Patents by Inventor Michael W. Cumbie

Michael W. Cumbie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10557798
    Abstract: A housing may include sidewalls and a base extending between and supported by the sidewalls. The base and the sidewalls form a cavity. The housing support they substrate. The substrate supports a surface enhanced luminescence stage between the substrate and the base.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: February 11, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Devin A. Mourey
  • Patent number: 10559512
    Abstract: A method of molding a circuit may include depositing a first epoxy mold compound (EMC) over a cavity, upon the first EMC gelling over a predetermined period of time, depositing a second EMC over the first EMC, and depositing a circuit in at least one of the first and second epoxy mold compounds. A circuit package may include a packaging and a circuit device in the packaging, wherein the packaging comprises a first EMC with a first CTE and a second EMC with a second CTE higher than the first CTE, the second EMC being dispensed onto the first EMC after the first EMC is allowed to gel to a predetermined degree.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: February 11, 2020
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Stephen Farrar
  • Publication number: 20200038872
    Abstract: An apparatus includes a polymer base layer having a surface. A die that includes a fluid manipulation surface that is substantially coplanar with the surface of the polymer base layer. The die includes a control electrode to generate an electric field to perform microfluidic manipulation of fluid across the fluid manipulation surface of the die.
    Type: Application
    Filed: April 21, 2017
    Publication date: February 6, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Viktor SHKOLNIKOV, Chien-Hua CHEN
  • Publication number: 20200031126
    Abstract: A printhead includes a number of inkjet slivers molded into a moldable substrate. The overmolded inkjet slivers form at least one die. The printhead also includes a number of wire bonds electrically coupling the inkjet slivers to a side connector. The side connector electrically couples the inkjet slivers to a controller of a printing device.
    Type: Application
    Filed: October 7, 2019
    Publication date: January 30, 2020
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie
  • Publication number: 20200023641
    Abstract: A method of forming a printbar module may include providing a printed circuit board (PCB) having a recess extending partially through the PCB and a dam surrounding the recess. An adhesive material may be applied to the recess and a printhead die sliver may be positioned in the recess. The printhead die sliver may be bonded with the PCB and the printhead die sliver and the PCB may be encapsulated with a molding compound. In response to encapsulating, a slot, extending through the PCB and the adhesive material may be formed, wherein the slot is in fluidic communication with fluid feed holes of the printhead die sliver to provide direct fluidic communication without fan-out.
    Type: Application
    Filed: August 15, 2019
    Publication date: January 23, 2020
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Patent number: 10532568
    Abstract: First electronics may determine a count of bubble jet resistors to be fired by a fire pulse group. A fire pulse generator may generate a fire pulse train for bubble jet resistors, the fire pulse train comprising a precursor pulse and a firing pulse separated by a dead time. Second electronics may adjust a width of the fire pulse for the bubble jet resistors of the fire pulse group by maintaining a first edge of the fire pulse relative to the precursor pulse and adjusting a second edge of the fire pulse relative to the precursor pulse based upon the determined count for the fire pulse group.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: January 14, 2020
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Vincent C. Korthuis, Eric T Martin, Michael W. Cumbie, Scott A Linn, Pere Esterri
  • Patent number: 10532571
    Abstract: In one example, a printhead structure includes an ejector element, a multi-layer insulator covering the ejector element, and an amorphous metal on the insulator.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: January 14, 2020
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Zhizhang Chen, James Elmer Abbott, Jr., Michael W Cumbie, Roberto A Pugliese
  • Publication number: 20190389220
    Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, and a number of heat exchangers thermally coupled to an ejection side of the fluid ejection die. Further, the fluid ejection device may include a number of cooling channels defined in the moldable material thermally coupled to the heat exchangers.
    Type: Application
    Filed: March 15, 2017
    Publication date: December 26, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, James R Przybyla
  • Patent number: 10500859
    Abstract: In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: December 10, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Publication number: 20190368911
    Abstract: A liquid level sensor circuit for measuring a liquid level in the reservoir comprising two electrodes extending into the reservoir along at least part of a height of the reservoir down to a base of the reservoir, wherein the liquid level sensor circuit is arranged to have increased sensitivity near the base.
    Type: Application
    Filed: March 14, 2017
    Publication date: December 5, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, William R. Boucher, Michael W. Cumbie
  • Publication number: 20190366719
    Abstract: In an example, a method for making a fluid ejection apparatus may include forming a molding material over a fluid passage on a back surface of printhead die, embedding the printhead die in an encapsulant in a cavity in a printed circuit board such that at least one drop ejector of the printhead die is exposed at a front side of the printed circuit board, removing the encapsulant at a back side of the printed circuit board to expose the molding material, and removing the molding material to form a fluid feed slot through which fluid may flow to the fluid passage opening in the printhead die.
    Type: Application
    Filed: August 14, 2019
    Publication date: December 5, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Devin Alexander Mourey
  • Patent number: 10493766
    Abstract: A fluid level sensing device includes a substrate (210) and a sensing die (216) cantilevered at one end from the substrate. A number of sensing components (218), preferably thermal or impedance sensing components, are disposed on the sensing die and detect a fluid level in a fluid reservoir. A protective member (208) is also cantilevered at one end from the substrate alongside the sensing die. Electrical interconnects (212) output data collected from the number of sensing components. A number of sensing dies may be provided to lengthen the sensing device, in which case the protective cover extends alongside and parallel to the number of sensing dies.
    Type: Grant
    Filed: April 21, 2016
    Date of Patent: December 3, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Devin Alexander Mourey
  • Patent number: 10479085
    Abstract: In one example, a method for fabricating a printhead is described. The method may include applying an electrical interconnect between a printhead die and an electrical fan out structure embedded in a molding of a printhead via a direct patterning additive process. The method may further include applying a passivation layer over the electrical interconnect as a dry film laminate.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: November 19, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Devin Alexander Mourey, Chien-Hua Chen, Michael W. Cumbie
  • Patent number: 10471714
    Abstract: A printhead includes a number of inkjet slivers molded into a moldable substrate. The overmolded inkjet slivers form at least one die. The printhead also includes a number of wire bonds electrically coupling the inkjet slivers to a side connector. The side connector electrically couples the inkjet slivers to a controller of a printing device.
    Type: Grant
    Filed: October 12, 2015
    Date of Patent: November 12, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Patent number: 10464324
    Abstract: A method of manufacturing a fluid flow structure may include coupling a flex circuit to a carrier. The flex circuit may include at least one conductor. The method may include coupling an orifice side of a fluidic die to the carrier at an opening on the carrier. The fluidic die may include at least one electrical terminal. The method may include coupling the electrical terminal to the conductor, and overmolding the fluid flow structure with a moldable material. The overmolded fluid flow structure may include a channel molded therein, and the channel may be fluidically coupled to the fluidic die. The conductor may be surrounded by the moldable material.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: November 5, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Publication number: 20190315125
    Abstract: Examples include a fluid ejection die. Examples comprise an ejection nozzle and an ejection chamber fluidly connected to the ejection nozzle. A fluid input hole is fluidly connected to the ejection chamber. A fluid output channel is also fluidly connected to the ejection chamber, and a fluid output hole is fluidly connected to the fluid output channel. Examples further comprise a fluid pump disposed in the fluid output channel to pump fluid from the ejection chamber out of the fluid output hole.
    Type: Application
    Filed: November 1, 2016
    Publication date: October 17, 2019
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Michael W Cumbie, Chien-Hua Chen
  • Patent number: 10434770
    Abstract: A temperature of one printing element is adjusted based upon a temperature of another of printing element.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: October 8, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Garrett E. Clark, Michael W. Cumbie, Mark H. MacKenzie, Jose Luis Valero
  • Patent number: 10438864
    Abstract: A circuit package comprises a circuit device in a first epoxy mold compound and a second epoxy mold compound of different compositions.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: October 8, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Stephen Farrar
  • Patent number: 10434774
    Abstract: Examples include a glass-based support substrate and at least one fluid ejection die coupled thereto. The at least one fluid ejection die comprises nozzles for dispensing printing material. The glass-based support substrate has a fluid communication channel formed therethrough, where the fluid communication channel is in fluid communication with the nozzles of the at least one fluid ejection die.
    Type: Grant
    Filed: November 2, 2015
    Date of Patent: October 8, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • Patent number: 10427407
    Abstract: In an example, a method for making a fluid ejection apparatus may include forming a molding material over a fluid passage on a back surface of printhead die, embedding the printhead die in an encapsulant in a cavity in a printed circuit board such that at least one drop ejector of the printhead die is exposed at a front side of the printed circuit board, removing the encapsulant at a back side of the printed circuit board to expose the molding material, and removing the molding material to form a fluid feed slot through which fluid may flow to the fluid passage opening in the printhead die.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: October 1, 2019
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, Devin Alexander Mourey