Patents by Inventor Michael W. Cumbie
Michael W. Cumbie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11590495Abstract: A method may include maintaining a sample comprising an ionic species and an optical indicator at an elevated temperature above 25° C. on a semi-conductive microfluidic die during an incubation period, intermittently interrogating the sample with an interrogating light during the incubation period and sensing a response of the sample to the interrogating light, wherein the sample is interrogated with the interrogating light only during those times at which the sample is being sensed.Type: GrantFiled: July 28, 2017Date of Patent: February 28, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Hilary Ely, Matthew David Smith, Jeremy Sells, George H. Corrigan, Michael W. Cumbie, Chantelle Domingue
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Patent number: 11583861Abstract: In an example implementation, a reagent storage system for a microfluidic device includes a microfluidic chamber formed in a microfluidic device. A blister pack to store a reagent includes an electrically conductive membrane barrier adjacent to the chamber. A thinned region is formed in the membrane barrier, and a conductive trace is to supply electric current to heat and melt the thinned region. Melting the thinned region is to cause the membrane barrier to open and release the reagent into the chamber.Type: GrantFiled: October 30, 2017Date of Patent: February 21, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Viktor Shkolnikov, Michael W Cumbie, Chien-Hua Chen
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Patent number: 11577456Abstract: Examples include a process comprising forming a molded panel that includes a fluid ejection die molded in the molded panel. The molded panel is formed with a mold chase and a release liner. The mold chase has a fluid slot feature that aligns with fluid feed holes of the fluid ejection die. The mold chase and release liner is released from the molded panel such that the molded panel has a fluid slot formed therethrough corresponding to the fluid slot feature of the mold chase, and the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die.Type: GrantFiled: May 1, 2017Date of Patent: February 14, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chien-Hua Chen, Michael W Cumbie
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Patent number: 11565521Abstract: According to an example, a fluid ejection device may include a membrane including a first column of firing chambers, a second column of firing chambers, and a portioning wall, in which the portioning wall physically separates the first column of firing chambers from the second column of firing chambers. The fluid ejection device may also include a plurality of actuators and a substrate including a respective hole extending through the substrate from each of the firing chambers, in which an actuator of the plurality of actuators is provided in each of the firing chambers.Type: GrantFiled: July 26, 2016Date of Patent: January 31, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chien-Hua Chen, Michael W. Cumbie
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Publication number: 20230025338Abstract: An example fluidic device comprises a fluid reservoir having a porous media arranged within the reservoir, and a capillary structure. The capillary structure is in fluid communication with the porous media and the fluid reservoir and has tuned parameters corresponding to parameters of the fluid reservoir and the porous media. Wherein fluid within the capillary structure is to change level in response to pressure changes in the reservoir.Type: ApplicationFiled: December 18, 2019Publication date: January 26, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Robert S Wickwire, David N Olsen, Michael W Cumbie
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Patent number: 11559985Abstract: An integrated circuit for a fluidic die including an address bus to communicate a set of addresses, a first group of die configuration functions including a first address driver to drive a first portion of an address of the set of addresses on the address bus, a second group of die configuration functions including a second address driver to drive a second portion of the address of the set of addresses on the address bus, and an array of fluid actuating devices addressable by the set of addresses communicated via the address bus.Type: GrantFiled: February 6, 2019Date of Patent: January 24, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Scott A. Linn, James Michael Gardner, Michael W. Cumbie
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Publication number: 20230018474Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.Type: ApplicationFiled: September 23, 2022Publication date: January 19, 2023Inventors: Michael W. Cumbie, James Michael Gardner, Scott A. Linn, George H. Corrigan, III
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Patent number: 11548287Abstract: In one example in accordance with the present disclosure, a fluidic die assembly is described. The fluidic die assembly includes a rigid substrate having a bend therein. A fluidic die is disposed on the rigid substrate. The fluidic die is to eject fluid from a reservoir fluidly coupled to the fluidic die. The fluidic die includes an array of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid, an opening, and a fluid actuator to eject a portion of the volume of fluid through the opening. The fluidic die assembly also includes an electrical interface disposed on the rigid substrate to establish an electrical connection between the fluidic die and a controller. The fluidic die and the electrical interface are disposed on a same surface on opposite sides of the bend.Type: GrantFiled: November 14, 2018Date of Patent: January 10, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chien-Hua Chen, Michael W. Cumbie
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Publication number: 20230001697Abstract: An example fluidic device comprises a fluid reservoir and a capillary structure. The fluid reservoir has a porous media arranged within and the capillary structure is in fluid communication with the porous media reservoir and the fluid reservoir. The capillary structure has tuned parameters corresponding to parameters of the porous media. An internal fluid path of the capillary structure enables three or more fill readings based on a height of a fluid within the capillary structure and further based on the tuned parameters of the capillary structure.Type: ApplicationFiled: December 18, 2019Publication date: January 5, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Robert S Wickwire, David N Olsen, Michael W Cumbie
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Patent number: 11541659Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.Type: GrantFiled: August 12, 2020Date of Patent: January 3, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Silam J Choy, Michael W Cumbie, Devin Alexander Mourey, Chien-Hua Chen
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Publication number: 20220410163Abstract: In one example an apparatus can include a controller communicatively coupled to a droplet dispenser to deposit fluid on a digital microfluidic (DMF) array including a plurality of droplet manipulation electrodes, the controller to: select a first droplet manipulation electrode from the plurality of droplet manipulation electrodes to on which to dispense a first volume of fluid via the droplet dispenser; position the droplet dispenser over the selected first droplet manipulation electrode; and deposit the first volume of fluid onto the selected first droplet manipulation electrode.Type: ApplicationFiled: December 9, 2019Publication date: December 29, 2022Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Michael W. Cumbie, Viktor Shkolnikov, Chien-Hua Chen
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Publication number: 20220348022Abstract: A logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit, and at least one logic circuit. The logic circuit may be configured to identify, from a command stream received from the print apparatus, parameters including a class parameter, and/or identify, from the command stream, a read request, and output, via the interface, a count value in response to a read request, the count value based on identified received parameters.Type: ApplicationFiled: July 14, 2022Publication date: November 3, 2022Inventors: James Michael GARDNER, Scott A. LINN, Stephen D. PANSHIN, Jefferson P. WARD, David Owen ROETHIG, David N. OLSEN, Anthony D. STUDER, Michael W. CUMBIE, Sirena Chi LU
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Publication number: 20220348013Abstract: A device includes a first column of contact pads. The device also includes a column of fluid actuation devices disposed longitudinally to the first column of contact pads.Type: ApplicationFiled: July 7, 2022Publication date: November 3, 2022Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: James Michael Gardner, Scott A. Linn, Michael W. Cumbie, Anthony M. Fuller
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Patent number: 11479036Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.Type: GrantFiled: February 6, 2019Date of Patent: October 25, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Michael W. Cumbie, James Michael Gardner, Scott A. Linn, George H. Corrigan, III
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Patent number: 11479046Abstract: In an example, a method includes, by logic circuitry associated with a replaceable print apparatus component installed in a print apparatus, responding to a sensor data request received from the print apparatus by returning a first response; receiving a calibration parameter from the print apparatus; and returning a second response which is different from the first response.Type: GrantFiled: April 5, 2019Date of Patent: October 25, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: James Michael Gardner, Sirena Chi Lu, Scott A. Linn, Stephen D. Panshin, David Owen Roethig, David N. Olsen, Anthony D. Studer, Michael W. Cumbie, Jefferson P. Ward
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Patent number: 11478793Abstract: In an example implementation, a microfluidic device includes a first layer with a first microfluidic channel and a second layer with a second microfluidic channel. The first and second channels are adjacent to one another at a channel intersection, and a conductive membrane valve extends across and covers the channel intersection to separate the first and second channels. The microfluidic device includes a conductive trace to open the membrane valve and join the first and second channels by supplying an electric current to heat and melt a thinned region of the membrane valve.Type: GrantFiled: October 30, 2017Date of Patent: October 25, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Viktor Shkolnikov, Chien-Hua Chen, Michael W Cumbie
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Patent number: 11472180Abstract: A device includes a plurality of fluid ejection dies, wherein each of the fluid ejection dies includes a contact pad and a plurality of fluid actuation devices. The device includes an electrical interconnect element in contact with the contact pad of each of the fluid ejection dies to electrically interconnect the plurality of fluid ejection dies.Type: GrantFiled: February 6, 2019Date of Patent: October 18, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Anthony M. Fuller, Daren L. Forrest, Michael W. Cumbie, Michael Groom, Conrad Jenssen
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Patent number: 11453222Abstract: A liquid level sensor package for a replaceable print liquid reservoir, the package including a number of heater circuits, each heater circuit including a heater element to dissipate heat and a number of control devices, each control device individually controllable to be electrically connected to the heater element, the heater element to dissipate a different amount of heat when electrically connected to different ones of the control devices.Type: GrantFiled: October 25, 2019Date of Patent: September 27, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: James Michael Gardner, Sirena Lu, Frank D. Derryberry, Michael W. Cumbie
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Publication number: 20220297113Abstract: A method of manufacturing a digital dispense apparatus includes molding a monolithic carrier structure, forming cut outs into a planar top surface of the monolithic carrier structure, the cut outs including a reservoir extending into part of a thickness of the monolithic carrier structure and fluid routing to connect the reservoir with a fluid dispense device, and overmolding the fluid dispense device into the monolithic carrier structure on a side of the monolithic carrier structure that is opposite to the reservoir to fluidically connect to the fluid routing.Type: ApplicationFiled: June 9, 2022Publication date: September 22, 2022Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Jeffrey A. NIELSEN, Michael W. CUMBIE, Devin Alexander MOUREY, Silam J. CHOY, Kenneth WARD, Christie DUDENHOEFER
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Patent number: 11440009Abstract: A method may include etching a number of holes into a carrier wafer layer to form a plurality of filters in the carrier wafer layer, patterning a chamber layer over a first side of the carrier wafer layer to form chambers above each filter formed in the carrier wafer layer, forming a layer over the chamber layer, grinding a second side of the carrier wafer layer to expose the number of holes etched into the carrier wafer layer, and bonding a molded substrate to the carrier wafer layer opposite the chamber layer.Type: GrantFiled: July 15, 2016Date of Patent: September 13, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Chien-Hua Chen, Michael W. Cumbie, Devin Alexander Mourey