Patents by Inventor Michimasa Takahashi

Michimasa Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10004145
    Abstract: A combined wiring board includes a metal frame having multiple opening portions, and multiple wiring boards accommodated in the opening portions in the metal frame, respectively. The opening portions in the metal frame have side walls having holding portions such that the holding portions hold the wiring boards in the opening portions in the metal frame, and the metal frame has slit portions adjacent to the holding portions and connecting portions connecting the slit portions to the opening portions.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: June 19, 2018
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Patent number: 9844151
    Abstract: A method for manufacturing a combined wiring board includes preparing multiple wiring boards, preparing a metal frame having opening portions which accommodate the boards, respectively, positioning the boards in the opening portions of the frame, respectively, and forming multiple crimped portions in the frame by plastic deformation such that the sidewalls of the boards bond to sidewalls of the opening portions in the frame. The preparing of the boards includes forming the sidewalls of the boards such that when the boards are positioned in the opening portions of the frame, the sidewalls of the boards form wide-space portions and narrow-space portions with respect to the sidewalls of the opening portions in the frame, and the forming of the crimped portions includes generating the deformation such that the sidewalls of the opening portions in the frame abut the narrow-space portions of the boards before the wide-space portions of the boards.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: December 12, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Patent number: 9750136
    Abstract: A wiring board includes an insulating substrate, a first conductor layer laminated on a first side of the insulating substrate, a second conductor layer laminated on a second side of the insulating substrate, first plating posts fitted in through holes in the insulating substrate respectively such that the first plating posts are projecting from the first conductor layer, and plating connecting parts connecting the second conductor layer and the first plating posts and having electronic component connecting portions such that the electronic component connecting portions form an electronic component mounting part positioned to mount an electronic component and are positioned on the through holes, respectively.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: August 29, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Michimasa Takahashi, Katsutoshi Kitagawa
  • Patent number: 9717151
    Abstract: A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: July 25, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Hirotaka Taniguchi, Dongdong Wang, Michimasa Takahashi
  • Publication number: 20170171974
    Abstract: A wiring board includes an insulating substrate, a first conductor layer laminated on a first side of the insulating substrate, a second conductor layer laminated on a second side of the insulating substrate, first plating posts fitted in through holes in the insulating substrate respectively such that the first plating posts are projecting from the first conductor layer, and plating connecting parts connecting the second conductor layer and the first plating posts and having electronic component connecting portions such that the electronic component connecting portions form an electronic component mounting part positioned to mount an electronic component and are positioned on the through holes, respectively.
    Type: Application
    Filed: December 12, 2016
    Publication date: June 15, 2017
    Applicant: IBIDEN CO., LTD.
    Inventors: MICHIMASA TAKAHASHI, KATSUTOSHI KITAGAWA
  • Patent number: 9635765
    Abstract: A method for manufacturing a combined wiring board includes preparing wiring boards, preparing a metal frame having opening portions formed to accommodate the wiring boards, respectively, positioning the wiring boards in the opening portions in the metal frame, and forming crimped portions in the metal frame by plastic deformation such that sidewalls of the metal frame in the opening portions bond sidewalls of each of the wiring boards. The crimped portions are formed such that the crimped portions in the metal frame have amounts of the plastic deformation which are set different for positions of the crimped portions in the metal frame.
    Type: Grant
    Filed: August 21, 2014
    Date of Patent: April 25, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Patent number: 9603238
    Abstract: A combined wiring board has multiple piece components each including a wiring board, and a frame component having an accommodation opening portion and holding the multiple piece components in the accommodation opening portion such that each of the piece components is fixed to the frame component at an outer rim of each of the piece components. The frame component has a thermal expansion coefficient in a planar direction which is set higher than a thermal expansion coefficient of the multiple piece components in the planar direction.
    Type: Grant
    Filed: November 11, 2013
    Date of Patent: March 21, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Michimasa Takahashi, Teruyuki Ishihara
  • Patent number: 9538663
    Abstract: A method for manufacturing a combined wiring board includes providing a metal frame having an accommodation opening portion, positioning a wiring board in the accommodation opening portion of the metal frame, and subjecting the metal frame to plastic deformation such that a sidewall of the wiring board is connected to a sidewall of the metal frame inside the accommodation opening portion of the metal frame.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: January 3, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Patent number: 9480173
    Abstract: A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer formed on first surfaces of the flexible and non-flexible substrates, a second wiring layer embedded in second surfaces of the flexible and non-flexible substrates, a first insulating layer covering the first surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the first surface of the flexible substrate, and a second insulating layer covering the second surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the second surface of the flexible substrate. The first wiring layer includes non-embedded wirings on the first surfaces of the flexible and non-flexible substrates, and the second wiring layer includes embedded wirings in the second surfaces of the flexible and non-flexible substrates.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: October 25, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi, Takashi Kariya
  • Patent number: 9425137
    Abstract: A wiring board includes multiple insulating layers including first, second, third, fourth and fifth insulation layers laminated in the order of the first, second, third, fourth and fifth insulation layers. The first insulation layer has a first conductor including plating, the second insulation layer has a second conductor including plating, the third insulation layer has a third conductor including conductive paste, the fourth insulation layer has a fourth conductor including plating, the fifth insulation layer has a fifth conductor including plating, and the first conductor, the second conductor, the third conductor, the fourth conductor and the fifth conductor are formed along the same axis and are electrically continuous with each other.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: August 23, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Nobuyuki Naganuma, Michimasa Takahashi, Masakazu Aoyama
  • Patent number: 9370101
    Abstract: A plug-in board replacement method includes preparing a board having a piece board, forming first conductive pattern on first surface of the board, forming second conductive pattern on second surface on the opposite side such that the second pattern is on the opposite side of the first pattern, irradiating laser upon the first and second surfaces along the first and second patterns such that the piece is cut out from the board, and fitting the piece into another board. The irradiating includes irradiating laser upon the first surface along the first pattern such that laser is irradiated along the border between edge portion of the first pattern and the first surface and laser upon the second surface along the second pattern such that laser is irradiated along the border between edge portion of the second pattern and the second surface such that the piece is cut out through the board.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: June 14, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Publication number: 20160095207
    Abstract: A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 31, 2016
    Applicant: IBIDEN CO., LTD.
    Inventors: Hirotaka TANIGUCHI, Dongdong WANG, Michimasa TAKAHASHI
  • Publication number: 20160066429
    Abstract: A flex-rigid wiring board includes a flexible base material structure, a rigid base material structure extending from opposite ends of the flexible base material structure, an electronic component embedded in the rigid base material structure, a first buildup layer laminated on first surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure, and a second buildup layer laminated on second surfaces of the flexible base material structure and rigid base material structure and having an exposing portion exposing the flexible base material structure. The first and second buildup layers are formed such that the flexible base material structure exposed by the exposing portions of the first and second buildup layers forms a bendable portion and that the rigid base material structure and the first and second buildup layers form non-bendable portions connected to the bendable portion.
    Type: Application
    Filed: August 27, 2015
    Publication date: March 3, 2016
    Applicant: IBIDEN CO., LTD.
    Inventors: Hirotaka TANIGUCHI, Dongdong WANG, Michimasa TAKAHASHI
  • Patent number: 9277650
    Abstract: A combined wiring board includes multiple wiring boards, and a connected metal frame having multiple metal frames and one or more connecting portions such that the metal frames are connected each other by the connecting portion or connecting portions and have accommodation opening portions formed to accommodate the wiring boards, respectively.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: March 1, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Patent number: 9277655
    Abstract: A combined wiring board includes a wiring board set having multiple wiring boards and one or more adhesive agent portions such that the wiring boards are connected each other by the adhesive agent portion or adhesive agent portions, and a metal frame having an accommodation opening portion formed to accommodate the wiring board set such that the wiring board set is positioned in the accommodation opening portion of the metal frame.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: March 1, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Teruyuki Ishihara, Michimasa Takahashi
  • Patent number: 9271405
    Abstract: A method of manufacturing a flex-rigid wiring board includes positioning a flexible board and a non-flexible substrate adjacent to each other, forming a metal layer over the flexible board such that the metal layer is formed to stop laser irradiation from reaching into the flexible board, forming an insulating layer such that the insulating layer covers the metal layer, the flexible board and the non-flexible substrate, irradiating laser upon the insulating layer such that a portion of the insulating layer covering the metal layer is cut; and removing the portion of the insulating layer covering the metal layer from the flexible board such that at least a portion of the flexible board is exposed.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: February 23, 2016
    Assignee: IBIDEN CO., LTD.
    Inventors: Michimasa Takahashi, Masakazu Aoyama
  • Patent number: 9215811
    Abstract: A method for manufacturing a multi-piece substrate includes preparing a first frame having a connecting portion to which a first piece substrate is to be connected, forming on a portion of the first piece substrate connected to a second frame a conductive pattern having a contour corresponding to the periphery of the connecting portion of the first frame, irradiating laser along the boundary between the second frame and the conductive pattern on the first piece substrate such that the first piece substrate having a joint portion which engages with the connecting portion of the first frame is detached from the second frame, and fitting the joint portion of the first piece substrate into the connecting portion of the first frame such that the first piece substrate is connected to the first frame.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: December 15, 2015
    Assignee: IBIDEN CO., LTD.
    Inventors: Michimasa Takahashi, Nobuyuki Naganuma, Toshinobu Asai, Teruyuki Ishihara
  • Publication number: 20150257269
    Abstract: A combined wiring board includes multiple metal frames arrayed in a first direction, and multiple wiring boards bonded to the metal frames such that the wiring boards are arrayed in the first direction. The metal frames directly or indirectly engage with the wiring boards such that each of the metal frames is positioned between two adjacent wiring boards of the wiring boards.
    Type: Application
    Filed: March 3, 2015
    Publication date: September 10, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Teruyuki ISHIHARA, Michimasa Takahashi
  • Publication number: 20150245474
    Abstract: A wiring board includes a first multilayer wiring board having a built-in electronic component and first conductive layers, a second multilayer wiring board having second conductive layers and positioned such that the second multilayer wiring board has a surface facing a surface of the first multilayer wiring board, and an adhesive layer including an adhesive sheet and interposed between the first multilayer wiring board and the second multilayer wiring board such that the adhesive layer is adhering the first multilayer wiring board and the second multilayer wiring board. The first multilayer wiring board has a first pad on the surface of the first multilayer wiring board, the second multilayer wiring board has a second pad on the surface of the second multilayer wiring board, and the first pad and the second pad are positioned such that the first pad and the second pad face each other across the adhesive layer.
    Type: Application
    Filed: May 8, 2015
    Publication date: August 27, 2015
    Applicant: IBIDEN CO., LTD.
    Inventors: Michimasa Takahashi, Teruyuki Ishihara
  • Patent number: 9084381
    Abstract: A method for manufacturing a flex-rigid wiring board including forming a rigid substrate including a rigid base material, a separator provided over the rigid base material, and insulation layers laminated over the rigid base material after the separator is provided, removing the separator together with a portion of the insulation layers after the laminating of the insulation layers, and forming a recessed portion configured to accommodate an electronic component according to a shape of the separator on a surface of the rigid substrate.
    Type: Grant
    Filed: November 16, 2011
    Date of Patent: July 14, 2015
    Assignee: IBIDEN CO., LTD.
    Inventor: Michimasa Takahashi