Patents by Inventor Mike Andrews

Mike Andrews has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Waveguide adapter for probe assembly having a detachable bias tee
    Patent number: 7352258
    Abstract: A probe assembly including a probe, a waveguide to transmission path transition, and a bias tee detachably connected to the probe.
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: April 1, 2008
    Assignee: Cascade Microtech, Inc.
    Inventors: Mike Andrews, Leonard Hayden, John Martin
  • Probe for combined signals
    Publication number: 20080074129
    Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.
    Type: Application
    Filed: September 18, 2007
    Publication date: March 27, 2008
    Inventors: Leonard Hayden, Scott Rumbaugh, Mike Andrews
  • Probe for testing a device under test
    Publication number: 20080054929
    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
    Type: Application
    Filed: October 24, 2007
    Publication date: March 6, 2008
    Inventors: K. Gleason, Tim Lesher, Eric Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr Safwat
  • Probe for testing a device under test
    Publication number: 20080054923
    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
    Type: Application
    Filed: October 24, 2007
    Publication date: March 6, 2008
    Inventors: K. Gleason, Tim Lesher, Eric Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr Safwat
  • Probe for testing a device under test
    Publication number: 20080048692
    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
    Type: Application
    Filed: October 24, 2007
    Publication date: February 28, 2008
    Inventors: K. Gleason, Tim Lesher, Eric Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr Safwat
  • Probe for testing a device under test
    Publication number: 20080042672
    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
    Type: Application
    Filed: October 19, 2007
    Publication date: February 21, 2008
    Inventors: K. Gleason, Tim Lesher, Mike Andrews, John Martin
  • Wafer probe
    Publication number: 20080042678
    Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.
    Type: Application
    Filed: October 18, 2007
    Publication date: February 21, 2008
    Inventors: Leonard Hayden, John Martin, Mike Andrews
  • Probe for combined signals
    Publication number: 20080042673
    Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.
    Type: Application
    Filed: October 22, 2007
    Publication date: February 21, 2008
    Inventors: Leonard Hayden, Scott Rumbaugh, Mike Andrews
  • Wafer probe
    Publication number: 20080042677
    Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.
    Type: Application
    Filed: October 18, 2007
    Publication date: February 21, 2008
    Inventors: Leonard Hayden, John Martin, Mike Andrews
  • Probe for testing a device under test
    Publication number: 20080042671
    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
    Type: Application
    Filed: October 19, 2007
    Publication date: February 21, 2008
    Inventors: K. Gleason, Tim Lesher, Mike Andrews, John Martin
  • Wafer probe
    Publication number: 20080045028
    Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.
    Type: Application
    Filed: October 18, 2007
    Publication date: February 21, 2008
    Inventors: Leonard Hayden, John Martin, Mike Andrews
  • Probe for testing a device under test
    Publication number: 20080024149
    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
    Type: Application
    Filed: September 27, 2007
    Publication date: January 31, 2008
    Inventors: K. Gleason, Tim Lesher, Eric Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr Safwat
  • Differential signal probe with integral balun
    Publication number: 20080012591
    Abstract: A probe with integral balun enables connecting a device utilizing differential signals to a source or a sink of single ended signals.
    Type: Application
    Filed: June 11, 2007
    Publication date: January 17, 2008
    Inventors: Richard Campbell, Eric Strid, Mike Andrews
  • Shielded probe for high-frequency testing of a device under test
    Patent number: 7304488
    Abstract: A shielded probe for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. The probe may include a probe tip that extends through a dielectric substrate that supports on a first surface a signal path to test instrumentation and on a second surface a ground path that shields both the signal path and the probe tip.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: December 4, 2007
    Assignee: Cascade Microtech, Inc.
    Inventors: K. Reed Gleason, Tim Lesher, Eric W. Strid, Mike Andrews, John Martin, John Dunklee, Leonard Hayden, Amr M. E. Safwat
  • Probe for testing a device under test
    Publication number: 20070273399
    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.
    Type: Application
    Filed: August 3, 2007
    Publication date: November 29, 2007
    Inventors: K. Gleason, Tim Lesher, Mike Andrews, John Martin
  • Probe for combined signals
    Patent number: 7285969
    Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.
    Type: Grant
    Filed: March 5, 2007
    Date of Patent: October 23, 2007
    Assignee: Cascade Microtech, Inc.
    Inventors: Leonard Hayden, Scott Rumbaugh, Mike Andrews
  • Shielded probe for testing a device under test
    Patent number: 7271603
    Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. The probe measurement system preferably includes a probe having a conductive path extending between the first and second surfaces of a membrane and a probe contact electrically connected to the conductive path.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: September 18, 2007
    Assignee: Cascade Microtech, Inc.
    Inventors: K. Reed Gleason, Tim Lesher, Mike Andrews, John Martin
  • Wafer probe
    Publication number: 20070200580
    Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.
    Type: Application
    Filed: April 26, 2007
    Publication date: August 30, 2007
    Inventors: Leonard Hayden, John Martin, Mike Andrews
  • Toy vehicle having fanciful facial expression
    Publication number: 20070178804
    Abstract: A toy vehicle includes a body supported by a plurality of wheels. The body also includes a roof and rear window supporting a plurality of user inputs. Within the toy vehicle body, a microprocessor controlled drive and steering mechanism is operative. The operation of the microprocessor is set by the user inputs. The body further supports a movable bumper mouth and movable eyes and eyebrows behind the windshield.
    Type: Application
    Filed: November 7, 2006
    Publication date: August 2, 2007
    Inventors: Keith Hippely, Mike Andrews, Chris Down, Mark Mayer, Mark Trageser
  • Probe for combined signals
    Publication number: 20070159196
    Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode, with a probe that reduces signal distortion and power dissipation by transmitting a modulated signal through an impedance matching resistor and transmitting of a direct current over a second signal path that avoids the impedance matching resistor.
    Type: Application
    Filed: March 5, 2007
    Publication date: July 12, 2007
    Inventors: Leonard Hayden, Scott Rumbaugh, Mike Andrews