Patents by Inventor Michitaka Suto

Michitaka Suto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8007869
    Abstract: A method of preparing a reinforced silicone resin film, the method comprising the steps of impregnating a fiber reinforcement in a condensation-curable silicone composition comprising a silicone resin, and curing the silicone resin in the condensation-curable silicone composition of the impregnated fiber reinforcement; wherein the reinforced silicone resin film comprises from 10 to 99% (w/w) of the cured silicone resin and the film has a thickness of from 15 to 500 ?m; and a reinforced silicone resin film prepared according to the method.
    Type: Grant
    Filed: February 1, 2006
    Date of Patent: August 30, 2011
    Assignee: Dow Corning Corporation
    Inventors: Debbie Bailey, Dimitris Elias Katsoulis, Michitaka Suto, Bizhong Zhu
  • Publication number: 20110177342
    Abstract: A cured organopolysiloxane resin film having gas barrier properties in which a layer of cured organopolysiloxane that contains an organic functional group, an organic group produced by the polymerization of polymerizable organic functional groups, or the hydrosilyl group or silanol group, is formed on a visible region-transparent film comprising cured organopolysiloxane resin yielded by hydrosilylation reaction-mediated crosslinking, and in which a silicon oxynitride layer, silicon nitride layer, or silicon oxide layer is formed on the aforementioned layer of cured organopolysiloxane. Also, a method of producing this cured organopolysiloxane resin film having gas barrier properties.
    Type: Application
    Filed: June 26, 2009
    Publication date: July 21, 2011
    Inventors: Maki Itoh, Michitaka Suto, Nobuo Kushibiki, Hidekatsu Hatanaka, Katsuya Eguchi, Dimitris Elias Katsoulis
  • Patent number: 7960030
    Abstract: A free-standing film comprising a cured organopolysiloxane resin obtained by conducting a cross-linking reaction between (A) an organopolysiloxane resin represented by the following average siloxane unit formula: [R1aR23-aSiO1/2]v[R3SiO3/2]w (1) or [R1aR23-aSiO1/2]x[R3SiO3/2]y[SiO4/2]z (2) (where R1 designates univalent hydrocarbon groups of one or more than one type selected from alkyl groups having 1 to 4 carbon atoms and univalent aromatic hydrocarbon groups having 6 to 8 carbon atoms; R2 designate alkenyl groups having 2 to 6 carbon atoms; R3 designates alkyl groups with 1 to 4 carbon atoms or univalent aromatic hydrocarbon groups having 6 to 8 carbon atoms; at least 50 mole % of R3 groups being phenyl groups; “a” is 0, 1, or 2; 0.8?w<1.0 and v+w=1; 0<x<0.4, 0.5<y<1, 0<z<0.
    Type: Grant
    Filed: May 13, 2005
    Date of Patent: June 14, 2011
    Assignee: Dow Corning Corporation
    Inventors: Maki Itoh, Michitaka Suto, Nobuo Kushibiki, Katsuya Eguchi
  • Publication number: 20110092647
    Abstract: A curable organopolysiloxane composition comprising: (A) a solvent-soluble organopolysiloxane obtained by conducting a hydrosilylation reaction between (i) an organopolysiloxane represented by the following average structural formula: RaSiO(4-a)/2 (wherein R1 represents a substituted or non-substituted monovalent hydrocarbon group, the content of alkenyl groups in all groups represented by R1 is within the range of 0.
    Type: Application
    Filed: March 11, 2009
    Publication date: April 21, 2011
    Inventors: Yoshitsugu Morita, Michitaka Suto
  • Publication number: 20110086989
    Abstract: A curable organopolysiloxane composition comprising: (A) an novel organopolysiloxane represented by the following average structural formula: R1aSiO(4-a)2 {wherein R1 represents a substituted or non-substituted monovalent hydrocarbon group, an alkoxy group, a hydroxyl group, or an organopolysiloxane residue of the following general formula: —X—(SiR2O)mSiR23 (wherein R2 are the same or different, substituted or unsubstituted monovalent hydrocarbon groups; X represents oxygen atoms or a bivalent hydrocarbon group; and ‘m’ is an integer equal to or greater than 1); however, at least one R1 in one molecule is the aforementioned organopolysiloxane residue, at least one R1 is a monovalent hydrocarbon group having aliphatic carbon-carbon double bonds, and ‘a’ is a positive number that satisfies the following condition: 0<a<2)}; (B) an organic silicon compound having in one molecule at least two silicon-bonded hydrogen atoms; and (C) a hydrosilylation catalyst; is capable of forming a cured product of high flex
    Type: Application
    Filed: March 11, 2009
    Publication date: April 14, 2011
    Inventors: Yoshitsugu Morita, Michitaka Suto
  • Publication number: 20110011447
    Abstract: A method of forming a ceramic silicon oxide type coating and a method of producing an inorganic base material having this coating, by coating an organohydrogensiloxane/hydrogensiloxane copolymer on the surface of an inorganic base material and converting the coating into a ceramic silicon oxide type coating by heating to high temperatures in an inert gas or an oxygen-containing inert gas (oxygen gas less than 20 volume %). A coating-forming agent comprising an organohydrogensiloxane/hydrogensiloxane copolymer or its solution. A semiconductor device comprising at least a semiconductor layer formed on a silicon oxide type coating on an inorganic substrate.
    Type: Application
    Filed: October 3, 2008
    Publication date: January 20, 2011
    Inventors: Yukinari Harimoto, Tetsuyuki Michino, Dimitris Elias Katsoulis, Nobuo Kushibiki, Michitaka Suto
  • Publication number: 20090246499
    Abstract: A method of preparing a silicone resin film comprising coating a first release liner with a filled silicone composition comprising a hydrosilylation-curable silicone composition and a flame retardant filler, applying a second release liner to the coated first release liner to form an assembly, compressing the assembly; and curing the silicone resin of the compressed assembly, wherein the silicone resin film has a thickness of from 1 to 500 ?m; and a silicone resin film.
    Type: Application
    Filed: August 16, 2007
    Publication date: October 1, 2009
    Inventors: Dimitris Katsoulis, Elizabeth Mc Quiston, Michitaka Suto
  • Publication number: 20090084428
    Abstract: A copper indium diselenide (CIS)-based photovoltaic device includes a CIS-based solar absorber layer including copper, indium, and selenium. The CIS-based photovoltaic device further includes a substrate including a silicone layer formed from a silicone composition and a metal foil layer. The substrate, due to the presence of the silicone layer and the metal foil layer, is both flexible and sufficiently able to withstand annealing temperatures in excess of 500° C. to obtain maximum efficiency of the device.
    Type: Application
    Filed: April 18, 2007
    Publication date: April 2, 2009
    Inventors: Thomas Duncan Barnard, Yukinari Harimoto, Hidekatsu Hatanaka, Maki Itoh, Dimitris Elias Katsoulis, Michitaka Suto, Bizhong Zhu, Lawrence M. Woods, Joseph H. Armstrong, Rosine M. Ribelin
  • Publication number: 20080318067
    Abstract: A free-standing film comprising a cured organopolysiloxane resin obtained by conducting a cross-linking reaction between (A) an organopolysiloxane resin represented by the following average siloxane unit formula: [R1aR23-aSiO1/2]v[R3SiO3/2]w (1) or [R1aR23-aSiO1/2]x[R3SiO3/2]y[SiO4/2]z (2) (where R1 designates univalent hydrocarbon groups of one or more than one type selected from alkyl groups having 1 to 4 carbon atoms and univalent aromatic hydrocarbon groups having 6 to 8 carbon atoms; R2 designate alkenyl groups having 2 to 6 carbon atoms; R3 designates alkyl groups with 1 to 4 carbon atoms or univalent aromatic hydrocarbon groups having 6 to 8 carbon atoms; at least 50 mole % of R3 groups being phenyl groups; “a” is 0, 1, or 2; 0.8?w<1.0 and v+w=1; 0<x<0.4, 0.5<y<1, 0<z<0.
    Type: Application
    Filed: May 13, 2005
    Publication date: December 25, 2008
    Applicants: DOW CORNING TORAY COMPANY, LTD., DOW CORNING CORPORATION
    Inventors: Maki Itoh, Michitaka Suto, Nobuo Kushibiki, Katsuya Eguchi
  • Publication number: 20080138525
    Abstract: A method of preparing a reinforced silicone resin film, the method comprising the steps of impregnating a fiber reinforcement in a condensation-curable silicone composition comprising a silicone resin, and curing the silicone resin in the condensation-curable silicone composition of the impregnated fiber reinforcement; wherein the reinforced silicone resin film comprises from 10 to 99% (w/w) of the cured silicone resin and the film has a thickness of from 15 to 500 ?m; and a reinforced silicone resin film prepared according to the method.
    Type: Application
    Filed: February 1, 2006
    Publication date: June 12, 2008
    Inventors: Debbie Bailey, Dimitris Elias Katsoulis, Michitaka Suto, Bizhong Zhu
  • Patent number: 7381470
    Abstract: The present invention relates to a film made from a cross-linked polysiloxane obtained by subjecting a polysiloxane that has a specific chemical structure and contains at least two unsaturated aliphatic hydrocarbon groups in one molecule and an organosilicon compound with at least two hydrogen atoms directly bonded to silicon atoms in one molecule to cross-linking reaction in the presence of a platinum-type catalyst. The film provided by the invention possesses superior heat-resistant properties, has excellent permeability for light in the visible wavelength range, is characterized by low birefringence, and demonstrates physical properties suitable for practical application. By forming an inorganic substance layer on the aforementioned polysiloxane, it is possible to use the laminated film of the invention, e.g., as a transparent electrode film.
    Type: Grant
    Filed: June 5, 2003
    Date of Patent: June 3, 2008
    Assignee: Dow Corning Toray Co., Ltd.
    Inventors: Michitaka Suto, Dimitris Elias Katsoulis, Nobuo Kushibiki
  • Publication number: 20080115827
    Abstract: In an embodiment, one reinforced substrate for use in a photovoltaic device includes a polymer base material and a reinforcing structure bonded with the base material. The reinforced substrate presents a surface in a condition that is made-ready for deposition of thin film layers of the photovoltaic device. A thin film photovoltaic device includes the reinforced substrate, a back contact layer formed on the surface of the reinforced substrate, and a solar absorber layer formed on the back contact layer. A plurality of thin film photovoltaic devices may be formed on a common reinforced substrate. A process of producing a reinforced substrate includes combining a fluid base material and a fiber reinforcing structure to form an impregnated fiber reinforcement. The impregnated fiber reinforcement is cured to form the reinforced substrate, and the reinforced substrate is annealed.
    Type: Application
    Filed: April 18, 2007
    Publication date: May 22, 2008
    Applicants: ITN ENERGY SYSTEMS, INC., DOW CORNING CORPORATION
    Inventors: Lawrence M Woods, Joseph H. Armstrong, Rosine M. Ribelin, Thomas Duncan Barnard, Yukinari Harimoto, Hidekatsu Hatanaka, Maki Itoh, Dimitris Elias Katsoulis, Michitaka Suto, Bizhong Zhu, Nicole R. Anderson, Herschel Henry Reese
  • Publication number: 20080051548
    Abstract: A method of preparing a reinforced silicone resin film, the method comprising the steps of impregnating a fiber reinforcement in a hydrosilylation-curable silicone composition comprising a silicone resin, and heating the impregnated fiber reinforcement at a temperature sufficient to cure the silicone resin, wherein the reinforced silicone resin film comprises from 10 to 99% (w/w) of the cured silicone resin and the film has a thickness of from 15 to 500 ?m; and a reinforced silicone resin film prepared according to the method.
    Type: Application
    Filed: February 1, 2006
    Publication date: February 28, 2008
    Inventors: Debbie Bailey, Dimitris Katsoulis, Michitaka Suto, Bizhong Zhu
  • Publication number: 20070111014
    Abstract: A dielectric coating for use on a conductive substrate including a silicone composition of the formula: [RxSiO(4-x)/2]n wherein x=1-4 and wherein R comprises of methyl, or phenyl, or hydrido, or hydroxyl or alkoxy or combination of them (when 1<x<4). R can also comprise other monovalent radicals independently selected from alkyl or aryl groups, arylether, alkylether, alylamide, arylamide, alkylamino and arylamino radicals. The dielectric coating has a network structure. A photovoltaic substrate is also disclosed and includes a conductive material having a dielectric coating disposed on a surface of the conductive material.
    Type: Application
    Filed: June 18, 2004
    Publication date: May 17, 2007
    Applicant: DOW CORNING CORPORATION
    Inventors: Dimitris Katsoulis, Michitaka Suto
  • Publication number: 20050227091
    Abstract: The present invention relates to a film made from a cross-linked polysiloxane obtained by subjecting a polysiloxane that has a specific chemical structure and contains at least two unsaturated aliphatic hydrocarbon groups in one molecule and an organosilicon compound with at least two hydrogen atoms directly bonded to silicon atoms in one molecule to cross-linking reaction in the presence of a platinum-type catalyst. The film provided by the invention possesses superior heat-resistant properties, has excellent permeability for light in the visible wavelength range, is characterized by low birefringence, and demonstrates physical properties suitable for practical application. By forming an inorganic substance layer on the aforementioned polysiloxane, it is possible to use the laminated film of the invention, e.g., as a transparent electrode film.
    Type: Application
    Filed: June 5, 2003
    Publication date: October 13, 2005
    Inventors: Michitaka Suto, Dimitris Katsoulis, Nobuo Kushibiki
  • Patent number: 6252030
    Abstract: A method for manufacturing an organic solvent-soluble hydrogenated octasilsesquioxane-vinyl group-containing compound copolymer comprising reacting 1 mol of (A) a hydrogenated octasilsesquioxane described by formula I with 0.2 to less than 3 mol of (B) a divinyl group-containing compound described by formula (2) CH2═CH—L—CH═CH2   Formula 2 where L is selected from the group consisting of (a) a divalent hydrocarbon group comprising 3 to 10 carbon atoms and (b) —(SiR2O)m—SiR2—, where each R is independently selected from the group consisting of alkyls comprising 1 to 6 carbon atoms and aryls comprising 6 to 9 carbon atoms and 1≦m≦10; in the presence of a hydrosilylation catalyst.
    Type: Grant
    Filed: March 9, 2000
    Date of Patent: June 26, 2001
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Gregg Alan Zank, Michitaka Suto
  • Patent number: 6008310
    Abstract: This invention relates to a silicone release coating comprising (A) an organopolysiloxane having at least two crosslinkable carbon-carbon double bonds in each molecule, (B) an organopolysiloxane having at least two Si-bonded hydrogen atoms in each molecule, (C) a silylated polymethylsilsesquioxane and (D) platinum catalyst. The silicone release coating compositions of this invention can further comprise an inhibitor. The silicone release coating compositions of this invention do not decline in release resistance due to release paper aging or release liner aging.
    Type: Grant
    Filed: February 24, 1998
    Date of Patent: December 28, 1999
    Assignees: Dow Corning Asia, Ltd., Dow Corning Toray Silicone
    Inventors: Maki Itoh, Akihito Sakakibara-Saitoh, Michitaka Suto, Takateru Yamada
  • Patent number: 5981670
    Abstract: An alkenyl-functional silylated polymethylsilsesquioxane that contains no more than 0.12 residual silanol per Si atom and is obtained by silylating the silanol in starting polymethylsilsesquioxane. The starting polymethylsilsesquioxane has a predetermined number average molecular weight, Mn, from 380 to 2,000 and is represented by the general formula(CH.sub.3 SiO.sub.3/2).sub.n (CH.sub.3 Si(OH)O.sub.2/2).sub.mwherein m and n are positive numbers that provide the predetermined Mn, with the proviso that the value of m/(m+n) is less than or equal to 0.152/(Mn.times.10.sup.-3)+0.10 and greater than or equal to 0.034/(Mn.times.10.sup.-3). The alkenyl-functional silylated polymethylsilsesquioxane has the formula(CH.sub.3 SiO.sub.3/2).sub.n (CH.sub.3 Si(OH)O.sub.2/2).sub.m-k (CH.sub.3 Si(OSiR.sup.1 R.sup.2 R.sup.3)O.sub.2/2).sub.kwherein k is a positive number smaller than A, (m-k/(m+n) is less than or equal to 0.12, and R.sup.1, R.sup.2 and R.sup.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: November 9, 1999
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Maki Itoh, Akihito Sakakibara-Saitoh, Michitaka Suto
  • Patent number: 5939500
    Abstract: A hydrogen-functional silylated polymethylsilsesquioxane that contains no more than 0.12 residual silanol per Si atom and is obtained by silylating the silanol in starting polymethylsilsesquioxane. The starting polymethylsilsesquioxane has a predetermined number average molecular weight, Mn, from 380 to 2,000 and is represented by the general formula(CH.sub.3 SiO.sub.3/2).sub.n (CH.sub.3 Si(OH)O.sub.2/2).sub.mwherein m and n are positive numbers that provide the predetermined Mn, with the proviso that the value of m/(m+n) is less than or equal to 0.152/(Mn.times.10.sup.-3)+0.10 and greater than or equal to 0.034/(Mn.times.10.sup.-3). The hydrogen-functional silylated polymethylsilsesquioxane has the formula(CH.sub.3 SiO.sub.3/2).sub.n (CH.sub.3 Si(OH)O.sub.2/2).sub.m-k (CH.sub.3 Si(OSiR.sup.1 R.sup.2 R.sup.3)O.sub.2/2).sub.kwherein k is a positive number smaller than m, (m-k/(m+n) is less than or equal to 0.12, and R.sup.1, R.sup.2, and R.sup.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: August 17, 1999
    Assignee: Dow Corning Asia, Ltd
    Inventors: Maki Itoh, Akihito Sakakibara-Saitoh, Michitaka Suto
  • Patent number: 5907019
    Abstract: A silylated polymethylsilsesquioxane, that contains no more than 0.12 residual silanol per Si atom and has a predetermined number average molecular weight from 380 to 2,000 is obtained by silylating the silanol in a starting polymethylsilsesquioxane with the formula(CH.sub.3 SiO.sub.3/2).sub.n (CH.sub.3 Si(OH)O.sub.2/2).sub.mwherein m and n are positive numbers that provide the specified molecular weight and 0.034/(M.times.10.sup.-3).ltoreq.m/(m+n).ltoreq.0.152/(M.times.10.sup.-3)+ 0.10. The silylated polymethylsilsequioxanes of the present invention exhibit compatibility with silicone polymers, e.g., polydimethylsiloxanes. As a consequence, the silylated polymethylsilsesquioxanes of the invention can be used in a wide range of applications as, for example, a reinforcing filler for rubbers.
    Type: Grant
    Filed: November 25, 1997
    Date of Patent: May 25, 1999
    Assignee: Dow Corning Asia, Ltd.
    Inventors: Maki Itoh, Akihito Sakakibara-Saitoh, Michitaka Suto