Patents by Inventor Min Baek

Min Baek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10804145
    Abstract: A method of fabricating a semiconductor device is provided. The method may include forming a first interlayer insulating film on a substrate, forming a second interlayer insulating film on the first interlayer insulating film, and forming a third interlayer insulating film on the second interlayer insulating film. Different amounts of carbon may be present in each of the first, second, and third interlayer insulating films. The third interlayer insulating film may be used as a mask pattern to form a via trench that extends at least partially into the first interlayer insulating film and the second interlayer insulating film. Supplying a carbon precursor may be interrupted between the forming of the second and third interlayer insulating films, such that the second interlayer insulating film and the third interlayer insulating film may have a discontinuous boundary therebetween.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: October 13, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yeong Gil Kim, Han Seong Kim, Jong Min Baek, Ji Young Kim, Sung Bin Park, Deok Young Jung, Kyu Hee Han
  • Patent number: 10793373
    Abstract: A self-cleaning ring conveyor includes a first roller having a first rotational axis and a second roller having a second rotational axis that is parallel with the first rotational axis. The conveyor also includes a first ring extending around a combination of the first roller and the second roller and a second ring extending around the combination of the first roller and the second roller. The first ring and the second ring are parallel to each other. The conveyor also includes a first scraper having a first scraping slot and a second scraping slot. The first ring extends through the first scraping slot and the second ring extends through the second scraping slot.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: October 6, 2020
    Assignee: NIKE, Inc.
    Inventors: HyunTae Ahn, Hyun Min Baek, Do Hyun Choi, Sang Hee Lee
  • Patent number: 10796437
    Abstract: Provided are a system and method for simultaneously reconstructing an initial three-dimensional (3D) trajectory and velocity of an object by using single camera images. The system for simultaneously reconstructing an initial 3D trajectory and velocity of an object by using single camera images includes a receiver configured to receive 3D world coordinate information of a starting point of an object and object-captured image information of a single camera, a two-dimensional (2D) coordinate acquisition unit configured to acquire 2D image coordinates of the object from the object-captured image information, and a reconstructor configured to simultaneously reconstruct an initial 3D velocity and trajectory of the object by applying a 3D motion equation to the 2D image coordinates and depth information from the single camera to the object.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: October 6, 2020
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jong Sung Kim, Myung Gyu Kim, Woo Suk Kim, Seong Min Baek, Sang Woo Seo, Sung Jin Hong
  • Patent number: 10777449
    Abstract: A semiconductor device includes a first insulating interlayer on a first region of a substrate and a second insulating interlayer on a second region of the substrate, a plurality of first wiring structures on the first insulating interlayer, the first wiring structures being spaced apart from each other, a plurality of second wiring structures filling a plurality of trenches on the second insulating interlayer, respectively, an insulation capping structure selectively on a surface of the first insulating interlayer between the first wiring structures and on a sidewall and an upper surface of each of the first wiring structures, the insulation capping structure including an insulating material, a third insulating interlayer on the first and second wiring structures, and an air gap among the first wiring structures under the third insulating interlayer.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: September 15, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Shin Jang, Woo-Kyung You, Kyu-Hee Han, Jong-Min Baek, Viet Ha Nguyen, Byung-Hee Kim
  • Publication number: 20200267016
    Abstract: A management terminal may include an ID inputter configured to receive an ID of an electronic device from a user; a memory configured to store management information for a plurality of the electronic devices in association with a plurality of the IDs for identifying the plurality of electronic devices, when the management information for the plurality of electronic devices is input; a communication interface connected to at least one of the plurality of electronic devices by wire or wirelessly; and a controller configured to control the communication interface to transmit the management information stored in the memory to the electronic device connected to the communication interface.
    Type: Application
    Filed: October 18, 2018
    Publication date: August 20, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Seok Min BAEK
  • Publication number: 20200264706
    Abstract: An input sensing unit includes a first metal pattern layer including a plurality of first conductive lines extending in a first direction. A first insulating layer is disposed on the first metal pattern layer. A second metal pattern layer is positioned above the first insulating layer and includes a plurality of second conductive lines extending in a second direction intersecting the first direction. A second insulating layer is disposed on the second metal pattern layer. A sensing electrode is disposed on the second insulating layer and is electrically connected to the second metal pattern layer through a contact hole defined in the second insulating layer. An anti-reflection pattern layer is disposed on the first and second metal pattern layers to overlap the first and second metal pattern layers along a direction orthogonal to an upper surface of the anti-reflection pattern layer.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 20, 2020
    Inventors: Gyung Min BAEK, Hyun Eok SHIN, Ju Hyun LEE, Joon Yong PARK, Sang Won SHIN
  • Patent number: 10744914
    Abstract: A seat includes one or more cushions secured to a shell. The cushions include a 3D printed lattice of repeating cells. The cells may include nodes interconnected by branches. The nodes may be arranged in a cubic, parallelepiped, diamond, or other arrangement. The branches may extend directly between nodes or may be bent. The branches may extend from each node to an adjacent node that is closest to its point of attachment to the each node or the branches may be curved or bent to secure to a different adjacent node. The 3D printed lattice may include 3D printed barbs formed thereon that engage receptacles in the seat shell. The 3D printed lattice may be printed with a groove that engages a fastening structure on a cover or a separate fastening element. The cover may be a perforated sheet of material or fabric.
    Type: Grant
    Filed: May 16, 2019
    Date of Patent: August 18, 2020
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Hyung Min Baek, Daniel Boccuccia
  • Patent number: 10742880
    Abstract: An image display apparatus and a method of displaying an image are provided. The image display apparatus includes: a display; a graphics processing unit (GPU); and a processor configured to: determine a copy region of a planar-format image based on information regarding a current viewpoint, control the GPU to generate a sphere-format image by mapping an image corresponding to the copy region to a sphere and to generate an output image by rendering the sphere-format image, and control the display to display the output image.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: August 11, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-min Baek, Young-hyun Kim, Se-hyun Kim, Kwan-sik Yang, Jae-young You, Kil-soo Choi
  • Publication number: 20200251376
    Abstract: A semiconductor device includes a first interlayer dielectric film on a substrate, first and second wires respectively extending in a first direction within the first interlayer dielectric film, the first and second wires being adjacent to each other in a second direction different from the first direction, a hard mask pattern on the first interlayer dielectric film, the hard mask pattern including an opening, and an air gap within the first interlayer dielectric film, the air gap including a first portion overlapping vertically with the opening and a second portion not overlapping with the opening in the first direction.
    Type: Application
    Filed: April 22, 2020
    Publication date: August 6, 2020
    Inventors: Kyu Hee HAN, Jong Min BAEK, Viet Ha NGUYEN, Woo Kyung YOU, Sang Shin JANG, Byung Hee KIM
  • Publication number: 20200226784
    Abstract: A system for recognizing collision positions of a plurality of moving objects in a screen includes an infrared camera configured to obtain an image frame when a plurality of moving objects move toward a screen, a memory configured to store a program for calculating a collision position in the screen on the basis of the image frame, and a processor configured to execute the program stored in the memory. By executing the program, the processor detects all of the plurality of moving objects from the image frame to generate a graph where moving objects included in a successive image frame are connected to one another, and calculates a collision position of the moving object included in the image frame and a collision position of the moving object in the screen on the basis of the graph.
    Type: Application
    Filed: January 9, 2020
    Publication date: July 16, 2020
    Inventors: Jong Sung KIM, Myung Gyu KIM, Woo Suk KIM, Seong Min BAEK, Sang Woo SEO, Sung Jin HONG
  • Publication number: 20200227314
    Abstract: A method of fabricating a semiconductor device is provided. The method may include forming a first interlayer insulating film on a substrate, forming a second interlayer insulating film on the first interlayer insulating film, and forming a third interlayer insulating film on the second interlayer insulating film. Different amounts of carbon may be present in each of the first, second, and third interlayer insulating films. The third interlayer insulating film may be used as a mask pattern to form a via trench that extends at least partially into the first interlayer insulating film and the second interlayer insulating film. Supplying a carbon precursor may be interrupted between the forming of the second and third interlayer insulating films, such that the second interlayer insulating film and the third interlayer insulating film may have a discontinuous boundary therebetween.
    Type: Application
    Filed: August 20, 2019
    Publication date: July 16, 2020
    Inventors: Yeong Gil Kim, Han Seong Kim, Jong Min Baek, Ji Young Kim, Sung Bin Park, Deok Young Jung, Kyu Hee Han
  • Publication number: 20200219808
    Abstract: A semiconductor device includes a substrate, a first lower wiring line on the substrate, a first insulation layer on the first lower wiring line, a first dielectric barrier layer and a first etch stop layer sequentially stacked on the first insulation layer, a second insulation layer on the first etch stop layer, a first upper wiring line extending through the second insulation layer, the first etch stop layer, and the first dielectric barrier layer, and a first conductive via in the first insulation layer and electrically connecting the first lower wiring line and the first upper wiring line. An upper surface of the first conductive via protrudes above a lower surface of the first upper wiring line.
    Type: Application
    Filed: June 14, 2019
    Publication date: July 9, 2020
    Inventors: Soon Gyu HWANG, Kyoung Woo LEE, YoungWoo CHO, IL SUP KIM, Su Hyun BARK, Young-Ju PARK, Jong Min BAEK, Min HUH
  • Publication number: 20200211646
    Abstract: In some example embodiments, a program pulse is applied to a resistive memory cell and a plurality of post pulses are applied to the resistive memory cell at a time point after a relaxation time from a time point when application of the program pulse is finished, the plurality of post pulses having voltage levels that increase sequentially. Programming speed and/or performance of the resistive memory device may be enhanced by accelerating resistance drift of the resistive memory cell using the plurality of post pulses having the voltage levels that increase sequentially.
    Type: Application
    Filed: July 3, 2019
    Publication date: July 2, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yong-Sung CHO, Moo-Sung KIM, Seung-You BAEK, Jong-Min BAEK, Bong-Kil JUNG
  • Patent number: 10700164
    Abstract: Semiconductor devices may include a diffusion prevention insulation pattern, a plurality of conductive patterns, a barrier layer, and an insulating interlayer. The diffusion prevention insulation pattern may be formed on a substrate, and may include a plurality of protrusions protruding upwardly therefrom. Each of the conductive patterns may be formed on each of the protrusions of the diffusion prevention insulation pattern, and may have a sidewall inclined by an angle in a range of about 80 degrees to about 135 degrees to a top surface of the substrate. The barrier layer may cover a top surface and the sidewall of each if the conductive patterns. The insulating interlayer may be formed on the diffusion prevention insulation pattern and the barrier layer, and may have an air gap between neighboring ones of the conductive patterns.
    Type: Grant
    Filed: February 13, 2019
    Date of Patent: June 30, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jin-Nam Kim, Rak-Hwan Kim, Byung-Hee Kim, Jong-Min Baek, Sang-Hoon Ahn, Nae-In Lee, Jong-Jin Lee, Ho-Yun Jeon, Eun-Ji Jung
  • Patent number: 10684698
    Abstract: An input sensing unit includes a first metal pattern layer including a plurality of first conductive lines extending in a first direction. A first insulating layer is disposed on the first metal pattern layer. A second metal pattern layer is positioned above the first insulating layer and includes a plurality of second conductive lines extending in a second direction intersecting the first direction. A second insulating layer is disposed on the second metal pattern layer. A sensing electrode is disposed on the second insulating layer and is electrically connected to the second metal pattern layer through a contact hole defined in the second insulating layer. An anti-reflection pattern layer is disposed on the first and second metal pattern layers to overlap the first and second metal pattern layers along a direction orthogonal to an upper surface of the anti-reflection pattern layer.
    Type: Grant
    Filed: November 15, 2017
    Date of Patent: June 16, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Gyung Min Baek, Hyun Eok Shin, Ju Hyun Lee, Joon Yong Park, Sang Won Shin
  • Patent number: 10686986
    Abstract: An image display apparatus and a method of displaying an image are provided. The image display apparatus includes: a display; a graphics processing unit (GPU); and a processor configured to: determine a copy region of a planar-format image based on information regarding a current viewpoint, control the GPU to generate a sphere-format image by mapping an image corresponding to the copy region to a sphere and to generate an output image by rendering the sphere-format image, and control the display to display the output image.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: June 16, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-min Baek, Young-hyun Kim, Se-hyun Kim, Kwan-sik Yang, Jae-young You, Kil-soo Choi
  • Patent number: 10658231
    Abstract: A semiconductor device includes a first interlayer dielectric film on a substrate, first and second wires respectively extending in a first direction within the first interlayer dielectric film, the first and second wires being adjacent to each other in a second direction different from the first direction, a hard mask pattern on the first interlayer dielectric film, the hard mask pattern including an opening, and an air gap within the first interlayer dielectric film, the air gap including a first portion overlapping vertically with the opening and a second portion not overlapping with the opening in the first direction.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: May 19, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyu Hee Han, Jong Min Baek, Viet Ha Nguyen, Woo Kyung You, Sang Shin Jang, Byung Hee Kim
  • Patent number: 10632856
    Abstract: An integrated endplate for a battery pack includes an inner wall and an outer wall. The outer wall has a first side adjacent to the inner wall and a second side opposite the first side. The outer wall includes a connector interface protruding from the second side and defining at least one aperture therethrough. The integrated endplate further includes at least one electrical connector extending between the inner wall and the outer wall to the at least one aperture of the connector interface.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: April 28, 2020
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: John Sturza, Neil Robert Burrows, Sai K. Perumalla, Rohit Gunna, Hyung Min Baek
  • Patent number: 10629639
    Abstract: A display device includes: a thin film transistor to which signals are provided for displaying an image, the thin film transistor including a semiconductor layer, a data signal line and a gate signal line; and a first electrode with which the image is displayed, the first electrode connected to the thin film transistor. One signal line among the data signal line and the gate signal line in the thin film transistor includes a metal layer and an organic layer which is disposed on the metal layer, and the organic layer is an ion-doped photosensitive resin material.
    Type: Grant
    Filed: July 16, 2018
    Date of Patent: April 21, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Do Keun Song, Gyung Min Baek, Sang Won Shin
  • Publication number: 20200119310
    Abstract: A display device may include a display configured to emit light for displaying an image, a microlens array on the display and configured to collimate the image incident from the display so as to be delivered to the eyes of a user, the microlens array including a refractive index conversion layer in which a refractive index varies from region to region, and an optical path adjustment layer configured to collect light, emitted from the display and transmitted by the microlens array, and to space the display and the microlens array a preset distance apart from each other. Here, the refractive index conversion layer may include a polymer and liquid crystal molecules that interact with the polymer.
    Type: Application
    Filed: August 19, 2019
    Publication date: April 16, 2020
    Inventors: Su Jung HUH, Soo Min BAEK, Ji Won LEE, Ju Hwa HA