Abstract: The present invention relates to a curable silicone composition comprising: (A) a diorganopolysiloxane having at least two alkenyl groups in a molecule, (B) at least two types of resinous organopolysiloxanes having different mass average molecular weights, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and (D) a hydrosilylation reaction catalyst. The curable silicone composition enables the production of an optical semiconductor device in which the marked viscosity elevation of the resulting composition can be inhibited, in which the fluidity and packing properties are outstanding and that has outstanding gas barrier properties when used as a sealant, and in which the device has outstanding initial optical output efficiency even when organopolysiloxane resin is blended in order to form cured product with moderate hardness and strength.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups and at least one aryl group in a molecule, (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule, (C) an organopolysiloxane having at least one aryl group in a molecule and containing a metal atom selected from the group consisting of V, Ta, Nb and Ce, and (D) a hydrosilylation-reaction catalyst. The present invention can provide the curable silicone composition, which does not develop a crack by thermal aging and further can form a cured material that exhibits less yellowing.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and represented by the average unit formula; (B) a straight chain organopolysiloxane having at least two alkenyl groups in a molecule and having no silicon-bonded hydrogen atoms; (C) an organosiloxane i) represented by the general formula, an organopolysiloxane (C2) having at least two silicon-bonded hydrogen atoms in a molecule and represented by the average unit formula, or a mixture of components (C1) and (C2); and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having a high refractive index and a low gas permeability.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (D) a phosphor; and (E) a hydrosilylation reaction catalyst, to a cured product obtained by curing said composition, and to an optical semiconductor device in which a light emitting element is sealed or coated with a cured product of the aforementioned composition. The curable silicone composition has excellent fluidity and cures to form a cured product in which phosphors are homogeneously dispersed and which has a high refractive index.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an alkenyl group-containing organopolysiloxane having a condensed polycyclic aromatic group or a group containing a condensed polycyclic aromatic group; (B) an organopolysiloxane resin having at least two alkenyl groups in a molecule; (C) an organosiloxane (C1) having silicon-bonded hydrogen atoms at both molecular terminals, an organopolysiloxane (C2) having at least two silicon-bonded hydrogen atoms in a molecule, or a mixture of components (C1) and (C2); and (D) a hydrosilylation reaction catalyst. The curable silicone composition has excellent handleability and can form a cured product with a high refractive index and low gas permeability.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane resin having at least two alkenyl groups in a molecule; (B) a straight-chain organopolysiloxane having at least two alkenyl groups and not having silicon-bonded hydrogen atoms in a molecule; (C) an organopolysiloxane having a condensed polycyclic aromatic group or a group including a condensed polycyclic aromatic group; and (D) a hydrosilylation reaction catalyst. The curable silicone composition has excellent handling and processability and can form a cured product with a high refractive index and low gas permeability.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane resin having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organosiloxane (C1) having silicon-bonded hydrogen atoms at both molecular terminals, an organopolysiloxane (C2) having at least two silicon-bonded hydrogen atoms in a molecule, or a mixture of components (C1) and (C2); and (D) a hydrosilylation reaction catalyst. The curable silicone composition has excellent handleability and can form a cured product with a high refractive index and low gas permeability when cured.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by a specific average unit formula, (B) an optional straight-chain organopolysiloxane having at least two alkenyl groups and not having any silicon-bonded hydrogen atoms in a molecule, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and (D) a hydrosilylation reaction catalyst. The curable silicone composition has high reactivity and forms a cured product with low gas permeability.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane represented by a specific average unit formula and having at least two alkenyl groups in a molecule, (B) an optional straight-chain organopolysiloxane having at least two alkenyl groups and not having any silicon-bonded hydrogen atoms in a molecule, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, wherein at least 80 mass % of this component comprises an organotrisiloxane represented by the formula: H(CH3)2SiO(C6H5)2SiOSi(CH3)2H, and (D) a hydrosilylation reaction catalyst. The curable silicone composition has excellent handleability and high reactivity and forms a cured product with low gas permeability.

Abstract: The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule and represented by the average unit formula; (B) a straight chain organopolysiloxane having at least two alkenyl groups in a molecule and having no silicon-bonded hydrogen atoms; (C) an organosiloxane i) represented by the general formula, an organopolysiloxane (C2) having at least two silicon-bonded hydrogen atoms in a molecule and represented by the average unit formula, or a mixture of components (C1) and (C2); and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having a high refractive index and a low gas permeability.

Abstract: A silicone composition and more particularly to a silicone composition comprising at least one organosilicon compound having an average of at least two silicon-bonded hydrogen atoms per molecule, at least one silicone resin having the formula (R1R4R5SiO1/2)w(R12SiO2/2)x(R4SiO3/2)y(SiO4/2)z (II), wherein R1 is C1 to C10 hydrocarbyl or C1 to C10 halogen-substituted hydrocarbyl, both free of aliphatic unsaturation, R4 is C2 to C4 alkenyl, R5 is R1 or R4, w is from 0.01 to 0.6, x is from 0 to 0.5, y is from 0.1 to 0.95, z is from 0 to 0.4, and w+x+y+z)=1, and a hydrosilylation catalyst; a silicone adhesive comprising a cured product of the silicone composition, and a coated substrate and a laminated substrate, each comprising the silicone adhesive.

Abstract: A composition includes an organopolysiloxane component (A) having at least one aryl group and having an average of at least two alkenyl groups per molecule. The composition further includes an organohydrogensiloxane component (B) having at least one of an alkyl group and an aryl group and an average of at least two silicon-bonded hydrogen atoms per molecule. Components (A) and (B) each independently have a number average molecular weight less than or equal to 1500 (g/mole). The composition yet further includes a catalytic amount of a hydrosilylation catalyst component (C), and metal-oxide nanoparticles (D) other than titanium dioxide (TiO2) nanoparticles. The composition has a molar ratio of alkyl groups to aryl groups ranging from 1:0.25 to 1:3.0. A product of the present invention is the reaction product of the composition, which may be used to make a light emitting diode.

Abstract: Methods employing acidic and basic catalysts are disclosed, and generally entail hydrolysis and condensation reactions of silicon based components. The methods are useful for forming siloxane-modified metal-oxide nanoparticles, such as modified ZrO2 nanoparticles. The siloxane-modified metal-oxide nanoparticles, and products including the siloxane-modified metal-oxide nanoparticles, can be used to form various products, such as lenses or encapsulants for making various devices, such as, but not limited to, light emitting diodes (LEDs).

Abstract: A cured organopolysiloxane resin film having gas barrier properties comprising a fiber-reinforced film made of a hydrosilylation-cured organopolysiloxane resin and having a transparent inorganic layer selected from silicon oxynitride layer, silicon nitride layer, and silicon oxide layer formed on the fiber-reinforced film wherein a layer of cured organopolysiloxane that contains an organic functional group, silanol group, hydrosilyl group, or an organic group produced by the polymerization of polymerizable organic functional groups is interposed between said fiber-reinforced film and inorganic layer. Also, a method of producing this cured organopolysiloxane resin film having gas barrier properties.

Abstract: A curable organopolysiloxane composition comprising: (A) an novel organopolysiloxane represented by the following average structural formula: R1aSiO(4-a)/2 {wherein R1 represents a substituted or non-substituted monovalent hydrocarbon group, an alkoxy group, a hydroxyl group, or an organopolysiloxane residue of the following general formula: —X—(SiR2O)mSiR23 (wherein R2 are the same or different, substituted or unsubstituted monovalent hydrocarbon groups; X represents oxygen atoms or a bivalent hydrocarbon group; and ‘m’ is an integer equal to or greater than 1); however, at least one R1 in one molecule is the aforementioned organopolysiloxane residue, at least one R1 is a monovalent hydrocarbon group having aliphatic carbon-carbon double bonds, and ‘a’ is a positive number that satisfies the following condition: 0<a<2)}; (B) an organic silicon compound having in one molecule at least two silicon-bonded hydrogen atoms; and (C) a hydrosilylation catalyst; is capable of forming a cured product of high fle

Abstract: In an embodiment, one reinforced substrate for use in a photovoltaic device includes a polymer base material and a reinforcing structure bonded with the base material. The reinforced substrate presents a surface in a condition that is made-ready for deposition of thin film layers of the photovoltaic device. A thin film photovoltaic device includes the reinforced substrate, a back contact layer formed on the surface of the reinforced substrate, and a solar absorber layer formed on the back contact layer. A plurality of thin film photovoltaic devices may be formed on a common reinforced substrate. A process of producing a reinforced substrate includes combining a fluid base material and a fiber reinforcing structure to form an impregnated fiber reinforcement. The impregnated fiber reinforcement is cured to form the reinforced substrate, and the reinforced substrate is annealed.

Abstract: A curable organopolysiloxane composition comprising: (A) a solvent-soluble organopolysiloxane obtained by conducting a hydrosilylation reaction between (i) an organopolysiloxane represented by the following average structural formula: RaSiO(4-a)/2 (wherein R1 represents a substituted or non-substituted monovalent hydrocarbon group, the content of alkenyl groups in all groups represented by R1 is within the range of 0.

Abstract: Vinylhydrogenpolysiloxanes are provided. The vinylhydrogenpolysiloxanes comprise organopolysiloxanes having at least two silicon-bonded hydrogen atoms and at least two silicon-bonded vinyl groups. As a fraction of the total number of silicon atoms in the vinylhydrogenpolysiloxanes, about 25% to about 90% of the silicon atoms are bonded to a hydrogen atom and about 10% to about 45% are bonded to a vinyl group. The ratio of the number of silicon-bonded hydrogen groups to the number of silicon-bonded vinyl groups is about 1.3 to about 6. Also provided are silicone compositions comprising at least one vinylhydrogenpolysiloxane and a hydrosilylation catalyst; silicone adhesives comprising a cured product of at least one vinylhydrogenpolysiloxane; and laminates comprising at least one such silicone adhesive. When subjected to high temperatures or direct flame, the vinylhydrogenpolysiloxanes form chars that retain adhesion to various substrates.

Abstract: A method of preparing a reinforced silicone resin film, the method comprising the steps of impregnating a fiber reinforcement in a hydrosilylation-curable silicone composition comprising a silicone resin, and heating the impregnated fiber reinforcement at a temperature sufficient to cure the silicone resin, wherein the reinforced silicone resin film comprises from 10 to 99% (w/w) of the cured silicone resin and the film has a thickness of from 15 to 500 ?m; and a reinforced silicone resin film prepared according to the method.

Abstract: A method of preparing a reinforced silicone resin film, the method comprising the steps of impregnating a fiber reinforcement in a condensation-curable silicone composition comprising a silicone resin, and curing the silicone resin in the condensation-curable silicone composition of the impregnated fiber reinforcement; wherein the reinforced silicone resin film comprises from 10 to 99% (w/w) of the cured silicone resin and the film has a thickness of from 15 to 500 ?m; and a reinforced silicone resin film prepared according to the method.