Patents by Inventor Michio Yamashita

Michio Yamashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7534076
    Abstract: In a core bit formed with a drill portion in a cylindrical shape formed with a boring blade on one end side thereof and a mounting portion in a cylindrical shape mounted to a chuck portion of a concrete drill on other end side of the drill portion, formed with an engaging portion capable of being engaged with an engaging portion on a side of the chuck portion at an outer peripheral face of the mounting portion for transmitting rotation of a side of the concrete drill via the engaging member, the outer peripheral face of the mounting portion on a side of the boring blade of the engaging member is formed with a flange portion in a shape of a flange having a diameter larger than an outer diameter of the engaging member.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: May 19, 2009
    Assignee: Max Co., Ltd.
    Inventors: Kigen Agehara, Michio Yamashita, Naohide Murakami
  • Publication number: 20090079536
    Abstract: A method of evaluating laser trimming of a semiconductor device having a thin film resistor is disclosed. The method includes the steps of providing the thin film resistor and laser trimming the thin film resistor by creating a first trim cut. The first trim cut bisects the thin film resistor such that the thin film resistor is divided into a first portion and a second portion. Also, the method involves measuring the insulation resistance of the thin film resistor. In addition, the method involves evaluating the trim cut based on the measured insulation resistance.
    Type: Application
    Filed: November 18, 2008
    Publication date: March 26, 2009
    Applicant: DENSO CORPORATION
    Inventor: Michio Yamashita
  • Publication number: 20090011325
    Abstract: A locking mechanism of a battery pack A is provided with a hook 14 which can be locked to a mounting part B of an object equipment such as an electric tool in a state slid with respect to the mounting part, and operation parts 16 for releasing the lock which are linked to the hook 14, on a case which contains a battery. The hook 14 is urged to move upward by an elastic body in a direction of being locked to the mounting part B. The operation parts 16 are arranged in both side parts of the case within such a range that they can be grasped with a single hand from both sides of a backward end in the sliding direction of the case. When the operation parts 16 are operated from the both sides, the lock between the hook 14 and the mounting part B is released against the urge by the elastic body.
    Type: Application
    Filed: January 11, 2007
    Publication date: January 8, 2009
    Applicant: MAX CO., LTD.
    Inventors: Kigen Agehara, Michio Yamashita
  • Patent number: 7241087
    Abstract: In a core bit formed with a boring blade at a front end thereof and integrally formed with a mounting portion, at a rear end portion thereof, formed with a guide portion in a cylindrical shape mounted to a chuck portion formed at a concrete drill, a ring-like seal member forming a seal between the mounting portion and a side of the chuck portion is formed at the guide portion in the cylindrical shape of the core bit.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: July 10, 2007
    Assignee: Max Co., Ltd.
    Inventors: Kigen Agehara, Michio Yamashita, Naohide Murakami
  • Patent number: 7228445
    Abstract: An electronic apparatus includes a clock oscillator which supplies a clock signal, a processor which generates an internal clock on the basis of the clock signal supplied from the clock oscillator, and a control unit which controls a frequency of the internal clock in accordance with a ratio of an executable instruction count per unit time to a clock count per unit time of the internal clock generated by the processor.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: June 5, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Michio Yamashita, Katsuki Uwatoko
  • Publication number: 20070018781
    Abstract: A method of evaluating laser trimming of a semiconductor device having a thin film resistor is disclosed. The method includes the steps of providing the thin film resistor and laser trimming the thin film resistor by creating a first trim cut. The first trim cut bisects the thin film resistor such that the thin film resistor is divided into a first portion and a second portion. Also, the method involves measuring the insulation resistance of the thin film resistor. In addition, the method involves evaluating the trim cut based on the measured insulation resistance.
    Type: Application
    Filed: April 20, 2006
    Publication date: January 25, 2007
    Applicant: DENSO CORPORATION
    Inventor: Michio Yamashita
  • Publication number: 20070012666
    Abstract: A method of laser trimming a semiconductor device having a plurality of thin film resistors is disclosed. The method includes choosing a linear trimming direction in which a linearly polarized laser beam will be applied to the thin film resistors to thereby create trim cuts in the thin film resistors. The linear trimming direction is chosen to ensure that the linearly polarized laser beam forms complete trim cuts in the thin film resistors and such that strip-like uncut parts are unlikely to be generated. The method also includes forming trim cuts in the thin film resistors by applying the linearly polarized laser beam to the thin film resistors in the linear trimming direction only. Accordingly, it is possible to reduce the generation of strip-like uncut parts when the thin film resistor is laser-trimmed using the linearly polarized laser beam.
    Type: Application
    Filed: April 13, 2006
    Publication date: January 18, 2007
    Applicant: DENSO CORPORATION
    Inventor: Michio Yamashita
  • Patent number: 7141995
    Abstract: A semiconductor manufacturing device includes a prober whose needles are at once engaged for contacting pads of two chip forming regions within a wafer. In one chip forming region, trimming is performed, while in the other chip forming region, inspecting posterior to trimming is performed.
    Type: Grant
    Filed: November 23, 2004
    Date of Patent: November 28, 2006
    Assignee: Denso Corporation
    Inventors: Michio Yamashita, Katuhiko Mori, Takashi Suzuki, Teruhiko Uchimura
  • Publication number: 20060210248
    Abstract: According to one embodiment, an information recording method acquires a recording target video/audio content, divides the acquired recording target video/audio content into a plurality of data units, compares the obtained plurality of data units with a plurality of data units included in a video/audio content stored in a storage unit in advance, and based on the comparison result, deletes, of identical data units, a data unit belonging to the recording target video/audio content other than a data unit stored in the storage unit, and records, in the storage unit, the recording target video/audio content together with playback control information for complementing the deleted data unit upon accessing the remaining data unit.
    Type: Application
    Filed: March 16, 2006
    Publication date: September 21, 2006
    Inventor: Michio Yamashita
  • Publication number: 20050260048
    Abstract: In a core bit formed with a drill portion in a cylindrical shape formed with a boring blade on one end side thereof and a mounting portion in a cylindrical shape mounted to a chuck portion of a concrete drill on other end side of the drill portion, formed with an engaging portion capable of being engaged with an engaging portion on a side of the chuck portion at an outer peripheral face of the mounting portion for transmitting rotation of a side of the concrete drill via the engaging member, the outer peripheral face of the mounting portion on a side of the boring blade of the engaging member is formed with a flange portion in a shape of a flange having a diameter larger than an outer diameter of the engaging member.
    Type: Application
    Filed: September 8, 2003
    Publication date: November 24, 2005
    Inventors: Kigen Agehara, Michio Yamashita, Naohide Murakami
  • Publication number: 20050226694
    Abstract: In a core bit formed with a boring blade at a front end thereof and integrally formed with a mounting portion, at a rear end portion thereof, formed with a guide portion in a cylindrical shape mounted to a chuck portion formed at a concrete drill, a ring-like seal member forming a seal between the mounting portion and a side of the chuck portion is formed at the guide portion in the cylindrical shape of the core bit.
    Type: Application
    Filed: September 8, 2003
    Publication date: October 13, 2005
    Inventors: Kigen Agehara, Michio Yamashita, Naohide Murakami
  • Publication number: 20050122124
    Abstract: A semiconductor manufacturing device includes a prober whose needles are at once engaged for contacting pads of two chip forming regions within a wafer. In one chip forming region, trimming is performed, while in the other chip forming region, inspecting posterior to trimming is performed.
    Type: Application
    Filed: November 23, 2004
    Publication date: June 9, 2005
    Inventors: Michio Yamashita, Katuhiko Mori, Takashi Suzuki, Teruhiko Uchimura
  • Patent number: 6881341
    Abstract: A method for separating a lactone-containing high-molecular weight compound comprising subjecting a mixture of a lactone-containing high-molecular weight compound having, as its side-chain, at least one of a lower alkenyl group and a lower alkoxy group and its analogous compound(s) to either one or both steps in any order of a step (A) for adsorbing the mixture to a nonionic adsorption resin and eluting with an aqueous solvent containing silver ions, and a step (B) for adsorbing the mixture to a basic active alumina and eluting with an organic solvent to separate each of the compounds.
    Type: Grant
    Filed: April 7, 2003
    Date of Patent: April 19, 2005
    Assignee: Fujisawa Pharmaceutical Co., Ltd.
    Inventors: Tomoji Higaki, Takashi Yoshiyasu, Norihiro Hashimoto, Keiji Honda, Hiroshi Hatanaka, Michio Yamashita
  • Patent number: 6825003
    Abstract: The present invention provides a cyclic lipopeptide acylase which may effectively deacylate the acyl side chain of a cyclic lipopeptide compound, specifically FR901379 Substance or its analog thereof shown by the following general formula [I], and a process for production of a cyclic peptide compound which comprises the use of said acylase.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: November 30, 2004
    Assignee: Fujisawa Pharmaceutical Co., Ltd.
    Inventors: Satoshi Ueda, Miho Tanaka, Masami Ezaki, Kazutoshi Sakamoto, Seiji Hashimoto, Nobutaka Oohata, Masaru Tsuboi, Michio Yamashita
  • Patent number: 6825018
    Abstract: A gene encoding D-sorbitol dehydrogenase (SLDH); a process for producing SLDH by culturing host cells transformed by an expression vector having the above gene; and a process for processing L-sorbose or 2-keto-L-gulonic acid (2KLGA) by using the above culture. 2KLGA is an important intermediate in the production of L-ascorbic acid. Thus, a process for producing L-ascorbic acid from the 2KLGA obtained by the above process is also provided.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: November 30, 2004
    Assignee: Fujisawa Pharmaceutical Co. Ltd.
    Inventors: Takashi Shibata, Chiyo Ichikawa, Mitsutaka Matsuura, Yuji Noguchi, Yoshimasa Saito, Michio Yamashita, Yoko Takata
  • Publication number: 20040235105
    Abstract: The present invention provide a gene encoding D-sorbitol dehydrogenase (SLDH), a method for producing SLDH by culture of a host cell transformed with a vector expressing this gene and a method for producing L-sorbose or 2-keto-L-gulonic acid (2KLGA) using the culture. 2KLGA is an important intermediate for the production of L-ascorbic acid. Therefore, the present invention also provides a method for producing L-ascorbic acid from the 2KLGA obtained by the above-mentioned method.
    Type: Application
    Filed: May 13, 2004
    Publication date: November 25, 2004
    Applicant: Fujisawa Pharmaceutical Co. Ltd.
    Inventors: Takashi Shibata, Chiyo Ichikawa, Mitsutaka Matsuura, Yuji Noguchi, Yoshimasa Saito, Michio Yamashita, Yoko Takata
  • Publication number: 20040073826
    Abstract: An electronic apparatus includes a clock oscillator which supplies a clock signal, a processor which generates an internal clock on the basis of the clock signal supplied from the clock oscillator, and a control unit which controls a frequency of the internal clock in accordance with a ratio of an executable instruction count per unit time to a clock count per unit time of the internal clock generated by the processor.
    Type: Application
    Filed: June 27, 2003
    Publication date: April 15, 2004
    Inventors: Michio Yamashita, Katsuki Uwatoko
  • Publication number: 20030168409
    Abstract: A method for separating a lactone-containing high-molecular weight compound comprising subjecting a mixture of a lactone-containing high-molecular weight compound having, as its side-chain, at least one of a lower alkenyl group and a lower alkoxy group and its analogous compound(s) to either one or both steps in any order of a step (A) for adsorbing the mixture to a nonionic adsorption resin and eluting with an aqueous solvent containing silver ions, and a step (B) for adsorbing the mixture to a basic active alumina and eluting with an organic solvent to separate each of the compounds.
    Type: Application
    Filed: April 7, 2003
    Publication date: September 11, 2003
    Applicant: Fujisawa Pharmaceutical Co., Ltd.
    Inventors: Tomoji Higaki, Takashi Yoshiyasu, Norihiro Hashimoto, Keiji Honda, Hiroshi Hatanaka, Michio Yamashita
  • Patent number: 6576135
    Abstract: A method for separating a lactone-containing high-molecular weight compound comprising subjecting a mixture of a lactone-containing high-molecular weight compound having, as its side-chain, at least one of a lower alkenyl group and a lower alkoxy group and its analogous compound(s) to either one or both steps in any order of a step (A) for adsorbing the mixture to a nonionic adsorption resin and eluting with an aqueous solvent containing silver ions, and a step (B) for adsorbing the mixture to a basic active alumina and eluting with an organic solvent to separate each of the compounds.
    Type: Grant
    Filed: March 8, 2002
    Date of Patent: June 10, 2003
    Assignee: Fujisawa Pharmaceutical Co., Ltd.
    Inventors: Tomoji Higaki, Takashi Yoshiyasu, Norihiro Hashimoto, Keiji Honda, Hiroshi Hatanaka, Michio Yamashita
  • Patent number: 6573084
    Abstract: There is provided a cyclic lipopeptide acylase which is capable of deacylating the acyl side chain of a cyclic lipopeptide compound, e.g. Substance FR901379 or its analog, of the following general formula [I] with effectiveness as well a method of producing a cyclic peptide compound which comprises using the acylase. [wherein R1 is acyl; R2 is hydroxy or acyloxy; R3 is hydrogen or hydroxy; R4 is hydrogen or hydroxy; R5 is hydrogen or hydroxysulfonyloxy; and R6 is hydrogen or carbamoyl.
    Type: Grant
    Filed: September 6, 2000
    Date of Patent: June 3, 2003
    Assignee: Fujisawa Pharmaceutical Co., Ltd.
    Inventors: Satoshi Ueda, Miho Tanaka, Masami Ezaki, Kazutoshi Sakamoto, Seiji Hashimoto, Nobutaka Oohata, Masaru Tsuboi, Michio Yamashita