Abstract: A sole for an article of footwear comprising a midsole having a plurality of polygonal-shaped openings, or cavities, therein. In alternative embodiments, the sole includes reinforcement elements such as a plate disposed along at least a portion of one of the surfaces of the midsole. The plate includes at least one polygonal-shaped extension adapted to fit within at least a portion of at least one of the polygonal-shaped openings within the midsole. Additionally, a polyurethane film is disposed on at least a portion of the bottom surface of the midsole. The shoe also includes an outsole disposed on at least a portion of a bottom surface of the polyurethane film, wherein the outsole comprises a plurality of polygonal-shaped openings aligned with the polygonal-shaped openings of the midsole.

Abstract: The present invention relates to a method of assembling a probe for testing of integrated circuits or other microelectronic devices.

Abstract: The present invention relates to a probe tip assembly for testing of integrated circuits or other microelectronic devices. The probe tip assembly may include a plurality of independently flexible contact fingers extending from a support, each contact finger spaced apart from the other contact fingers, and each contact finger terminating in free space at an end distal from the support. A probe may be constructed by attaching the free ends of the contact fingers to electrical contacts on a circuit board and then removing the support from the contact fingers.

Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Abstract: A probe with integral balun enables connecting a device utilizing differential signals to a source or a sink of single ended signals.

Abstract: A method, apparatus and system provide reliable access to a mobile node. Requests for care of addresses (COAs) are intercepted and the mobile node hostnames in the requests are replaced with alternative configured names. These altered requests are then passed down the network stack. Similarly, replies to the COA requests are also intercepted and the alternative configured names may be replaced with the mobile node hostnames. These replies may then be passed up the network stack. A mobile IP registration request extension may be used to create a mapping entry in a Domain Name Services (DNS) server between the mobile node hostname and the mobile node home address. This mapping entry ensures that the mobile node is consistently reachable via its hostname.

Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Abstract: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.

Abstract: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.

Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.

Abstract: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal oath and the probe tip.

Abstract: A probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies may include a dielectric substrate that supports a signal path interconnecting test instrumentation and a probe tip and a ground path that shields both the signal path and the probe tip.

Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.

Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.

Abstract: A sole for an article of footwear comprising a midsole having a plurality of polygonal-shaped openings, or cavities, therein. In alternative embodiments, the sole includes reinforcement elements such as a plate disposed along at least a portion of one of the surfaces of the midsole. The plate includes at least one polygonal-shaped extension adapted to fit within at least a portion of at least one of the polygonal-shaped openings within the midsole. Additionally, a polyurethane film is disposed on at least a portion of the bottom surface of the midsole. The shoe also includes an outsole disposed on at least a portion of a bottom surface of the polyurethane film, wherein the outsole comprises a plurality of polygonal-shaped openings aligned with the polygonal-shaped openings of the midsole.

Abstract: A probe measurement system having low, stable contact resistance for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.

Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.