Abstract: A fluid thermal processing device may include a substrate, a platform projecting from the substrate, a fluid heating element supported by the platform, a temperature sensing element, distinct from the fluid heating element, supported by the platform and an enclosure supported by and cooperating with the substrate to form a fluid chamber about the platform. The fluid chamber forms a volume of uniform thickness conforming to and about the platform.

Abstract: In one example in accordance with the present disclosure, a fluid ejection device assembly is described. The fluid ejection device assembly includes a monolithically molded fluidic structure to extend between a separately molded body comprising a print fluid reservoir and a fluid ejection device. The fluidic structure includes a plenum to receive a print fluid from the body at a fluidic interface.

Abstract: A fluid ejection device may include a fluid ejection die including nozzles and fluid feed holes. Each nozzle may have a nozzle orifice formed in a top surface of the fluid ejection die. The fluid feed holes may be formed in a bottom surface of the fluid ejection die and fluidly connected to the nozzles. The fluid ejection device may include a molded panel into which the fluid ejection die is at least partially embedded, the molded panel having a fluid slot formed therethrough such that the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die, the molded panel formed with a mold chase and a release liner coupled to and at least partially covering an interior surface of the mold chase, the mold chase having a fluid slot feature corresponding to the fluid slot.

Abstract: An integrated circuit to drive a number of fluid actuation devices, comprising a circuit configured to have a memory access state which can be set to one of an enabled state and disabled state. The integrated circuit to include a fluid actuation circuit to transmit selection information for a fluid actuation device, the selection information comprising a data state bit. The integrated circuit to include a memory cell array, configured so that each memory cell is accessible by the memory access state being enabled, and the data state bit being set.

Abstract: An integrated circuit includes a plurality of memory cells, an address decoder to select memory cells based on a data signal, activation logic to activate selected memory cells based on the data signal and a fire signal, and configuration logic to enable or disable access to the plurality of memory cells.

Abstract: An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten ?m and two hundred ?m, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.

Abstract: An integrated circuit to drive a plurality of fluid actuation devices includes a status register, a plurality of interfaces, and control logic. The plurality of interfaces include a mode interface, a data interface, and a fire interface. The control logic enables reading of the status register in response to a signal on the mode interface transitioning to logic high with a logic high signal on the data interface, and transitioning a signal on the fire interface to logic high with the signal on the single data interface floating.

Abstract: An example overfill-tolerant microfluidic structure can include an inlet microfluidic channel. A sample chamber can be connected to the inlet microfluidic channel to receive liquid from the inlet microfluidic channel. A gas-permeable liquid barrier can be connected to the sample chamber and positioned to allow gas to flow out of the sample chamber. An overflow chamber can be connected to the inlet microfluidic channel. A capillary break can be positioned between the inlet microfluidic channel and the overflow chamber. The capillary break can include a narrowed opening with a smaller width than a width of the inlet microfluidic channel. In some examples, the gas-permeable liquid barrier can allow gas to flow out of the sample chamber at a pressure lower than the break pressure, and prevent liquid from flowing out of the sample chamber at the break pressure.

Abstract: In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies.

Abstract: A fluid ejection device includes a plurality of fluid actuation devices, a plurality of memory cells, and a configuration register. Each memory cell of the plurality of memory cells corresponds to a fluid actuation device of the plurality of fluid actuation devices. The configuration register stores data to enable or disable access to the plurality of memory cells.

Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.

Abstract: An integrated circuit includes a plurality of memory cells, an address decoder to select memory cells based on a data signal, activation logic to activate selected memory cells based on the data signal and a fire signal, and configuration logic to enable or disable access to the plurality of memory cells.

Abstract: An example digital microfluidic device can include a hydrophobic electrowetting surface including an array of electrodes. The individual electrodes can have a shape with three or more sides. The array of electrodes can include a parking electrode and an adjacent electrode that is adjacent to the parking electrode. A cover can be positioned over the electrowetting surface at a gap distance sufficient to accommodate a liquid droplet between the cover and the electrowetting surface. A plurality of droplet barriers can be positioned on three or more sides of the parking electrode. The droplet barriers can constrain movement of a liquid droplet from the parking electrode to the adjacent electrode.

Abstract: A fluid ejection device includes a plurality of fluid actuation devices, a plurality of memory cells, and a configuration register. Each memory cell of the plurality of memory cells corresponds to a fluid actuation device of the plurality of fluid actuation devices. The configuration register stores data to enable or disable access to the plurality of memory cells.

Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.

Abstract: The present disclosure is drawn to microfluidic devices. A microfluidic device can include a substrate, a lid mounted to the substrate, and a microchip mounted to the substrate. The lid mounted to the substrate can form a discrete microfluidic chamber between structures including an interior surface of the lid and a portion of the substrate. The lid can include an inlet and a vent positioned relative to one another to facilitate loading of fluid to the discrete microfluidic chamber via capillary action. A portion of the microchip can be positioned within the discrete microfluidic chamber.

Abstract: In some examples, a fluid dispensing device includes a fluid chamber, a heating element adjacent the fluid chamber, and an orifice adjacent the fluid chamber. A ratio of an area of a surface of the heating element to an orifice area of the orifice is greater than or equal to 3, where the surface of the heating element faces the fluid chamber.

Abstract: A fluid ejection device includes a plurality of fluid actuation devices, a plurality of memory cells, and a configuration register. Each memory cell of the plurality of memory cells corresponds to a fluid actuation device of the plurality of fluid actuation devices. The configuration register stores data to enable or disable access to the plurality of memory cells.

Abstract: An example device may comprise a molded structure and a dependent device coupled to the molded structure. The molded structure comprises thermo-electric traces and channels. The channels are between ten ?m and two hundred ?m, or less in one dimension. The dependent device comprises apertures corresponding to the channels and through which fluids, electromagnetic radiation, or a combination thereof is to travel. The dependent device also comprises contacts corresponding to the thermo-electric traces of the molded structure.

Abstract: In various examples, a fluid ejection device may include a fluid ejection die formed with a first material and that includes a bondpad and a plurality of fluid ejectors, and a cover layer adjacent the fluid ejection die. The cover may be formed with a second material that is different than the first material and may include a first region that overlays the bondpad and a second region that overlays the plurality of fluid ejectors. In various examples, the first and second regions are separated by a break in the cover layer. The break may be filled with a third material that is different than one or both of the first and second material.