Abstract: A plurality of stunt devices are used within a toy vehicle trackset. Each of the devices includes a movable portion within the toy vehicle travel path. Each movable portion is moved by a pneumatic actuator. A manually operated air bellows is coupled to each pneumatic actuator by a hollow tube. When a particular air bellows is compressed, the corresponding actuator moves the movable portion diverting the toy vehicle on the stunt device.

Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode. A probe and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a second signal path that avoids the impedance matching resistor.

Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a device under test, such as a laser diode. A probe and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a second signal path that avoids the impedance matching resistor.

Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a signal path that avoids the impedance matching resistor.

Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a signal path that avoids the impedance matching resistor.

Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a signal path that avoids the impedance matching resistor.

Abstract: A direct current and a modulation signal are simultaneously applied to contact pads on a wafer to test certain devices, such as a laser diode. A probe, probing system, and method of probing reduces signal distortion and power dissipation by transmitting a modulated signal to the device-under-test through an impedance matching resistor and transmitting of a direct current to the device-under-test over a signal path that avoids the impedance matching resistor.

Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies.

Abstract: A probe assembly including a probe, a waveguide to transmission path transition, and a bias tee detachably connected to the probe.

Abstract: A apparatus and apparatus for compensating for video insertion loss due to transmission over long twisted pair cable lines is presented. Transmission of video over twisted pair cable is advantageous because of its superior cost advantage over coaxial cable. However, twisted pair cables have significant loss characteristics at the higher frequencies (i.e., broadband) compared to coaxial cables. At a transmitter station, the video signal is amplified in the high frequency region for possible skin effect losses thereby brute forcing the high frequency components to the receiving station. At the receiver station, the video signal is further compensated for diffusion line and skin effect losses. The total skin effect compensation applied in both the transmitter and receiver stations is such that the square root of frequency characteristics of skin effect losses is compensated for.

Abstract: The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.

Abstract: In this monolithic detector array, a signal processing layer is epitaxially formed directly on an active detector layer. The active detector layer is supported by a transparent substrate. The three layers are made of intrinsic semiconductors of the same conductivity type (e.g., n-type). The semiconductor forming the active layer has a smaller bandgap than the signal processing and substrate layers. A plurality of vias of opposite conductivity type (e.g, p-type) extend through the signal processing layer into the active detector layer where they form p-n junctions with the active detector layer. These p-n junctions collect charges generated by the radiation and the vias conduct these charges to the signal processing layer where gates, AC background suppression circuitry, and a charge coupled device process the photogenerated signals.