Abstract: A graphic data of a first wiring in a first area of a semiconductor wafer may be extracted, which may correspond to a semiconductor chip forming area. The first area may be surrounded by a scribed area of the semiconductor wafer. The first area includes a second area bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to a boundary between the first area and the second area. A first dummy pattern in the first area is laid out to have at least a first distance from the first wiring. A second dummy pattern in the second area is laid out to have at least the first distance from the first wiring and at least a third distance from the first dummy pattern.

Abstract: A graphic data of a first wiring in a first area of a semiconductor wafer may be extracted, which may correspond to a semiconductor chip forming area. The first area may be surrounded by a scribed area of the semiconductor wafer. The first area includes a second area bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to a boundary between the first area and the second area. A first dummy pattern in the first area is laid out to have at least a first distance from the first wiring. A second dummy pattern in the second area is laid out to have at least the first distance from the first wiring and at least a third distance from the first dummy pattern.

Abstract: A graphic data of a first wiring in a first area of a semiconductor wafer may be extracted, which may correspond to a semiconductor chip forming area. The first area may be surrounded by a scribed area of the semiconductor wafer. The first area includes a second area bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to a boundary between the first area and the second area. A first dummy pattern in the first area is laid out to have at least a first distance from the first wiring. A second dummy pattern in the second area is laid out to have at least the first distance from the first wiring and at least a third distance from the first dummy pattern.

Abstract: A graphic data of a first wiring in a first area of a semiconductor wafer may be extracted, which may correspond to a semiconductor chip forming area. The first area may be surrounded by a scribed area of the semiconductor wafer. The first area includes a second area bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to a boundary between the first area and the second area. A first dummy pattern in the first area is laid out to have at least a first distance from the first wiring. A second dummy pattern in the second area is laid out to have at least the first distance from the first wiring and at least a third distance from the first dummy pattern.

Abstract: A graphic data of a first wiring in a first area of a semiconductor wafer may be extracted, which may correspond to a semiconductor chip forming area. The first area may be surrounded by a scribed area of the semiconductor wafer. The first area includes a second area bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to an boundary between the first area and the second area. A first dummy pattern in the first area is laid out to have at least a first distance from the first wiring. A second dummy pattern in the second area is laid out to have at least the first distance from the first wiring and at least a third distance from the first dummy pattern.

Abstract: A graphic data of a first wiring in a first area of a semiconductor wafer may be extracted, which may correspond to a semiconductor chip forming area. The first area may be surrounded by a scribed area of the semiconductor wafer. The first area includes a second area bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to an boundary between the first area and the second area. A first dummy pattern in the first area is laid out to have at least a first distance from the first wiring. A second dummy pattern in the second area is laid out to have at least the first distance from the first wiring and at least a third distance from the first dummy pattern.

Abstract: A method of layout of pattern includes the following processes. A graphic data of a first wiring in a first area of a semiconductor wafer is extracted. The first area is a semiconductor chip forming area. The first area is surrounded by a scribed area of the semiconductor wafer. The first area includes a second area. The second area is bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to an boundary between the first area and the second area. A first dummy pattern in the first area is laid out. The first dummy pattern has at least a first distance from the first wiring. A second dummy pattern in the second area is laid out. The second dummy pattern has at least the first distance from the first wiring. The second dummy pattern has at least a third distance from the first dummy pattern.

Abstract: A method of layout of pattern includes the following processes. A graphic data of a first wiring in a first area of a semiconductor wafer is extracted. The first area is a semiconductor chip forming area. The first area is surrounded by a scribed area of the semiconductor wafer. The first area includes a second area. The second area is bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to an boundary between the first area and the second area. A first dummy pattern in the first area is laid out. The first dummy pattern has at least a first distance from the first wiring. A second dummy pattern in the second area is laid out. The second dummy pattern has at least the first distance from the first wiring. The second dummy pattern has at least a third distance from the first dummy pattern.

Abstract: A method of layout of pattern includes the following processes. A graphic data of a first wiring in a first area of a semiconductor wafer is extracted. The first area is a semiconductor chip forming area. The first area is surrounded by a scribed area of the semiconductor wafer. The first area includes a second area. The second area is bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to an boundary between the first area and the second area. A first dummy pattern in the first area is laid out. The first dummy pattern has at least a first distance from the first wiring. A second dummy pattern in the second area is laid out. The second dummy pattern has at least the first distance from the first wiring. The second dummy pattern has at least a third distance from the first dummy pattern.

Abstract: A method of layout of pattern includes the following processes. A graphic data of a first wiring in a first area of a semiconductor wafer is extracted. The first area is a semiconductor chip forming area. The first area is surrounded by a scribed area of the semiconductor wafer. The first area includes a second area. The second area is bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to an boundary between the first area and the second area. A first dummy pattern in the first area is laid out. The first dummy pattern has at least a first distance from the first wiring. A second dummy pattern in the second area is laid out. The second dummy pattern has at least the first distance from the first wiring. The second dummy pattern has at least a third distance from the first dummy pattern.

Abstract: A method of layout of pattern includes the following processes. A graphic data of a first wiring in a first area of a semiconductor wafer is extracted. The first area is a semiconductor chip forming area. The first area is surrounded by a scribed area of the semiconductor wafer. The first area includes a second area. The second area is bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to an boundary between the first area and the second area. A first dummy pattern in the first area is laid out. The first dummy pattern has at least a first distance from the first wiring. A second dummy pattern in the second area is laid out. The second dummy pattern has at least the first distance from the first wiring. The second dummy pattern has at least a third distance from the first dummy pattern.

Abstract: A method of layout of pattern includes the following processes. A graphic data of a first wiring in a first area of a semiconductor wafer is extracted. The first area is a semiconductor chip forming area. The first area is surrounded by a scribed area of the semiconductor wafer. The first area includes a second area. The second area is bounded with the scribed area. The second area has a second distance from a boundary between the semiconductor chip forming area and the scribed area to an boundary between the first area and the second area. A first dummy pattern in the first area is laid out. The first dummy pattern has at least a first distance from the first wiring. A second dummy pattern in the second area is laid out. The second dummy pattern has at least the first distance from the first wiring. The second dummy pattern has at least a third distance from the first dummy pattern.

Abstract: An air bag system M includes an air bag 40 which can cover a front surface 1a side of a front pillar 1 of a vehicle V, an inflator 55, an air bag cover 65, a case 61 which stores and holds the air bag and the inflator and holds the air bag cover, and bolts 59 which are provided so as to extend from the case for mounting the air bag system on to an installation portion of a front side door 11. A portion of an outer reinforcement 19 which reinforces an outer panel 18 of the front side door is configured as a mounting portion 20 of the front side door where the bolts are attached, and the air bag system M is installed at a portion of the front side door which lies in proximity to a belt line 14 on a side facing a vehicle's outer side by the bolts 59 being attached to the mounting portion 20 on the outer reinforcement.

Abstract: An air bag system includes an air bag which can cover a front surface side of a front pillar of a vehicle. The air bag includes an inflatable main body portion and a supporting inflatable portion. The inflatable main body portion covers a front surface of the front pillar when the air bag is inflated completely. The supporting inflatable portion stretches continuously from the inflation main body portion so as to extend towards an outside of the vehicle from the inflation main body portion and is disposed to be brought into abutment with an upper surface of a mirror main body of a door mirror which is in a usable position on a lower surface side so as to be supported thereon to thereby support the inflatable main body portion, when the air bag is inflated completely.

Abstract: An air bag system M1 is installed in a vehicle having front side doors 13 which are installed adjacent to the rear of front pillars 1 and which each have an outside rearview mirror 27. An air bag 42 includes a pillar covering portion 47 which is disposed to cover a front surface 1a of the front pillar 1 when it completes its inflation and a fitting cell portion 50 which is installed below the pillar covering portion 47 and which is disposed so that when it completes its inflation, a rear end side portion thereof fits in a space defined between the outside rearview mirror 27 and a lateral side of the vehicle on an upper surface side of the outside rearview mirror. The fitting cell portion 50 is connected to a lower edge side of the pillar covering portion 47 over substantially the whole area in a front-rear direction thereof.

Abstract: The invention provides a golf ball manufactured using a mold having a top half and a bottom half, which ball has formed on a surface thereof, near a seam line corresponding to a parting line between the top and bottom halves of the mold, a recessed and/or raised mark serving as an indicator for detecting the direction or position of the seam line. The invention also provides a golf ball mold composed of a top half and a bottom half that detachably join together so as to form therein a spherical cavity into which a material is injected to mold a golf ball, which mold bears, near a parting line between the top and bottom halves on a wall of the cavity, a raised or recessed feature for forming a mark as an indicator for detecting the direction or position of the parting line.

Abstract: An air bag device for pedestrian includes an inflator which discharges an inflating gas, in operation, and an air bag which is inflated with the inflating gas supplied from the inflator thereby to cover a front face of the front pillar. The air bag is contained in a folded state, in an area covered with the front fender panel which is positioned in front of a front pillar and outside of a vehicle along a lateral direction of a hood panel. The front fender panel includes a cover part which is positioned at its back edge close to the front pillar, and arranged so as to cover an upper part of the air bag in the folded state. The cover part is deformed and opened, when it is pressed with the air bag which is being inflated, thereby to protrude the air bag so that the air bag can cover the front face side of the front pillar.

Abstract: The occupant protection system includes a catching body that is housed in a housing located between a near-by seat and a distant seat for upward deployment and a support body that supports the catching body. The catching body covers the impact side of a distant-side occupant to catch the occupant moving toward the impacted lateral and includes a distal end acting as a free end swingable in a left and right direction. The support body is located on a side of the near-by seat close to the impacted lateral for deployment to support the catching body when the catching body swings toward the impacted lateral after receiving the distant-side occupant.

Abstract: A side airbag apparatus is provided with an inflator, and an airbag. The airbag is stored in a vehicle seat, is inflated and deployed by gas from the inflator, breaks the vehicle seat so as to jump out, and is inflated and deployed between a body side portion of a vehicle and the vehicle seat. In this side airbag apparatus, a controller predicts a side collision of the vehicle, and makes the inflator start an actuation in advance of the side collision in response to the prediction. Further, in the airbag inflated and deployed in accordance with the actuation start of the inflator, a deploying speed of the airbag is lowered in comparison with the deploying speed at a time of starting the actuation of the inflator after the side collision, at least outside the vehicle seat.

Abstract: The invention provides a golf ball manufactured using a mold having a top half and a bottom half, which ball has formed on a surface thereof, near a seam line corresponding to a parting line between the top and bottom halves of the mold, a recessed and/or raised mark serving as an indicator for detecting the direction or position of the seam line. The invention also provides a golf ball mold composed of a top half and a bottom half that detachably join together so as to form therein a spherical cavity into which a material is injected to mold a golf ball, which mold bears, near a parting line between the top and bottom halves on a wall of the cavity, a raised or recessed feature for forming a mark as an indicator for detecting the direction or position of the parting line.