 7, 2012Publication date: September 27, 2012Applicants: SUSS MICROTEC, INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jerome D. Cohen, Robert G. Haas, Enrico Herz, Michael Teich, Christopher L. Tessler
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Patent number: 8240650Abstract: A chuck with triaxial construction comprises a receiving surface for a test substrate and arranged below the receiving surface: an electrically conductive first surface element, an electrically conductive second surface element electrically insulated therefrom, and an electrically conductive third surface element electrically insulated therefrom, and, between the first and the second surface element, a first insulation element and, between the second and the third surface element, a second insulation element.Type: GrantFiled: March 14, 2008Date of Patent: August 14, 2012Assignee: Cascade Microtech, Inc.Inventors: Michael Teich, Karsten Stoll, Axel Schmidt, Stojan Kanev, Jörg Kiesewetter
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Patent number: 8237086Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.Type: GrantFiled: January 16, 2008Date of Patent: August 7, 2012Assignees: International Business Machines Corporation, Suss MicrotecInventors: Jerome D. Cohen, Robert G. Haas, Enrico Herz, Michael Teich, Christopher L. Tessler
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Publication number: 20120186771Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.Type: ApplicationFiled: March 28, 2012Publication date: July 26, 2012Applicants: SUSS Micro Tec, INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jerome D. Cohen, Robert G. Haas, Enrico Herz, Michael Teich, Christopher L. Tessler