Patents by Inventor Michimasa Takahashi
Michimasa Takahashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7929313Abstract: In a method of manufacturing a multilayer printed circuit board, a first insulating resin base material is formed. A resin surface of a second insulating resin base material formed by attaching copper foil on a surface of a resin-insulating layer is unified with the first insulating resin base material. A conductor circuit is formed on the second insulating resin base material and a via hole electrically connecting to the conductor circuit. A concave portion is formed from a resin-insulating layer surface in a conductor circuit non-formation area of the first insulating resin base material. A semiconductor element is housed within the concave portion and adhered with an adhesive. A resin-insulating layer is formed by coating the semiconductor element and a via hole.Type: GrantFiled: November 3, 2009Date of Patent: April 19, 2011Assignee: Ibiden Co., Ltd.Inventors: Sotaro Ito, Michimasa Takahashi, Yukinobu Mikado
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Patent number: 7902463Abstract: A printed wiring board includes an insulation layer having a surface, electrodes embedded in the insulation layer, a resistor formed on the surface of the insulation layer and electrically connected to the electrodes, and an external connection conductive pattern formed over the surface of the insulation layer and electrically connected to one or more electrodes. The insulation layer and the electrodes form a component-mounting surface on the surface of the insulation layer, the component-mounting surface is substantially leveled with the surface of the insulation layer and includes a resistor forming region on which the resistor is formed, and the external connection conductive pattern is separated by a space from the resistor.Type: GrantFiled: August 24, 2007Date of Patent: March 8, 2011Assignee: Ibiden, Co. Ltd.Inventors: Michimasa Takahashi, Yukinobu Mikado, Hiroyuki Yanagisawa
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Patent number: 7834273Abstract: A multilayer printed wiring board comprises a plurality of insulating layers which is about 100 ?m or less in thickness and a plurality of conductor circuits formed on the insulating layers. Each of a plurality of viaholes electrically connecting conductor circuits on the insulating layers to each other is formed tapered inwardly from the surface of the insulating layer and the viaholes are disposed opposite to each other to form a multistage stacked vias.Type: GrantFiled: July 6, 2006Date of Patent: November 16, 2010Assignee: Ibiden Co., Ltd.Inventors: Michimasa Takahashi, Yukinobu Mikado, Takenobu Nakamura, Masakazu Aoyama
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Publication number: 20100252318Abstract: A multilayer printed wiring board including insulating layers, conductor layers stacked alternately over the insulating layers, respectively, and viaholes formed in the insulation layers and electrically connecting the conductor layers through the insulation layers. The viaholes include a first group of viaholes and a second group of viaholes. The viaholes in the first group are tapered toward the viaholes in the second group, and the viaholes in the second group are tapered toward the viaholes in the first group. The viaholes in the first group and the the viaholes in the second group are formed in the insulating layers, respectively, and the viaholes are formed by plating openings formed after lamination of respective ones of the insulating layers, and each of the insulating layers is about 100 ?m or less in thickness.Type: ApplicationFiled: June 21, 2010Publication date: October 7, 2010Applicant: IBIDEN CO., LTD.Inventors: Michimasa TAKAHASHI, Yukinobu Mikado, Takenobu Nakamura, Masakazu Aoyama
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Patent number: 7759582Abstract: A multilayer printed wiring board comprises insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof.Type: GrantFiled: July 6, 2006Date of Patent: July 20, 2010Assignee: Ibiden Co., Ltd.Inventors: Michimasa Takahashi, Yukinobu Mikado, Takenobu Nakamura, Masakazu Aoyama
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Publication number: 20100155130Abstract: A multilayer printed wiring board comprises insulating layers and conductor layers being stacked alternately on each other. The conductor layers are electrically connected to each other through viaholes formed in the insulating layers. Each of the viaholes is formed to bulge in a direction generally orthogonal to the direction of thickness of the insulating layer. The multilayer printed wiring board is to have electronic components such as a capacitor, IC and the like mounted on the surface layer thereof.Type: ApplicationFiled: February 26, 2010Publication date: June 24, 2010Applicant: IBIDEN CO., LTD.Inventors: Michimasa Takahashi, Yukinobu Mikado, Takenobu Nakamura, Masakazu Aoyama
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Publication number: 20100155109Abstract: A flex-rigid wiring board including a rigid wiring board including a rigid base material and having a conductive layer over the rigid base material, and a flexible wiring board including a flexible base material and having a conductive layer over the flexible base material. The conductive layer of the flexible wiring board is electrically connected to the conductive layer of the rigid wiring board. The flexible wiring board has a cut portion and one or more folding portions formed by using the cut portion and folding one or more portions of the flexible wiring board such that the flexible wiring board is extended in length.Type: ApplicationFiled: July 1, 2009Publication date: June 24, 2010Applicant: IBIDEN CO., LTD.Inventor: Michimasa TAKAHASHI
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Publication number: 20100159647Abstract: A multilayer printed circuit board, wherein, on a resin-insulating layer that houses a semiconductor element, another resin-insulating layer and a conductor circuit are formed with conductor circuits electrically connected through a via hole, wherein a electromagnetic shielding layer is formed on a resin-insulating layer surrounding a concave portion for housing a semiconductor element or on the inner wall surface of the concave portion, and the semiconductor element is embedded in the concave portion.Type: ApplicationFiled: November 3, 2009Publication date: June 24, 2010Applicant: IBIDEN CO., LTD.Inventors: Sotaro ITO, Michimasa Takahashi, Yukinobu Mikado
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Publication number: 20100139967Abstract: A wiring board includes an insulating board, wiring sub boards, and insulating layers having via holes in which conductors are formed by plating. The insulating board and the wiring sub boards are horizontally laid out. The insulating layers are laid out to respectively cover a first boundary portion between the insulating board and each of the wiring sub boards, and a second boundary portion between the wiring sub boards, and continuously extend from the insulating board to wiring sub boards. Resins which constitute the insulating layers are filled in the first boundary portion and the second boundary portion. The conductors are electrically connected to the wiring layers.Type: ApplicationFiled: August 7, 2009Publication date: June 10, 2010Applicant: IBIDEN CO., LTD.Inventor: Michimasa Takahashi
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Publication number: 20100132980Abstract: A wiring board includes an insulating board, a wiring sub board having a wiring layer, and an insulating layer. The insulating layer has a via hole in which a conductor is formed by plating. The insulating board and the wiring sub board are horizontally laid out. The insulating layer is laid out to cover a boundary portion between the insulating board and the wiring sub board and continuously extends from the insulating board to the wiring sub board. A resin which constitutes the insulating layer is filled in the boundary portion. The conductor is electrically connected to the wiring layer.Type: ApplicationFiled: August 7, 2009Publication date: June 3, 2010Applicant: IBIDEN CO., LTD.Inventor: Michimasa TAKAHASHI
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Patent number: 7718901Abstract: An electronic parts substrate includes a base substrate, a plurality of insulating resin layers provided on the base substrate, at least one conductive circuit, and at least one filled via provided in the plurality of insulating resin layers. The at least one conductive circuit is sandwiched between the plurality of insulating resin layers and/or between the base substrate and the plurality of insulating resin layers. At least one opening is formed in at least one of the plurality of insulating resin layers.Type: GrantFiled: October 24, 2007Date of Patent: May 18, 2010Assignees: Ibiden Co., Ltd., Nokia CorporationInventors: Michimasa Takahashi, Ian Timms
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Publication number: 20100025087Abstract: A flex-rigid wiring board including a rigid substrate including a rigid base material and a conductor layer, and a flexible substrate having a conductor layer. The conductor layer of the flexible substrate is electrically connected to the conductor layer of the rigid substrate. The rigid substrate has a recessed portion which is formed on a surface of the rigid substrate and which accommodates an electronic component.Type: ApplicationFiled: June 23, 2009Publication date: February 4, 2010Applicant: IBIDEN CO., LTDInventor: Michimasa TAKAHASHI
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Publication number: 20100018634Abstract: A method of manufacturing a flex-rigid wiring board including disposing a flexible board comprising a flexible substrate and a conductor pattern formed over the flexible substrate and a non-flexible substrate adjacent to each other, covering a boundary between the flexible board and the non-flexible substrate with an insulating layer comprising an inorganic material, providing a conductor pattern on the insulating layer, forming a via hole opening which passes through the insulating layer and reaches the conductor pattern of the flexible board, and plating the via hole opening to form a via connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.Type: ApplicationFiled: October 6, 2009Publication date: January 28, 2010Applicant: IBIDEN CO., LTD.Inventors: Michimasa TAKAHASHI, Masakazu Aoyama
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Publication number: 20100021627Abstract: A manufacturing method of a printed wiring board, including forming a plurality of electrodes on a conductive layer formed on a substrate by a plating method, forming an insulation layer on the electrodes and the conductive layer, removing the substrate from the conductive layer, patterning the conductive layer except for a resistor forming region reserved for forming a resistor, thereby forming an external connection conductive pattern, and forming a resistor in the resistor forming region such that the resistor is separated by a space from the external connection conductive pattern.Type: ApplicationFiled: October 6, 2009Publication date: January 28, 2010Applicant: IBIDEN CO., LTD.Inventors: Michimasa Takahashi, Yukinobu Mikado, Hiroyuki Yanagisawa
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Publication number: 20100000087Abstract: This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.Type: ApplicationFiled: September 8, 2009Publication date: January 7, 2010Applicant: IBIDEN CO., LTD.Inventors: Yasuhiro WATANABE, Michimasa TAKAHASHI, Masakazu AOYAMA, Takenobu NAKAMURA, Hiroyuki YANAGISAWA
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Patent number: 7626829Abstract: This invention provides a multilayer printed wiring board in which electric connectivity and functionality are obtained by improving reliability and particularly, reliability to the drop test can be improved. No corrosion resistant layer is formed on a solder pad 60B on which a component is to be mounted so as to obtain flexibility. Thus, if an impact is received from outside when a related product is dropped, the impact can be buffered so as to protect any mounted component from being removed. On the other hand, land 60A in which the corrosion resistant layer is formed is unlikely to occur contact failure even if a carbon pillar constituting an operation key makes repeated contacts.Type: GrantFiled: October 17, 2005Date of Patent: December 1, 2009Assignee: IBIDEN Co., Ltd.Inventors: Yasuhiro Watanabe, Michimasa Takahashi, Masakazu Aoyama, Takenobu Nakamura, Hiroyuki Yanagisawa
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Publication number: 20090290318Abstract: A printed wiring board includes a first substrate having a recess portion and multiple conductors, a second substrate having multiple conductors and inserted in the recess portion of the first substrate such that the first substrate has a surface exposing at least a portion of a surface of the second substrate. The multiple conductors in the first substrate is electrically connected to the multiple conductors in the second substrate, and the second substrate has density of the conductors which is higher than density of the conductors of the first substrate.Type: ApplicationFiled: May 20, 2009Publication date: November 26, 2009Applicant: IBIDEN CO., LTD.Inventor: Michimasa Takahashi
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Publication number: 20090283301Abstract: A wiring board including a main substrate having a base material and a conductive pattern formed on the base material, and a flex-rigid printed wiring board provided to the main substrate and having a rigid substrate and a flexible substrate connected to each other. The flex-rigid printed wiring board has a conductive pattern formed on the rigid substrate and/or the flexible substrate. The conductive pattern of the main substrate is electrically connected to the conductive pattern of the flex-rigid printed wiring board.Type: ApplicationFiled: May 18, 2009Publication date: November 19, 2009Applicant: IBIDEN CO., LTD.Inventor: Michimasa Takahashi
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Publication number: 20090283312Abstract: A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.Type: ApplicationFiled: May 18, 2009Publication date: November 19, 2009Applicant: IBIDEN CO., LTD.Inventor: Michimasa Takahashi
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Publication number: 20090255111Abstract: A method of forming a circuit board which includes generating laser light with a carbon dioxide laser and making a hole through an insulating substrate by irradiating the insulating substrate with the laser light. The hole includes a top opening in a top surface of the insulating substrate, a bottom opening in a bottom surface of the insulating substrate, and an inner wall extending from the top opening to the bottom opening along a thickness direction of the insulating substrate, the inner wall including a bulge which extends in a direction generally orthogonal to the thickness direction. A via hole is formed in the insulating substrate by providing metal in the hole such that the metal extends from the top opening to the bottom opening along the inner wall, and completely closes each of the top and bottom openings.Type: ApplicationFiled: June 22, 2009Publication date: October 15, 2009Applicant: IBIDEN CO., LTD.Inventors: Michimasa Takahashi, Yukinobu Mikado, Takenobu Nakamura, Masakazu Aoyama