Patents by Inventor Michael W. Cumbie

Michael W. Cumbie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11227807
    Abstract: Examples for a two-step insert molding process to encapsulate a pre-molded lead frame (104, 304, 504, 704) are described herein. In some examples, a first circuit component (106, 306, 506) and a first portion of a trace array (110, 310, 510) of the pre-molded lead frame for an integrated circuit (1C) assembly are encapsulated by a first insert molding component (112, 312, 512a, 512b, 712). The trace array connects the first circuit component to a second circuit component (108, 308, 508) of the pre-molded lead frame. A second portion of the trace array is encapsulated by a second insert molding component (114, 314, 514, 714).
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: January 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Chien-Hua Chen
  • Patent number: 11225086
    Abstract: A thermal contact device may include a thermal contact die embedded in a moldable material. The thermal contact die may include a number of resistors integrated into the thermal contact die, and a number of heater drivers integrated into the thermal contact die and electronically coupled to the resistors. The moldable material is coplanar with a thermal contact side of the thermal contact device. Further, the moldable material includes at least one gradient edge along a medium feed path.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: January 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, Reynaldo V Villavelez, Chien-Hua Chen
  • Patent number: 11225074
    Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber, an opening, and a fluid actuator disposed within the ejection chamber. Each nozzle also includes an inlet passage to deliver fluid into the ejection chamber and an outlet passage to deliver fluid out of the ejection chamber. The fluidic ejection die also includes an array of channels divided into inlet channels and outlet channels. Each inlet channel is fluidly connected to a respective plurality of inlet passages and each outlet channel is fluidly connected to a respective plurality of outlet passages.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: January 18, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Chien-Hua Chen
  • Patent number: 11220107
    Abstract: The present disclosure includes a description of an example printhead having multiple ejection dies. The ejection dies are coupled to a temperature sensor and send temperature signals to a controller. The printhead can also include a heater coupled to the ejection dies to apply heat to at least one ejection die.
    Type: Grant
    Filed: February 5, 2016
    Date of Patent: January 11, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Garrett E Clark, Michael W. Cumbie, Mark H. MacKenzie
  • Patent number: 11214065
    Abstract: A fluid ejection device includes a fluid ejection die including a substrate and a fluid architecture supported by the substrate, and a molded body molded around the fluid ejection die, with the molded body interlocked with the fluid architecture of the fluid ejection die.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: January 4, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W Cumbie, Chien-Hua Chen
  • Publication number: 20210402782
    Abstract: A circuit die may include an outermost circuit layer having electrical transmission routing and an alignment target overlying the outermost circuit layer.
    Type: Application
    Filed: April 15, 2018
    Publication date: December 30, 2021
    Inventors: Anthony M. Fuller, Michael W. Cumbie, Chien-Hua Chen
  • Publication number: 20210372840
    Abstract: A logic circuitry package includes an interface to communicate with a print apparatus logic circuit and at least one logic circuit including at least one heater and a temperature sensor. The at least one logic circuit is configured to receive, via the interface, a heater command to address the at least one heater. The at least one logic circuit is configured to receive, via the interface, subsequent to the heater command, a sensor command corresponding to a sensor ID to address the temperature sensor. The at least one logic circuit is configured to transmit, via the interface, a digital value in response to the sensor command. The digital value corresponds to a print material level of a print material within a reservoir.
    Type: Application
    Filed: October 25, 2019
    Publication date: December 2, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Michael W. CUMBIE, James Michael GARDNER, Scott A. LINN
  • Patent number: 11186082
    Abstract: An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and separated from the fluidic die. A conductive lead may provide an electrical coupling between a ground of the fluidic die and the conductive element.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: November 30, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie
  • Patent number: 11186090
    Abstract: Examples include a fluid ejection die embedded in a molded panel. The fluid ejection die comprises a substrate, and the substrate includes an army of nozzles extending therethrough. The substrate has a first surface in which nozzle orifices are formed and a second surface, opposite the first surface, in which nozzle inlet openings are formed. The fluid ejection die is embedded in the molded panel such that the first surface of the substrate is approximately planar with a top surface of the molded panel. The molded panel has a fluid channel formed therethrough in fluid communication with the nozzle inlet openings of the array of nozzles.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: November 30, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Erik D Torniainen
  • Patent number: 11183437
    Abstract: In some examples, a circuit package includes a packaging, and a circuit device in the packaging, where the packaging comprises a first EMC having a first coefficient of thermal expansion (CTE), and a second EMC having a second CTE higher than the first CTE. The second EMC is on the first EMC that has gelled over time.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: November 23, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Stephen Farrar
  • Publication number: 20210354462
    Abstract: A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. The die includes a number of fluidic actuators, proximate to the fluid feed holes, to eject fluid received from the fluid feed holes. Circuitry on the die operates the fluidic actuators, wherein traces are provided in layers between adjacent fluid feed holes, connecting circuitry on each side of the fluid feed holes.
    Type: Application
    Filed: February 6, 2019
    Publication date: November 18, 2021
    Inventors: Michael W. Cumbie, Scott A. Linn, Anthony M. Fuller, James Michael Gardner
  • Publication number: 20210354457
    Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.
    Type: Application
    Filed: February 6, 2019
    Publication date: November 18, 2021
    Inventors: Michael W. Cumbie, James Michael Gardner, Scott A. Linn, George H. Corrigan, III
  • Publication number: 20210354455
    Abstract: A die for a printhead is provided in examples. The die includes a number of fluidic actuator arrays. A data block is associated with each of the plurality of fluidic actuator arrays. The die includes an interface comprising a data pad and a clock pad, wherein a data bit value present at the data pad is loaded into a first data block corresponding to a first fluidic actuator array on a rising clock edge and loaded into a second data block corresponding to a second fluidic actuator array on a falling clock edge.
    Type: Application
    Filed: February 6, 2019
    Publication date: November 18, 2021
    Inventors: Scott A. Linn, James Michael Gardner, Michael W. Cumbie
  • Publication number: 20210354460
    Abstract: A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. A number of fluidic actuators are proximate to the fluid feed holes, to eject fluid received from the fluid feed holes A number of field-effect transistors are parallel to the fluid feed holes, where each of the fluidic actuators is powered by an associated field effect transistor. Logic circuitry to actuate the plurality of field-effect transistors is disposed on the die on an opposite side of the fluid feed holes from the field-effect transistors, wherein traces, disposed between the fluid feed holes, electrically couple the logic circuitry to the field-effect transistors. The die has a repeating structure comprising one fluid feed hole, two fluidic actuators, and two field-effect transistors placed at an interval of two times a dot pitch in a line along the die.
    Type: Application
    Filed: February 6, 2019
    Publication date: November 18, 2021
    Inventors: James Michael Gardner, Anthony M. Fuller, Michael W. Cumbie
  • Publication number: 20210354458
    Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.
    Type: Application
    Filed: February 6, 2019
    Publication date: November 18, 2021
    Inventors: Michael W. Cumbie, Robert N. K. Browning, James Michael Gardner
  • Publication number: 20210354461
    Abstract: A die for a printhead is described herein. The die includes a number of fluid feed holes disposed in a line parallel to a longitudinal axis of the die, wherein the fluid feed holes are formed through a substrate of the die. A number of fluidic actuators are proximate to the fluid feed holes to eject fluid received from the plurality of fluid feed holes. The die includes logic circuitry to operate the fluidic actuators, wherein the logic circuitry is disposed on a first side of the plurality of fluid feed holes. Power circuitry to power the plurality of fluidic actuators is disposed on an opposite side of the fluid feed holes from the logic circuitry. Activation traces are disposed between each of the fluid feed holes to couple the logic circuitry to the power circuitry.
    Type: Application
    Filed: February 6, 2019
    Publication date: November 18, 2021
    Inventors: James Michael Gardner, Anthony M. Fuller, Michael W. Cumbie, Scott A. Linn
  • Publication number: 20210354456
    Abstract: An integrated circuit to drive a number of fluid actuation devices, comprising a circuit configured to have a memory access state which can be set to one of an enabled state and disabled state. The integrated circuit to include a fluid actuation circuit to transmit selection information for a fluid actuation device, the selection information comprising a data state bit. The integrated circuit to include a memory cell array, configured so that each memory cell is accessible by the memory access state being enabled, and the data state bit being set.
    Type: Application
    Filed: February 6, 2019
    Publication date: November 18, 2021
    Inventors: Scott A. Linn, James Michael Gardner, Michael W. Cumbie
  • Publication number: 20210354472
    Abstract: A logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit, and at least one logic circuit. The logic circuit may be configured to identify, from a command stream received from the print apparatus, parameters including a class parameter, and/or identify, from the command stream, a read request, and output, via the interface, a count value in response to a read request, the count value based on identified received parameters.
    Type: Application
    Filed: May 5, 2019
    Publication date: November 18, 2021
    Inventors: James Michael GARDNER, Scott A. LINN, Stephen D. PANSHIN, Jefferson P. WARD, David Owen ROETHIG, David N. OLSEN, Anthony D. STUDER, Michael W. CUMBIE, Sirena Chi LU
  • Patent number: 11155086
    Abstract: In one example in accordance with the present disclosure, a fluidic ejection device is described. The device includes a fluidic ejection die embedded in a moldable material. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages. The device also includes the moldable material which includes supply slots to deliver fluid to and from the fluidic ejection die. A carrier substrate of the device supports the fluidic ejection die and moldable material.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: October 26, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Si-Iam Choy, Michael W Cumbie, Chien-Hua Chen, Jeffrey R Pollard
  • Publication number: 20210323315
    Abstract: A fluid ejection device may include fluid actuators, ejection chambers adjacent the fluid actuators, nozzles extending from the ejection chambers, and fluid feed holes to supply fluid from a fluid supply passage to the ejection chambers. The fluid feed holes have ports connected to the ejection chambers. The ports are sized to pass bubbles formed by the fluid actuators out of the ejection chambers.
    Type: Application
    Filed: January 9, 2019
    Publication date: October 21, 2021
    Inventors: Garrett E. Clark, Michael W. CUMBIE