Abstract: A wiring board includes a wiring sub board having a conductive pattern, a board positioned alongside of the wiring sub board such that the board forms a boundary portion between the board and the wiring sub board, and an insulating layer made of an insulating material and continuously extending from the board to the wiring sub board such that the insulating layer is covering the boundary portion between the board and the wiring sub board. The boundary portion between the board and the wiring sub board is filled with the insulating material of the insulating layer such that the insulating material of the insulating layer is connecting the board and the wiring sub board.

Abstract: A flex-rigid wiring board includes an insulative substrate, a flexible wiring board positioned beside the insulative substrate, and an insulation layer positioned over the insulative substrate and the flexible wiring board and exposing at least a portion of the flexible wiring board. The flexible wiring board has a tapered portion which is made thinner toward the insulative substrate at an end portion of the flexible wiring board positioned beside the insulative substrate.

Abstract: This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.

Abstract: A method for manufacturing a combined wiring board includes providing a metal frame having an accommodation opening portion, positioning a wiring board in the accommodation opening portion of the metal frame, and subjecting the metal frame to plastic deformation such that a sidewall of the wiring board is connected to a sidewall of the metal frame inside the accommodation opening portion of the metal frame.

Abstract: A combined wiring board has multiple piece components each including a wiring board, and a frame component having an accommodation opening portion and holding the multiple piece components in the accommodation opening portion such that each of the piece components is fixed to the frame component at an outer rim of each of the piece components. The frame component has a thermal expansion coefficient in a planar direction which is set higher than a thermal expansion coefficient of the multiple piece components in the planar direction.

Abstract: A wiring substrate has a frame including a metal material and having a connecting portion, and a piece substrate connected to the connecting portion of the frame and having a metal pattern. The metal pattern of the piece substrate has a contour which is corresponding to an outer edge of the connecting portion of the frame.

Abstract: A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein an electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion.

Abstract: A method for manufacturing a multilayered printed circuit board including forming a first insulating resin substrate having a metal layer substantially corresponding to dimensions of a semiconductor device, forming a second insulating resin substrate, forming a recess extending to the metal layer of the first insulating resin substrate such that a surface of the metal layer is exposed, accommodating the semiconductor device in the recess such that the semiconductor device is mounted on the surface of the metal layer, and forming a resin insulating layer on the first insulating resin substrate such that the semiconductor device accommodated in the recess is covered.

Abstract: A method for manufacturing a flex-rigid wiring board, including preparing a flexible wiring board having a flexible base material and having a conductive layer over the flexible base material, making a cut in the flexible wiring board to form a cut portion, and folding at least one portion of the flexible wiring board using the cut portion to form one or more folding portions such that the flexible wiring board is extended in length, and connecting the flexible wiring board to a rigid wiring board including a rigid base material and having a conductive layer over the rigid base material.

Abstract: A wiring board and method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate, such that the first substrate extends beyond an edge of the second substrate. An IVH (Interstitial Via Hole) or through hole penetrates the base substrate and vias are formed in at least one of the first substrate or the second substrate.

Abstract: A plug-in board replacement method includes preparing a board having a piece board, forming first conductive pattern on first surface of the board, forming second conductive pattern on second surface on the opposite side such that the second pattern is on the opposite side of the first pattern, irradiating laser upon the first and second surfaces along the first and second patterns such that the piece is cut out from the board, and fitting the piece into another board. The irradiating includes irradiating laser upon the first surface along the first pattern such that laser is irradiated along the border between edge portion of the first pattern and the first surface and laser upon the second surface along the second pattern such that laser is irradiated along the border between edge portion of the second pattern and the second surface such that the piece is cut out through the board.

Abstract: A flex-rigid wiring board including a flexible wiring board, a first insulation layer positioned to a side of the flexible board and having a first hole through the first layer, a second insulation layer over the first layer and an end portion of the flexible board and with a second hole through the second layer along the axis of the first hole, a third insulation layer over the first layer and the end portion of the flexible board on the opposite side of the second layer and with a third hole through the third layer along the axis of the first hole, a first structure having a filled conductor in the first hole, a second structure having a filled conductor in the second hole along the axis of the first structure, and a third structure having a filled conductor in the third hole along the axis of the first structure.

Abstract: A wiring board and a method of forming a wiring board including a first substrate, a second substrate having a smaller mounting area than a mounting area of the first substrate, and a base substrate laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate. An IVH (Interstitial Via Hole) penetrates the base substrate.

Abstract: A manufacturing method of a printed wiring board, including forming a plurality of electrodes on a conductive layer formed on a substrate by a plating method, forming an insulation layer on the electrodes and the conductive layer, removing the substrate from the conductive layer, patterning the conductive layer except for a resistor forming region reserved for forming a resistor, thereby forming an external connection conductive pattern, and forming a resistor in the resistor forming region such that the resistor is separated by a space from the external connection conductive pattern.

Abstract: A flex-rigid wiring board including a rigid substrate including a rigid base material and a conductor layer, and a flexible substrate having a conductor layer. The conductor layer of the flexible substrate is electrically connected to the conductor layer of the rigid substrate. The rigid substrate has a recessed portion which is formed on a surface of the rigid substrate and which accommodates an electronic component.

Abstract: A flex-rigid wiring board having a flexible wiring board, a first insulation layer positioned adjacent to a side of the flexible board and having a first hole which penetrates through the first layer, a second insulation layer laminated over the flexible board and the first layer and having a second hole which penetrates through the second layer, the second hole of the second layer being formed along the axis of the first hole of the first layer, a first conductor structure formed in the first hole and including a filled conductor formed by filling plating in the first hole, and a second conductor structure formed in the second hole and including a filled conductor formed by filling plating in the second hole, the second conductor structure being formed along the axis of the first conductor structure and electrically connected to the first conductor structure.

Abstract: A wiring board including a main substrate having a base material and a conductive pattern formed on the base material, and a flex-rigid printed wiring board provided to the main substrate and having a rigid substrate and a flexible substrate connected to each other. The flex-rigid printed wiring board has a conductive pattern formed on the rigid substrate and/or the flexible substrate. The conductive pattern of the main substrate is electrically connected to the conductive pattern of the flex-rigid printed wiring board.

Abstract: A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer including an inorganic material and covering the flexible board and the non-flexible substrate, the insulating layer exposing at least one portion of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.

Abstract: A method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate.

Abstract: A wiring board has a base substrate, a conductive pattern formed on the base substrate, an insulation layer formed on the conductive pattern and the base substrate and including a resin-impregnated inorganic cloth, a conductive pattern formed on the insulating layer, a via formed in the insulation layer and connecting the conductive pattern formed on the base substrate and the conductive pattern formed on the insulating layer, and a through-hole connected to the conductive pattern formed on the base substrate, penetrating through the base substrate and having a hole diameter in a range of 10 ?m to 150 ?m.