Abstract: A silica-based particle dispersion including a silica-based particle group and a high polishing rate and high surface precision is achieved to a silica-based substrate or a NiP-plated substrate to be polished or the like. A silica-based particle dispersion containing a group including irregularly-shaped and non-irregularly-shaped silica-based particles, wherein the irregularly-shaped silica-based particles each have a plurality of small holes thereinside and a covering silica layer which covers the core, and the silica-based particle group satisfies [1]-[3]. [1] Having an average particle size (D1) of 100-600 nm, and a particle size (D2) of 30-300 nm in terms of specific surface area. [2] An irregular-shape degree D (D=D1/D3) represented by the average particle size (D1) and a projected area-equivalent particle size (D3) being in the range of 1.1-5.0. [3] When waveform separation is performed on a volume-reference particle size distribution, a multi-peak distribution in which three or more peaks are detected.

Abstract: Provided is a production method of a silica particle dispersion liquid which includes, preparing a linked silica particle by adding a liquid A containing alkoxysilane and a liquid B containing an alkali catalyst to a liquid containing water, an organic solvent, and an alkali catalyst in a container. The preparing a linked silica particle includes initially adding an alkali catalyst, the initially adding an alkali catalyst includes decreasing a molar ratio of an alkali catalyst to silica in the liquid in the container to 0.15 to 0.60 by adding the liquid A containing alkoxysilane to the liquid in the container, and increasing the molar ratio by 0.2 or more by adding the liquid B to the liquid having the decreased molar ratio in the container.

Abstract: An object of the present invention is to provide a nanobubble-containing inorganic oxide fine particle dispersion having excellent concentration stability in a process used as an abrasive. The object is achieved by the nanobubble-containing inorganic oxide fine particle dispersion including: inorganic oxide fine particles having an average particle size of 1 to 500 nm and containing fine particles containing Ce; and nanobubbles having an average cell size of 50 to 500 nm and being at least one non-oxidizing gas selected from a group consisting of N2 and H2.

Abstract: A polishing composition that can not only achieve high polishing speed, but also can improve the surface smoothness (surface quality) of a polished substrate and reduce defects is provided. That is, provided is a polishing composition comprising silica particles and a water soluble polymer, wherein the contained silica particles satisfy the following requirements (a) to (c): (a) the primary particle diameter based on the specific surface area is 5 to 300 nm; (b) the coefficient of variation in the particle diameter is 10% or less; and (c) the Sears number Y is 10.0 to 12.0.

Abstract: Aiming at providing a ceria-based composite particle dispersion capable of polishing silica film, Si wafer or even hard-to-process material at high polishing rate, and can give high surface accuracy, disclosed is a ceria-based composite particle dispersion that contains a ceria-based composite particle that has an average particle size of 50 to 350 nm, to solve the aforementioned problem, featured by that the ceria-based composite particle has a mother particle, a cerium-containing silica layer, a child particle, and an easily soluble silica-containing layer; the mother particle contains amorphous silica as a major ingredient; the child particle contains crystalline ceria as a major ingredient; ratio of the mass of the easily soluble silica-containing layer relative to the mass of the ceria-based composite particle falls in a specific range; mass ratio of silica and ceria in the ceria-based composite particle falls in a specific range; the ceria-based composite particle, when analyzed by X-ray diffractometry,

Abstract: A silica-based particle dispersion including a silica-based particle group and a high polishing rate and high surface precision is achieved to a silica-based substrate or a NiP-plated substrate to be polished or the like. A silica-based particle dispersion containing a group including irregularly-shaped and non-irregularly-shaped silica-based particles, wherein the irregularly-shaped silica-based particles each have a plurality of small holes thereinside and a covering silica layer which covers the core, and the silica-based particle group satisfies [1]-[3]. [1] Having an average particle size (D1) of 100-600 nm, and a particle size (D2) of 30-300 nm in terms of specific surface area. [2] An irregular-shape degree D (D=D1/D3) represented by the average particle size (D1) and a projected area-equivalent particle size (D3) being in the range of 1.1-5.0. [3] When waveform separation is performed on a volume-reference particle size distribution, a multi-peak distribution in which three or more peaks are detected.

Abstract: A polishing composition comprising an abrasive grain; a modified microfibril cellulose in which at least a part of the cellulose units has a hydroxyl group at the C6 position oxidized to a carboxyl group; and a dispersion medium, wherein each content of Na and K is 100 ppm or less relative to the solids weight.

Abstract: A silica particle dispersion liquid includes a silica particle that satisfies (i) to (iii) below: (i) an average particle diameter d is 5 to 300 nm; (ii) an occlusion amount of a basic substance per 1 g of the particle is 2 mg or more; and (iii) a Sears number Y exceeds 12.0.

Abstract: Provided is a production method of a silica particle dispersion liquid which includes, preparing a linked silica particle by adding a liquid A containing alkoxysilane and a liquid B containing an alkali catalyst to a liquid containing water, an organic solvent, and an alkali catalyst in a container. The preparing a linked silica particle includes initially adding an alkali catalyst, the initially adding an alkali catalyst includes decreasing a molar ratio of an alkali catalyst to silica in the liquid in the container to 0.15 to 0.60 by adding the liquid A containing alkoxysilane to the liquid in the container, and increasing the molar ratio by 0.2 or more by adding the liquid B to the liquid having the decreased molar ratio in the container.

Abstract: A ceria composite particle dispersion has ceria composite particles having an average particle size of 50 to 350 nm and having the features described below. Each ceria composite particle has a mother particle, a cerium-containing silica layer on the surface thereof, and child particles dispersed inside the cerium-containing silica layer, the mother particles being amorphous silica-based and the child particles being crystalline ceria-based. The child particles have a coefficient of variation (CV value) in a particle size distribution of 14 to 40%. The ceria composite particles have a mass ratio of silica to ceria of 100:11-316. Only the crystal phase of ceria is detected when the ceria composite particles are subjected to X-ray diffraction. The average crystallite size of the crystalline ceria measured by subjecting the ceria composite particles to X-ray diffraction is 10 to 25 nm.

Abstract: A polishing composition that can not only achieve high polishing speed, but also can improve the surface smoothness (surface quality) of a polished substrate and reduce defects is provided. That is, provided is a polishing composition comprising silica particles and a water soluble polymer, wherein the contained silica particles satisfy the following requirements (a) to (c): (a) the primary particle diameter based on the specific surface area is 5 to 300 nm; (b) the coefficient of variation in the particle diameter is 10% or less; and (c) the Sears number Y is 10.0 to 12.0.

Abstract: Disclosed is a silica-based composite fine particle dispersion including a silica-based composite fine particle which comprises a mother particle containing amorphous silica as a main component with a child particle containing crystalline ceria as a main component on a surface thereof. Features of the silica-based composite fine particle include a silica to ceria mass ratio of 100:11 to 316, and when subjected to X-ray diffraction, only the crystalline phase of ceria is detected, and when subjected to X-ray diffraction for measurement, the crystalline ceria has a crystallite diameter of 10 to 25 nm.

Abstract: Provided is a dispersion containing high-purity silica particles and a method for producing the same. A first solution containing a silane alkoxide and a second solution containing fine bubbles having an average bubble diameter of 40 nm to 10 ?m are mixed. Thus, the silane alkoxide is hydrolyzed without using an alkaline catalyst in a liquid phase containing the fine bubbles, so that uniform silica particles having an average particle size of 3 to 10 nm are produced. Further, hydrolysis is carried out by adding a hydrolyzable metal compound to the dispersion containing the silica particles in the presence of the fine bubbles and the alkaline catalyst. Thus, the silica particles are grown, so that a uniform silica-based particle dispersion containing particles having an average particle size of more than 10 nm and 300 nm or less is produced.

Abstract: Provided is a dispersion containing high-purity silica particles and a method for producing the same. A first solution containing a silane alkoxide and a second solution containing fine bubbles having an average bubble diameter of 40 nm to 10 ?m are mixed. Thus, the silane alkoxide is hydrolyzed without using an alkaline catalyst in a liquid phase containing the fine bubbles, so that uniform silica particles having an average particle size of 3 to 10 nm are produced. Further, hydrolysis is carried out by adding a hydrolyzable metal compound to the dispersion containing the silica particles in the presence of the fine bubbles and the alkaline catalyst. Thus, the silica particles are grown, so that a uniform silica-based particle dispersion containing particles having an average particle size of more than 10 nm and 300 nm or less is produced.

Abstract: A subject of this invention is to provide a dispersion liquid of a silica-based composite particle, which can rapidly polish silica film, Si wafer or even hard-to-process material, can concurrently achieve high surface accuracy (less scratches, etc.), and can suitably be used for surface polishing of semiconductor devices including semiconductor substrate and wiring board, by virtue of its impurity-free nature. The subject is solved by a dispersion liquid of a silica-based composite particle that contains a silica-based composite particle that has a core particle mainly composed of amorphous silica, and bound thereto a ceria particle mainly composed of crystalline ceria, further has a silica film that covers them.

Abstract: An object of the present invention is to provide a nanobubble-containing inorganic oxide fine particle dispersion having excellent concentration stability in a process used as an abrasive. The object is achieved by the nanobubble-containing inorganic oxide fine particle dispersion including: inorganic oxide fine particles having an average particle size of 1 to 500 nm and containing fine particles containing Ce; and nanobubbles having an average cell size of 50 to 500 nm and being at least one non-oxidizing gas selected from a group consisting of N2 and H2.

Abstract: Aiming at providing a ceria-based composite particle dispersion capable of polishing silica film, Si wafer or even hard-to-process material at high polishing rate, and can give high surface accuracy, disclosed is a ceria-based composite particle dispersion that contains a ceria-based composite particle that has an average particle size of 50 to 350 nm, to solve the aforementioned problem, featured by that the ceria-based composite particle has a mother particle, a cerium-containing silica layer, a child particle, and an easily soluble silica-containing layer; the mother particle contains amorphous silica as a major ingredient; the child particle contains crystalline ceria as a major ingredient; ratio of the mass of the easily soluble silica-containing layer relative to the mass of the ceria-based composite particle falls in a specific range; mass ratio of silica and ceria in the ceria-based composite particle falls in a specific range; the ceria-based composite particle, when analyzed by X-ray diffractometry,

Abstract: A polishing composition comprising an abrasive grain; a modified microfibril cellulose in which at least a part of the cellulose units has a hydroxyl group at the C6 position oxidized to a carboxyl group; and a dispersion medium, wherein each content of Na and K is 100 ppm or less relative to the solids weight.

Abstract: Provided is a dispersion containing high-purity silica particles and a method for producing the same. A first solution containing a silane alkoxide and a second solution containing fine bubbles having an average bubble diameter of 40 nm to 10 ?m are mixed. Thus, the silane alkoxide is hydrolyzed without using an alkaline catalyst in a liquid phase containing the fine bubbles, so that uniform silica particles having an average particle size of 3 to 10 nm are produced. Further, hydrolysis is carried out by adding a hydrolyzable metal compound to the dispersion containing the silica particles in the presence of the fine bubbles and the alkaline catalyst. Thus, the silica particles are grown, so that a uniform silica-based particle dispersion containing particles having an average particle size of more than 10 nm and 300 nm or less is produced.

Abstract: A ceria composite particle dispersion has ceria composite particles having an average particle size of 50 to 350 nm and having the features described below. Each ceria composite particle has a mother particle, a cerium-containing silica layer on the surface thereof, and child particles dispersed inside the cerium-containing silica layer, the mother particles being amorphous silica-based and the child particles being crystalline ceria-based. The child particles have a coefficient of variation (CV value) in a particle size distribution of 14 to 40%. The ceria composite particles have a mass ratio of silica to ceria of 100:11-316. Only the crystal phase of ceria is detected when the ceria composite particles are subjected to X-ray diffraction. The average crystallite size of the crystalline ceria measured by subjecting the ceria composite particles to X-ray diffraction is 10 to 25 nm.