Patents by Inventor Michael W. Cumbie

Michael W. Cumbie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Embedded microfluidic devices
    Patent number: 11364497
    Abstract: A microfluidic system includes, in an example, a substrate and at least two microfluidic devices embedded into the substrate, at least one of the microfluidic devices being different from a remaining number of microfluidic devices. A microfluidic apparatus includes at least two microfluidic devices embedded into a substrate, at least a first microfluidic device of the microfluidic devices being heterogenous to at least a second microfluidic device of the microfluidic devices and a microfluidic channel to fluidically couple the microfluidic devices to each other.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: June 21, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • CIRCULATION PATH FOR BUBBLER
    Publication number: 20220176708
    Abstract: In some examples, a fluid dispensing device includes an inner chamber to contain a fluid. The fluid dispensing device further includes an orifice layer comprising a bubbler orifice to draw air through a bubbler chamber to the inner chamber responsive to a pressure satisfying a criterion, the bubbler chamber being adjacent the bubbler orifice. A circulation path circulates fluid drawn through a feed hole through the bubbler chamber.
    Type: Application
    Filed: August 28, 2019
    Publication date: June 9, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Boon Bing Ng, Anthony M. Fuller, Michael W. Cumbie
  • FLUID PROPERTY SENSOR
    Publication number: 20220176707
    Abstract: A fluid property sensor may comprising an integrated circuit (IC) including a fluid level sensor, and/or a pressure sensor; and an external interface electrically coupled to a proximal end of the EC, wherein the pressure sensor may be configured to measure a flexure of the fluid property sensor.
    Type: Application
    Filed: April 5, 2019
    Publication date: June 9, 2022
    Inventors: Anthony D. STUDER, David N. OLSEN, Michael W. CUMBIE, Chien-Hua CHEN, James Michael GARDNER, Scott A. LINN
  • Integrated circuits including customization bits
    Patent number: 11351775
    Abstract: An integrated circuit to drive a plurality of fluid actuation devices includes a plurality of first memory cells, a plurality of first storage elements, and control logic. Each first memory cell stores a customization bit. Each first storage element is coupled to a corresponding first memory cell. The control logic, in response to a reset signal, reads the customization bit stored in each first memory cell and latches each customization bit in a corresponding first storage element.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: June 7, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, James Michael Gardner, Michael W. Cumbie
  • Curved fluid ejection devices
    Patent number: 11351787
    Abstract: A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: June 7, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Si-Iam J. Choy
  • Replaceable print apparatus component
    Patent number: 11345159
    Abstract: A replaceable print apparatus component includes a print material reservoir, a print material within the reservoir and a sensing system including an integrated circuit configured to connect to and communicate over a digital bus. The sensing system includes at least one sensor, a digital controller, an analog to digital converter electrically coupled to the digital controller, and a memory array electrically coupled to the digital controller. The digital controller is configured to generate a clock signal for timing operations of the integrated circuit. The operations include initiating the at least one sensor based on values stored in the memory array and generating outputs of the at least one sensor via the analog to digital converter.
    Type: Grant
    Filed: December 3, 2019
    Date of Patent: May 31, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Scott A. Linn, James Michael Gardner
  • Logic circuitry
    Patent number: 11331925
    Abstract: A sensor circuit for a replaceable print apparatus component comprises an interface to transmit signals with respect to a print apparatus logic circuit, and further comprises, connected to the interface, at least two sensor cell arrays, each array including nominally the same cells, the cells of one array being nominally different than the cells of the other array, and at least one single cell sensor that is nominally different than the other cells.
    Type: Grant
    Filed: April 5, 2019
    Date of Patent: May 17, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James Michael Gardner, Scott A. Linn, Jefferson P. Ward, David N. Olsen, Anthony D. Studer, Michael W. Cumbie, Sirena Chi Lu
  • Fluid ejection dies
    Patent number: 11331915
    Abstract: A fluid ejection device may include a fluid ejection die embedded in a moldable material, a number of fluid actuators within the fluid ejection die to recirculate fluid within a number of firing chambers of the fluid ejection die, and a number of cooling channels defined in the moldable material thermally coupled to the fluid ejection die.
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: May 17, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie
  • COPLANAR MODULAR PRINTBARS
    Publication number: 20220143883
    Abstract: In various examples, a printbar is formed from multiple modular fluid ejection subassemblies joined together through a molding process that provides for a continuous planar substrate surface. A mold may secure the modular fluid ejection subassemblies during a molding process in which a runner conveys a molding material to seams between the joined modular fluid ejection subassemblies.
    Type: Application
    Filed: July 26, 2019
    Publication date: May 12, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Si-lam J. Choy, Michael W. Cumbie
  • Method of preparing test samples
    Patent number: 11326200
    Abstract: A method of preparing a sample may include depositing an aqueous solution comprising copies of a primer into a layer of hydrophobic liquid on a substrate with a thermal inkjet device. A sample may include: a substrate; a layer of hydrophobic liquid on the substrate, the layer of hydrophobic liquid comprising a plurality of droplets of aqueous solution distributed in the layer, wherein the plurality of droplets contain: primers; a polymerase enzyme; deoxynucleotide triphosphates (dNTPs); and a target sequence for replication; and a cover, the cover contacting and covering the layer of hydrophobic liquid.
    Type: Grant
    Filed: July 22, 2016
    Date of Patent: May 10, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Devin Alexander Mourey, Si-Iam Choy
  • Print head interposers
    Patent number: 11325378
    Abstract: In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: May 10, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Michael W. Cumbie, Devin Alexander Mourey, Chien-Hua Chen
  • Fluid property sensor
    Patent number: 11318750
    Abstract: In one example, a fluid property sensor includes an electrical circuit assembly (ECA), an elongated circuit (EC), and an external interface. The EC is attached to the ECA and includes multiple point sensors distributed along a length of the EC. The external interface is electrically coupled to a proximal end of the EC. The EC and the external interface are packaged together with an encasement on both sides of the ECA to form the fluid property sensor.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: May 3, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, Anthony D. Studer
  • Cassette substrates made of polyetherimide
    Patent number: 11318458
    Abstract: A cassette may include a substrate and a die coupled to the substrate wherein the substrate is made of modified polyetherimide (PEI). A system for ejecting a fluid into an assay may include at least one dispense head, the at least one dispense head including a substrate and a die coupled to the substrate wherein the substrate is made of modified polyetherimide (PEI).
    Type: Grant
    Filed: April 3, 2017
    Date of Patent: May 3, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Gary G. Lutnesky, Paul Schweitzer, Michael W. Cumbie
  • MOLDED STRUCTURES WITH CHANNELS
    Publication number: 20220126577
    Abstract: An example fluidic device may comprise a fluidic die, a unitary molded structure, and a fluidic fan-out structure—The unitary molded structure may comprise thermo-electric traces and fluidic channels and may be coupled to the fluidic die. A first dimension of the fluidic channels is between ten ?m to two hundred ?m, or less. The fluidic fan-out structure may also be coupled to the molded structure. The fluidic die, the molded structure, and the fluidic fan-out structure may be arranged such that a first fluidic channel of the fluidic channels is in fluid communication with an aperture of the fluidic die at a first extremity and to a fluidic fan-out fluid channel through hole of the fluidic fan-out structure at a second extremity.
    Type: Application
    Filed: June 25, 2019
    Publication date: April 28, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Michael G. Groh
  • Nozzle arrangements and supply channels
    Patent number: 11305537
    Abstract: Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: April 19, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-Iam J Choy
  • FLUID PROPELLING APPARATUS INCLUDING A HEAT SINK
    Publication number: 20220111645
    Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 14, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Garrett E. Clark, Michael W. Cumbie, Chien-Hua Chen
  • MOLDED STRUCTURES WITH CHANNELS
    Publication number: 20220111647
    Abstract: At times, devices, such as semiconductor devices, may be attached to molded structures. The molded structure may have through holes or channels through which fluids and gasses (among other things) may travel, A number of processes exist for creating molded structures with through holes or channels. For instance, build up processes, such as lithography on dry film, may be used to create molded structures with through holes or channels. Substrate bonding and/or welding may also be used to yield molded structures with through holes or channels.
    Type: Application
    Filed: June 25, 2019
    Publication date: April 14, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie, Michael G Groh
  • PRINTHEADS
    Publication number: 20220105726
    Abstract: The present disclosure includes a description of an example printhead having multiple ejection dies. The ejection dies are coupled to a temperature sensor and send temperature signals to a controller. The printhead can also include a heater coupled to the ejection dies to apply heat to at least one ejection die.
    Type: Application
    Filed: December 15, 2021
    Publication date: April 7, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Garrett E. Clark, Michael W. Cumbie, Mark H. MacKenzie
  • FLUID EJECTION POLYMERIC RECIRCULATION CHANNEL
    Publication number: 20220105725
    Abstract: A fluid ejection assembly may include a fluid ejection die comprising a back face and a front face through which fluid is ejected. The fluid ejection die may further include a fan-out fluid passages converging towards the back face of the fluid ejection die, the fan-out fluid passages comprising a first fan-out fluid passage and a second fan-out fluid passage and a recirculation channel extending within a polymeric material from the first fan-out fluid passage to the second fan-out fluid passage adjacent the back face of the fluid ejection die.
    Type: Application
    Filed: June 25, 2019
    Publication date: April 7, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W. Cumbie, Si-Iam J. Choy
  • Molded die slivers with exposed front and back surfaces
    Patent number: 11292257
    Abstract: In some examples, a print cartridge comprises a printhead die that includes a die sliver molded into a molding. The die sliver includes a front surface exposed outside the molding to dispense fluid, and a back surface exposed outside the molding and flush with the molding to receive fluid. Edges of the die sliver contact the molding to form a joint between the die sliver and the molding.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: April 5, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Michael W Cumbie