Patents by Inventor Min Baek

Min Baek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM, APPARATUS AND METHOD FOR RECOGNIZING MOTIONS OF MULTIPLE USERS
    Publication number: 20210158032
    Abstract: A method of recognizing motions of a plurality of users through a motion recognition apparatus includes acquiring a plurality of depth images from a plurality of depth sensors disposed at different positions, extracting user depth data corresponding to a user area from each of the plurality of depth images, allocating a label ID of each user to the extracted user depth data; matching the label ID for each frame of the depth images, and tracking a joint position for the user depth data on the basis of a result of the matching.
    Type: Application
    Filed: November 12, 2020
    Publication date: May 27, 2021
    Inventors: Seong Min BAEK, Youn Hee GIL, Hee Kwon KIM, Hee Sook SHIN, Cho Rong YU, Sung Jin HONG
  • SYSTEM AND METHOD FOR AUTOMATICALLY RECOGNIZING VIRTUAL BALL SPORTS INFORMATION
    Publication number: 20210117785
    Abstract: Provided is a system and method for automatically recognizing virtual ball sports information, specifically, a system and method for automatically recognizing virtual ball sports events and motions on the basis of ball measurement data training. Provided is a server for automatically recognizing virtual ball sports information including an inputter configured to receive ball measurement data, a memory which stores a program for automatically recognizing virtual ball sports information, and a processor configured to execute the program, wherein the processor automatically recognizes an event and a motion of a sport that is currently played by a user using the ball measurement data and a ball classification label.
    Type: Application
    Filed: September 25, 2020
    Publication date: April 22, 2021
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Jong Sung KIM, Myung Gyu KIM, Woo Suk KIM, Seong Min BAEK, Sang Woo SEO, Sung Jin HONG
  • MAGNESIUM ALLOY
    Publication number: 20210115538
    Abstract: The present invention relates to a magnesium alloy based on 100% by weight of the total magnesium alloy, Al: 0.03 to 16.0% by weight, Mn: 0.015 to 1.0% by weight, Sc: 0.02 to 0.5% by weight, lanthanide rare earth element (RE): 0.03 to 2.0% by weight, and the balance Mg and inevitable impurities, wherein, the rare earth element (RE) comprise La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, or a combination thereof.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 22, 2021
    Inventors: Sung Soo Park, Soo-Min Baek
  • Battery pack cover for an electrified vehicle
    Patent number: 10978763
    Abstract: An exemplary battery pack cover includes a polymer layer and a metallic layer grounded to a chassis of an electric vehicle. An exemplary method includes shielding battery cells of a battery pack against electromagnetic interference and thermal energy using a multilayer cover that is grounded to a chassis of an electrified vehicle.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: April 13, 2021
    Assignee: Ford Global Technologies, LLC
    Inventor: Hyung Min Baek
  • DISPLAY DEVICE
    Publication number: 20210091161
    Abstract: A device includes a substrate including a display area and a pad area; a first conductive layer on the substrate; and a first insulating film on the first conductive layer, the first insulating film having a first contact hole in the display area to expose the first conductive layer and a pad opening exposing the first conductive layer in the pad area, the first conductive layer being arranged such that in a first region covered by the first insulating film, a second conductive capping layer of the first conductive layer is entirely on a first conductive capping layer of the first conductive layer; in a second region overlapping the contact hole, the second conductive capping layer is entirely on the first conductive capping layer; and in a third region exposed by the pad opening, the second conductive capping layer exposes at least a portion of the first conductive capping layer.
    Type: Application
    Filed: May 12, 2020
    Publication date: March 25, 2021
    Inventors: Gyung Min BAEK, Ju Hyun LEE, Jae Uoon KIM, Hong Sick PARK, Hyun Eok SHIN
  • Semiconductor device
    Patent number: 10950541
    Abstract: A semiconductor device includes a substrate, a first lower wiring line on the substrate, a first insulation layer on the first lower wiring line, a first dielectric barrier layer and a first etch stop layer sequentially stacked on the first insulation layer, a second insulation layer on the first etch stop layer, a first upper wiring line extending through the second insulation layer, the first etch stop layer, and the first dielectric barrier layer, and a first conductive via in the first insulation layer and electrically connecting the first lower wiring line and the first upper wiring line. An upper surface of the first conductive via protrudes above a lower surface of the first upper wiring line.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: March 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Soon Gyu Hwang, Kyoung Woo Lee, YoungWoo Cho, Il Sup Kim, Su Hyun Bark, Young-Ju Park, Jong Min Baek, Min Huh
  • OPTICAL DEVICE
    Publication number: 20210063751
    Abstract: An optical device including: a display device configured to display an image; and a lens including a plurality of reflectors that reflect the image from the display device to a first surface of the lens, wherein the plurality of reflectors include: a first reflector; and a second reflector having a size different from a size of the first reflector.
    Type: Application
    Filed: August 27, 2020
    Publication date: March 4, 2021
    Inventors: Jeong Woo PARK, Jae Joong KWON, Ju Hwa HA, Yong Seok KIM, Soo Min BAEK, Ji Yeon SEO, Hyun Sup LEE, Su Bin JUNG
  • Seat or vehicle identification for a rideshare
    Patent number: 10933806
    Abstract: Systems, methods, and devices for indicating a status of a vehicle or a seat in a vehicle are disclosed herein. A system includes a plurality of seats in a vehicle, a light-diffusing fiber optic light source attached to at least one of the seats, a receiver configured to receive a status of at least one of the seats, and a controller. The controller may be configured to determine an illumination scheme based on the status of at least one of the seats and illuminate the light-diffusing fiber optic light source according to the illumination scheme.
    Type: Grant
    Filed: January 25, 2017
    Date of Patent: March 2, 2021
    Assignee: Ford Global Technologies, LLC
    Inventors: Zachary David Nelson, Hyung Min Baek, Daniel Boccuccia
  • ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE AND A MANUFACTURING METHOD THEREOF
    Publication number: 20210057504
    Abstract: An organic light emitting diode display including: a substrate; a TFT on the substrate; a planarization layer on the TFT; a pixel electrode on the planarization layer, wherein the pixel electrode includes upper and lower layers including a transparent conductive oxide and an intermediate layer including silver; an etch stop layer on the pixel electrode, wherein an upper surface of the pixel electrode is exposed by the etch stop layer; a partition on the etch stop layer, wherein the upper surface of the pixel electrode is exposed by the partition; an organic emission layer on the upper surface of the pixel electrode where the upper surface of the pixel electrode is exposed by the etch stop layer and the partition; and a common electrode on the organic emission layer and the partition, wherein the etch stop layer covers an edge and a side surface of the pixel electrode.
    Type: Application
    Filed: June 8, 2020
    Publication date: February 25, 2021
    Inventors: Kyeong Su KO, Joon Yong PARK, Gyung Min BAEK, Hyun Min CHO, Dae Won CHOI
  • Methods of forming micropatterns and substrate processing apparatus
    Patent number: 10916437
    Abstract: Provided herein is a method of forming micropatterns, including: forming an etching target film on a substrate; forming a photosensitivity assisting layer on the etching target film, the photosensitivity assisting layer being terminated with a hydrophilic group; forming an adhesive layer on the photosensitivity assisting layer, the adhesive layer forming a covalent bond with the hydrophilic group; forming a hydrophobic photoresist film on the adhesive layer; and patterning the photoresist film.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: February 9, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Shin Jang, Jong-Min Baek, Hoon-Seok Seo, Eui-Bok Lee, Sung-Jin Kang, Vietha Nguyen, Deok-Young Jung, Sang-Hoon Ahn, Hyeok-Sang Oh, Woo-Kyung You
  • SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
    Publication number: 20210020497
    Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.
    Type: Application
    Filed: February 24, 2020
    Publication date: January 21, 2021
    Inventors: Sung Jin KANG, Jong Min BAEK, Woo Kyung YOU, Kyu-Hee HAN, Han Seong KIM, Jang Ho LEE, Sang Shin JANG
  • Magnesium alloy materials and method for producing the same
    Patent number: 10883158
    Abstract: The present invention relates to a magnesium alloy material and a method for manufacturing the same. The magnesium alloy material comprises, with respect to the total of 100 wt % thereof: Sc of 0.01 to 0.3 wt %; Al of 0.05 to 15.0 wt %; and the balance being Mg and other unavoidable impurities, wherein the magnesium alloy comprises a secondary phase compound comprising Al and Sc in the alloy in which a Volta potential difference between the secondary phase compound and a magnesium base is less than 920 mV.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: January 5, 2021
    Assignee: UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
    Inventors: Sung Soo Park, Soo Min Baek, Beom Cheol Kim
  • Etching gas mixture, method of forming pattern by using the same, and method of manufacturing integrated circuit device by using the etching gas mixture
    Patent number: 10872784
    Abstract: An etching gas mixture, a method of forming a pattern using the etching gas mixture, and a method of manufacturing an integrated circuit device using the etching gas mixture, the etching gas mixture including a C1-C3 perfluorinated alkyl hypofluorite; and a C1-C10 organosulfur compound that includes a C—S bond in the compound.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: December 22, 2020
    Assignees: SAMSUNG ELECTRONICS CO., LTD., Wonik Materials
    Inventors: Do-hoon Kim, Tae-hyung Kim, Jong-min Baek, Han-dock Song
  • Semiconductor device
    Patent number: 10867923
    Abstract: A semiconductor device includes an element layer, a plurality of first interconnect lines on the element layer, a first insulation layer including carbon having a uniform concentration distribution between the first interconnect lines, a plurality of second interconnect lines spaced from the first interconnect lines, and a second insulation layer between the second interconnect lines. An air spacing is included between the second interconnect lines.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: December 15, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang Hoon Ahn, Tae Soo Kim, Jong Min Baek, Woo Kyung You, Thomas Oszinda, Byung Hee Kim, Nae In Lee
  • Resistive memory device and programming method of the same
    Patent number: 10867672
    Abstract: In some example embodiments, a program pulse is applied to a resistive memory cell and a plurality of post pulses are applied to the resistive memory cell at a time point after a relaxation time from a time point when application of the program pulse is finished, the plurality of post pulses having voltage levels that increase sequentially. Programming speed and/or performance of the resistive memory device may be enhanced by accelerating resistance drift of the resistive memory cell using the plurality of post pulses having the voltage levels that increase sequentially.
    Type: Grant
    Filed: July 3, 2019
    Date of Patent: December 15, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong-Sung Cho, Moo-Sung Kim, Seung-You Baek, Jong-Min Baek, Bong-Kil Jung
  • Semiconductor devices
    Patent number: 10847454
    Abstract: Semiconductor devices are provided. The semiconductor devices may include a substrate, a first insulating film on the substrate, a lower metal layer in the first insulating film, and a second insulating film on the first insulating film. The lower metal layer may be in the second insulating film, the second insulating film may include a lower surface facing the substrate and an upper surface that is opposite the lower surface, and the upper surface of the second insulating film may be upwardly convex. The semiconductor devices may further include a barrier dielectric film including a recess on the second insulating film, and a via metal layer that is in the recess of the barrier dielectric film and electrically connected with the lower metal layer.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: November 24, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eui Bok Lee, Deok Young Jung, Sang Bom Kang, Doo-Hwan Park, Jong Min Baek, Sang Hoon Ahn, Hyeok Sang Oh, Woo Kyung You
  • Wiring substrate, display device including the wiring substrate, and method of fabricating the wiring substrate
    Patent number: 10847076
    Abstract: A display device may include a base and a first wiring layer disposed on the base. The first wiring layer may include a first material and a second material layer that overlap each other. A material of the second material layer may be different from a material of the first material layer. The second material layer contains MoOx, wherein 1.9?x?2.1.
    Type: Grant
    Filed: April 15, 2019
    Date of Patent: November 24, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Hyun Eok Shin, Hong Sick Park, Gyung Min Baek, Sang Woo Sohn, Sang Won Shin, Ju Hyun Lee
  • Semiconductor device and method for fabricating the same
    Patent number: 10832948
    Abstract: A semiconductor device includes a first interlayer dielectric film on a substrate, first and second wires respectively extending in a first direction within the first interlayer dielectric film, the first and second wires being adjacent to each other in a second direction different from the first direction, a hard mask pattern on the first interlayer dielectric film, the hard mask pattern including an opening, and an air gap within the first interlayer dielectric film, the air gap including a first portion overlapping vertically with the opening and a second portion not overlapping with the opening in the first direction.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: November 10, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyu Hee Han, Jong Min Baek, Viet Ha Nguyen, Woo Kyung You, Sang Shin Jang, Byung Hee Kim
  • Semiconductor device with multi-layered wiring and method for fabricating the same
    Patent number: 10825766
    Abstract: A semiconductor device includes a lower wiring, an interlayer insulation film above the lower wiring and including a first portion having a first density, and a second portion on the first portion, the first portion and the second portion having a same material, and the second portion having a second density smaller than the first density, an upper wiring in the second portion of the interlayer insulating film, and a via in the first portion of the interlayer insulating film, the via connecting the upper wiring and the lower wiring.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: November 3, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ji Young Kim, Kyu Hee Han, Sung Bin Park, Yeong Gil Kim, Jong Min Baek, Kyoung Woo Lee, Deok Young Jung
  • Battery array frame including frame rail insert
    Patent number: 10804511
    Abstract: A battery array frame may include a frame body extending along a longitudinal axis and including a top frame rail, a bottom frame rail, and frame arms that connect between the top frame rail and the bottom frame rail. An insert extends inside the frame body for increasing the stiffness of the frame body.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: October 13, 2020
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Hyung Min Baek, Rajaram Subramanian