Abstract: A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method.

Abstract: A focused multi-planar image acquisition in real time even while a test object is moving, is achieved with a system and a method for a focused multi-planar image acquisition in a prober. When a surface of a test object is positioned laterally in relation to tips of separated probe needles, a microscope is focused on the surface of the test object at a first time and on a plane of the probe needles at a second time. The objective lens is provided with a microscope objective lens focusing system, which can focus the objective lens, independently of a vertical adjustment drive of the microscope, on the surface of the test object in a first focal plane and in a second focal plane, which is on a level with the probe needle tips.

Abstract: Disclosed is a method and apparatus for the correction of defective solder bump arrays arranged in a plurality of cavities in a mold. In the method, a faulty solder bump is searched, identified and located (i.e., its position is determined) in an arrangement of solder bumps disposed in cavities of a mold and the faulty solder bump is subsequently replaced by a prefabricated solder bump. The apparatus for carrying out the method comprises a mold holder, a scanning and locating device for finding and locating faulty solder bumps and a repair device for replacing the faulty solder bump by a prefabricated solder bump.

Abstract: A method and an apparatus for verifying or testing test substrates, i.e. wafers and other electronic semiconductor components, in a prober under defined thermal conditions. Such a verifying apparatus, known to the person skilled in the art as a prober, has a housing having at least two housing sections, in one housing section of which, designated hereinafter as test chamber, the test substrate to be verified is held by a chuck and is set to a defined temperature, and in the other housing section of which, designated hereinafter as probe chamber, probes are held. For verification purposes, the test substrate and the probes are positioned relative to one another by means of at least one positioning device and the probes subsequently make contact with the test substrate.

Abstract: An arrangement is provided for testing DUTs with a chuck that has a support surface for supporting of a DUT as well as for supplying the support surface with a defined potential, or for connecting the DUT. The arrangement further includes a positioning device for positioning the chuck as well as an electromagnetic shielding housing enclosing at least the chuck. Inside the housing and adjacent to the chuck, a signal preamplifier is arranged whose signal port facing the chuck is electrically connected with the support surface, wherein the signal preamplifier is moveable together with the chuck by the positioning device in a way that it holds its position constant relative to the chuck during positioning. The signal preamplifier is connected to a measurement unit outside of the housing via a measurement cable.

Abstract: In a system and a method for capturing images in a prober, the surface of a test object is illuminated in succession with light of a first, second and third color; an image capturing device records a gray scale image of the surface; and a composite image is produced from the three gray scale images by an image evaluating device. The object is to qualitatively improve the image capturing, in order to raise the positioning accuracy by an improved display, as a result of which, finely structured test objects can be used. This object is achieved in that the lighting device is designed as a unit, controlled by the image evaluating unit, produces at least three colors and includes at least one light emitting diode (LED) as the lighting source.

Abstract: A focused multi-planar image acquisition in real time even while a test object is moving, is achieved with a system and a method for a focused multi-planar image acquisition in a prober. When a surface of a test object is positioned laterally in relation to tips of separated probe needles, a microscope is focused on the surface of the test object at a first time and on a plane of the probe needles at a second time. The objective lens is provided with a microscope objective lens focusing system, which can focus the objective lens, independently of a vertical adjustment drive of the microscope, on the surface of the test object in a first focal plane and in a second focal plane, which is on a level with the probe needle tips.

Abstract: In a method and a device for testing a test substrate under defined thermal conditions, a substrate that is to be tested is held by a temperature-controllable chuck and is set to a defined temperature; the test substrate is positioned relative to test probes by at least one positioning device; and the test probes make contact with the test substrate for testing purposes. At least one component of the positioning device that is present in the vicinity of the temperature-controlled test substrate is set to a temperature that is independent of the temperature of the test substrate by a temperature-controlling device, and this temperature is held constant.

Abstract: A device for rapidly changing objectives with threaded fastening on an optical instrument comprises an instrument adaptor which has, at one end, an external thread corresponding to the external thread of the objective, and, at the other end, a bayonet mount for fixably holding a bayonet base, and an objective adaptor which has, at one end, a bayonet base which can be connected to the bayonet mount of the instrument adaptor, and, at the other end, an internal thread corresponding to the internal thread of the optical instrument.

Abstract: A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method.

Abstract: A probe for temporarily electrically contacting a solar cell for testing purposes, has at least one elastic, electrically conductive contact element for producing the electrical contact, at least one reference sensor for indicating a distance of the contact element to an external reference surface using an electrical signal of the reference sensor, and a mounting plane to which the tip of the contact element is oriented. The probe ensures a secure electrical contact of the solar cell in a testing station with minimal mechanical stress, and is also suitable for use in an industrial continuous production method.

Abstract: In a method and devices for forming a temporary electrical contact to a solar cell for testing purposes, probes form a contact to the electrode terminals of a solar cell held by a sample holder. The probes are held by a probe holder and exhibit an elastic, electrically conductive contact element and at least one reference sensor. In order to form a contact, the solar cell and the probes are positioned in relation to each other, and then a probe is placed on an electrode terminal of the solar cell. To this end, a feed motion of the probe is carried out until a reference sensor of the probe generates a reference signal upon reaching a predefined distance. Then the feed motion is continued by a predefined path that goes beyond the contact element making contact with the electrode terminal, in order to carry out an overtravel.

Abstract: Methods of removing material from a defective opening in a glass mold using a laser pulse, repairing a glass mold and a related glass mold for injection molded solder (IMS) are disclosed. In one embodiment, a method includes providing a glass mold including a plurality of solder filled openings; identifying a defective opening in the glass mold; removing material from the defective opening by applying a laser pulse to the defective opening; and repairing the defective opening by filling the defective opening with an amount of solder by: removing a redundant, non-defective solder portion from an opening in the glass mold by applying a laser pulse to the opening, and placing the redundant, non-defective solder portion in the defective opening.

Abstract: A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method.

Abstract: A chuck with triaxial construction comprises a receiving surface for a test substrate and arranged below the receiving surface: an electrically conductive first surface element, an electrically conductive second surface element electrically insulated therefrom, and an electrically conductive third surface element electrically insulated therefrom, and, between the first and the second surface element, a first insulation element and, between the second and the third surface element, a second insulation element.

Abstract: The invention relates to a system and a method for capturing images in a prober. According to the invention, the surface of a test object is illuminated in succession with light of a first, second and third color; and an image capturing device records a gray scale image of the surface; and a composite image is produced from the three gray scale images by means of an image evaluating device. The object of the invention is to qualitatively improve the image capturing, in order to raise the positioning accuracy by means of an improved display, as a result of which, finely structured test objects can be used. This object of the invention is achieved in that the lighting device is designed as a unit, which can be controlled by the image evaluating unit and which produces at least three colors and which exhibits at least one light emitting diode (LED) as the lighting means.

Abstract: The invention relates to a device for rapidly changing objectives with threaded fastening on an optical instrument. The object of the present invention of specifying a device which in the case of a microscope with a threaded connection for the objective substantially simplifies the interchange of the objective and greatly shortens the time required for the interexchange, is achieved by a device for removably fitting an objective with an external thread on a corresponding internal thread of an optical instrument which comprises an instrument adaptor which has at one end an external thread corresponding to the external thread of the objective, and at the other end, a bayonet mount for fixably holding a bayonet base, and comprises an objective adaptor which has at one end a bayonet base which can be connected to the bayonet mount of the instrument adaptor, and at the other end an internal thread corresponding to the internal thread of the optical instrument.

Abstract: Disclosed is a method and apparatus for the correction of defective solder bump arrays arranged in a plurality of cavities in a mold. In the method, a faulty solder bump is searched, identified and located (i.e., its position is determined) in an arrangement of solder bumps disposed in cavities of a mold and the faulty solder bump is subsequently replaced by a prefabricated solder bump. The apparatus for carrying out the method comprises a mold holder, a scanning and locating device for finding and locating faulty solder bumps and a repair device for replacing the faulty solder bump by a prefabricated solder bump.

Abstract: A focused multi-planar image acquisition in real time, even while a test object is moving is achieved with a system and a method for a focused multi-planar image acquisition in a prober. When a surface of a test object is positioned laterally in relation to tips of separated probe needles, a microscope is focused on the surface of the test object at a first time and on a plane of the probe needles at a second time. The objective lens is provided with a microscope objective lens focusing system, which can focus the objective lens, independently of a vertical adjustment drive of the microscope, on the surface of the test object in a first focal plane and in a second focal plane, which is on a level with the probe needle tips.