Abstract: A method comprises: providing a layer of curable adhesive material (4) on a substrate (2); forming a pattern of microstructures (321) on the layer of curable adhesive material (4); curing a first region (42) of the layer of curable adhesive material (4) at a first level and a second region (44) of the layer of curable adhesive material (4) at a second level greater than the first level; providing a solid circuit die (6) to directly attach to a major surface of the first region (42) of the layer of curable adhesive material (4); and further curing the first region (42) of the layer of curable adhesive material (4) to anchor the solid circuit die (6) on the first region (42) by forming an adhesive bond therebetween.

Abstract: Methods and systems of using pocket roller (110, 130) to place objects on a continuously moving web (2) are provided. The objects are received in an array of pockets (124) on a major surface of a roller sleeve (120). The roller sleeve (120) engages with an adhesive surface (22) of the continuously moving web (2) to place the objects on the web (2).

Abstract: A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.

Abstract: A pattern of microchannels is formed on a major surface of a substrate on the side opposite an adhesive surface thereof. Through holes extend through the substrate and are connected to the pattern of microchannels. Solid circuit dies are adhesively bonded to the adhesive surface of the substrate. The contact pads of the solid circuit dies at least partially overlie and face the through holes. Electrically conductive channel traces are formed to electrically connect to the solid circuit dies via the through holes.

Abstract: Methods and systems of using pocket roller (110, 130) to place objects on a continuously moving web (2) are provided. The objects are received in an array of pockets (124) on a major surface of a roller sleeve (120). The roller sleeve (120) engages with an adhesive surface (22) of the continuously moving web (2) to place the objects on the web (2).

Abstract: Devices including electrical connections to embedded electronic components and methods of making the same are provided. The devices include a flexible electronic component buried inside a substrate. The free end of the flexible electronic component can be extracted to stick out of the major plane of the substrate as a projecting contact.

Abstract: Methods and apparatuses for screen or stencil printing a pattern on a substrate are provided. The substrate (2) has its major surface in contact with a first major surface (112) of a stencil shell (111) having apertures (116). A coating material is disposed onto the second major surface (114) of the stencil shell (111) to flow through the apertures (116) to contact the substrate (2), where the coating material is at least partially cured. The substrate (2) is separated (C) from the first major surface (112) of the stencil shell (111) after the curing (142) and a pattern (42) of the at-least-partially-cured coating material is formed on the substrate (2).

Abstract: A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.

Abstract: A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.

Abstract: An article includes a solid circuit die on a first major surface of a substrate, wherein the solid circuit die includes an arrangement of contact pads, and wherein at least a portion of the contact pads in the arrangement of contact pads are at least partially exposed on the first major surface of the substrate to provide an arrangement of exposed contact pads; a guide layer including an arrangement of microchannels, wherein the guide layer contacts the first major surface of the substrate such that at least some microchannels in the arrangement of microchannels overlie the at least some exposed contact pads in the arrangement of exposed contact pads; and a conductive particle-containing liquid in at least some of the microchannels. Other articles and methods of manufacturing the articles are described.

Abstract: A method for manufacturing an electronic device includes providing a substrate with a first major surface having a microchannel, wherein the microchannel has a first end and a second end; dispensing a conductive liquid in the microchannel to cause the conductive liquid to move, primarily by capillary pressure, in a first direction toward the first end of the microchannel and in a second direction toward the second end of the microchannel; and solidifying the conductive liquid to form an electrically conductive trace electrically connecting a first electronic device at the first end of the microchannel to a second electronic device at the second end of the microchannel.

Abstract: Methods and apparatuses for roll coating are provided. The roll coating system (100) includes a coating roll (110) having a deformable inner layer (12) with a surface thereof covered by a deformable outer layer (14), the inner layer being softer than the outer layer. A substrate (3) is conveyed to the nip (12) between the coating roll and a back-up roll (120). A metered coating material is transferred from the coating roll to a patterned surface structure (40) of the substrate at the nip to form a conformal coating on the patterned structure of the substrate.

Abstract: A stretchable conductor includes a substrate with a first major surface, wherein the substrate is an elastomeric material. An elongate wire is on the first major surface of the substrate; the wire includes a first end and a second end, and further includes at least one arcuate region between the first end and the second end. At least one portion of the arcuate region of the wire in the region has a first surface area portion embedded in the surface of the substrate and a second surface area portion unembedded on the substrate and exposed in an amount sufficient to render at least an area of the substrate in the region electrically conductive. The unembedded second surface portion of the arcuate region may lie above or below a plane of the substrate. Composite articles including a stretchable conductor in durable electrical contact with a conductive fabric are also disclosed.

Abstract: Methods and apparatuses for screen or stencil printing a pattern on a substrate are provided. The substrate (2) has its major surface in contact with a first major surface (112) of a stencil shell (111) having apertures (116). A coating material is disposed onto the second major surface (114) of the stencil shell (111) to flow through the apertures (116) to contact the substrate (2), where the coating material is at least partially cured. The substrate (2) is separated (C) from the first major surface (112) of the stencil shell (111) after the curing (142) and a pattern (42) of the at-least-partially-cured coating material is formed on the substrate (2).

Abstract: Methods and apparatuses for applying coatings on a moving web are provided. A coating die and a back-up roll engage with each other. The back-up roll includes a shell rotatably supported by a pressurized air layer. When a coating material is dispensed from the coating die onto the web to form a liquid coating, the pressure of the air layer is controlled such that the shell translates in space to balance forces from the air layer and the coating bead, while the web is being translated to drive the shell.

Abstract: Wet-on-wet coating processes are provided to produce multilayer articles. First and second coating materials are sequentially applied on to a structured substrate surface to form a skin layer directly over the structured substrate surface and a bulk layer over the skin layer. The conformability of the skin layer can be adjusted to provide desired surface and bulk properties.

Abstract: A printing system (200) including a printing roll (220) is provided. The printing roll (220) includes an elastically deformable and compressible inner layer (224) and a thin outer shell (222) to cover the inner layer (224). The thin outer shell (222) includes a pattern of raised print features (223) to receive ink material thereon. The inner layer (224) is softer and thicker than the thin outer shell (222), and optionally, the thin outer shell (222) is removable from the inner layer (224). The inner layer (224) of the printing roll (220) has a thickness, a compression force deflection value and an elastically-deformable compressibility such that the raised print features (223) of the printing roll (220) do not slide or deform with respect to the printed web (2) in an amount to generate a substantially visible dot gain.

Abstract: Devices including electrical connections to embedded electronic components and methods of making the same are provided. The devices include a flexible electronic component buried inside a substrate. The free end of the flexible electronic component can be extracted to stick out of the major plane of the substrate as a projecting contact.

Abstract: Diagnostic devices for quantitative or qualitative analysis of a sample fluid including an analyte include at least two portions made from a hydrophilic material. The planar portions are stacked on each other and each occupy a different and substantially parallel plane to form a three-dimensional structure. At least one of the planar portions includes a hydrophobic region formed by applying a low surface energy material that extends through a thickness of the substrate portion from a first major surface to a second major surface thereof. The hydrophilic regions in the overlying substantially parallel substrate portions can be aligned with each other such that a fluid is passively transported between adjacent hydrophilic regions to provide a sample flow path between adjacent substrate portions.

Abstract: Methods and apparatuses for applying coatings (9) on a moving web (3) are provided. A slot die (20) and a back-up roll (11) engage with each other. The back-up roll has a deformable inner layer (12) with a surface thereof covered by a deformable outer layer (14). The slot die and the flexible web at a contacting area are impressed into the back-up roll with an engagement depth D, which enables formation of a coating having a substantially uniform thickness.