Patents by Inventor Michael W. Cumbie

Michael W. Cumbie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11904312
    Abstract: The present disclosure is drawn to microfluidic devices. A microfluidic device can include a substrate, a lid mounted to the substrate, and a microchip mounted to the substrate. The lid mounted to the substrate can form a discrete microfluidic chamber between structures including an interior surface of the lid and a portion of the substrate. The lid can include an inlet and a vent positioned relative to one another to facilitate loading of fluid to the discrete microfluidic chamber via capillary action. A portion of the microchip can be positioned within the discrete microfluidic chamber.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: February 20, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hilary Ely, Adam Higgins, Rachel M. White, Erik D. Torniainen, Tod Woodford, Michael W. Cumbie, Chien-Hua Chen
  • Publication number: 20240050974
    Abstract: In some examples, a fluid dispensing device includes a fluid chamber, a heating element adjacent the fluid chamber, and an orifice adjacent the fluid chamber. A ratio of an area of a surface of the heating element to an orifice area of the orifice is greater than or equal to 3, where the surface of the heating element faces the fluid chamber.
    Type: Application
    Filed: March 9, 2021
    Publication date: February 15, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Alexander N. Govyadinov, Michael W. CUMBIE, Craig A. OLBRICH, Erik D. TORNIAINEN, Omer GILA
  • Patent number: 11897259
    Abstract: A fluid ejection device includes a plurality of fluid actuation devices, a plurality of memory cells, and a configuration register. Each memory cell of the plurality of memory cells corresponds to a fluid actuation device of the plurality of fluid actuation devices. The configuration register stores data to enable or disable access to the plurality of memory cells.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: February 13, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, James Michael Gardner, Michael W. Cumbie
  • Publication number: 20230391086
    Abstract: An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten ?m and two hundred ?m, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.
    Type: Application
    Filed: August 23, 2023
    Publication date: December 7, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Michael G. Groh
  • Publication number: 20230356524
    Abstract: A fluid ejection device includes a plurality of fluid actuation devices, a plurality of memory cells, and a configuration register. Each memory cell of the plurality of memory cells corresponds to a fluid actuation device of the plurality of fluid actuation devices. The configuration register stores data to enable or disable access to the plurality of memory cells.
    Type: Application
    Filed: July 14, 2023
    Publication date: November 9, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, James Michael Gardner, Michael W. Cumbie
  • Publication number: 20230356525
    Abstract: An integrated circuit to drive a plurality of fluid actuation devices includes a status register, a plurality of interfaces, and control logic. The plurality of interfaces include a mode interface, a data interface, and a fire interface. The control logic enables reading of the status register in response to a signal on the mode interface transitioning to logic high with a logic high signal on the data interface, and transitioning a signal on the fire interface to logic high with the signal on the single data interface floating.
    Type: Application
    Filed: July 21, 2023
    Publication date: November 9, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, James Michael Gardner, Michael W. Cumbie
  • Publication number: 20230356527
    Abstract: In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.
    Type: Application
    Filed: July 14, 2023
    Publication date: November 9, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Anthony M. Fuller, Chien-Hua Chen
  • Patent number: 11807005
    Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.
    Type: Grant
    Filed: March 28, 2023
    Date of Patent: November 7, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-Lam J. Choy
  • Patent number: 11780227
    Abstract: At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.
    Type: Grant
    Filed: June 25, 2019
    Date of Patent: October 10, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, Michael G Groh
  • Publication number: 20230302790
    Abstract: A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays. A data block is associated with each of the plurality of fluidic actuator arrays. The die includes an interface comprising a data pad and a clock pad, wherein a data bit value present at the data pad is loaded into a first data block corresponding to a first fluidic actuator array on a rising clock edge and loaded into a second data block corresponding to a second fluidic actuator array on a falling clock edge.
    Type: Application
    Filed: May 25, 2023
    Publication date: September 28, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, James Michael Gardner, Michael W. Cumbie
  • Patent number: 11760085
    Abstract: An integrated circuit to drive a plurality of fluid actuation devices includes a configuration register, a plurality of interfaces, and control logic. The plurality of interfaces include a mode interface and a data interface. The control logic enables writing to the configuration register in response to a signal on the mode interface transitioning to logic high with a logic high signal on the data interface.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: September 19, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, James Michael Gardner, Michael W. Cumbie
  • Patent number: 11745507
    Abstract: In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: September 5, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Anthony M. Fuller, Chien-Hua Chen
  • Patent number: 11738562
    Abstract: A logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit, and at least one logic circuit. The logic circuit may be configured to identify, from a command stream received from the print apparatus, parameters including a class parameter, and/or identify, from the command stream, a read request, and output, via the interface, a count value in response to a read request, the count value based on identified received parameters.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: August 29, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Scott A. Linn, Stephen D. Panshin, Jefferson P. Ward, David Owen Roethig, David N. Olsen, Anthony D. Studer, Michael W. Cumbie, Sirena Chi Lu
  • Publication number: 20230264197
    Abstract: A microfluidic package may include a fluid passage, a substrate having a substrate surface adjacent an interior of the fluid passage and components inset in the substrate, the components having component surfaces adjacent the fluid passage and substantially flush with the substrate surface.
    Type: Application
    Filed: April 28, 2023
    Publication date: August 24, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Patent number: 11731419
    Abstract: A fluid ejection die includes a plurality of first memory cells, a plurality of first storage elements, and control logic. Each first memory cell stores a customization bit. Each first storage element is coupled to a corresponding first memory cell. The control logic, in response to a reset signal, reads the customization bit stored in each first memory cell and latches each customization bit in a corresponding first storage element.
    Type: Grant
    Filed: May 19, 2022
    Date of Patent: August 22, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, James Michael Gardner, Michael W. Cumbie
  • Patent number: 11725175
    Abstract: An electroporation system may include a well plate, a dispenser and a dispenser-well positioning system. The well plate may include wells, each of the wells including an interior, a first electrode adjacent the interior and a second electrode adjacent the interior and spaced from the first electrode. The first electrode and the second electrode are to apply an electrostatic field across the well. The dispenser is to dispense a cell having a diameter into each of the wells. The dispenser-well positioning system is to align each well and the dispenser such that the dispenser dispenses the cell into each well at a location spaced from the first electrode and the second electrode by a distance of at least 5 times the diameter of the cell.
    Type: Grant
    Filed: September 23, 2017
    Date of Patent: August 15, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Viktor Shkolnikov, Diane R. Hammerstad, Michael W. Cumbie
  • Publication number: 20230253021
    Abstract: An integrated circuit to drive a number of fluid actuation devices, comprising a circuit configured to have a memory access state which can be set to one of an enabled state and disabled state. The integrated circuit to include a fluid actuation circuit to transmit selection information for a fluid actuation device, the selection information comprising a data state bit. The integrated circuit to include a memory cell array, configured so that each memory cell is accessible by the memory access state being enabled, and the data state bit being set.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 10, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, James Michael Gardner, Michael W. Cumbie
  • Patent number: 11721636
    Abstract: A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.
    Type: Grant
    Filed: April 15, 2018
    Date of Patent: August 8, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Anthony M. Fuller, Michael W. Cumbie, Chien-Hua Chen
  • Patent number: 11712896
    Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: August 1, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-Iam J. Choy
  • Publication number: 20230234355
    Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.
    Type: Application
    Filed: March 28, 2023
    Publication date: July 27, 2023
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-lam J. Choy